SIST EN 60115-1:2023

SLOVENSKI STANDARD
01-maj-2023
Fiksni upori za elektronsko opremo - 1. del: Splošna specifikacija (IEC 60115-
1:2020, spremenjen)
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115
-1:2020 (MOD)
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1:
Fachgrundspezifikation (IEC 60115-1:2020 (MOD)
Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification
générique (IEC 60115-1:2020 (MOD)
Ta slovenski standard je istoveten z: EN 60115-1:2023
ICS:
31.040.10 Fiksni upor Fixed resistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60115-1
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2023
ICS 31.040.10 Supersedes EN 60115-1:2011;
EN 60115-1:2011/A11:2015
English Version
Fixed resistors for use in electronic equipment - Part 1: Generic
specification
(IEC 60115-1:2020, modified)
Résistances fixes utilisées dans les équipements Festwiderstände zur Verwendung in elektronischen Geräten
électroniques - Partie 1: Spécification générique - Teil 1: Fachgrundspezifikation
(IEC 60115-1:2020, modifiée) (IEC 60115-1:2020, modifiziert)
This European Standard was approved by CENELEC on 2023-02-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60115-1:2023 E
Contents Page
1 Modification to the Introduction . 5
2 Modification to Clause 1 . 5
3 Modification to Clause 2 . 5
4 Modification to Clause 5 . 5
5 Modification to Clause 9 . 5
6 Modification to Annex B . 5
7 Modification to Annex C . 7
8 Modification to Annex Q . 9
9 Modification to Annex R . 9
10 Modification to Annex X . 10
11 Addition of Annex ZA . 11
12 Addition of a new Annex ZX. 14
13 Modification of the Bibliography . 18
European foreword
This document (EN 60115-1:2023) consists of the text of IEC 60115-1:2020 prepared by IEC/TC 40,
“Capacitors and resistors for electronic equipment”, together with the common modifications prepared by the
CLC TC/40XB, “Resistors”.
The following dates are fixed:
• latest date by which this document has to be (dop) 2024-02-13
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) 2026-02-13
conflicting with this document have to be withdrawn
This document supersedes EN 60115-1:2011 + EN 60115-1:2011/A11:2015.
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure, where the tests of prior Clause 4 are given in
Clauses 6 to 12 now, with an informative Annex ZX providing cross-references for references to the
prior revision of this standard;
b) the terms and definitions have been revised and amended, supplemented by a new section on resistor
technologies and a new section on product classification levels;
c) a new Subclause 4.7 on recommendations for permissible substitutions has been added;
d) the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have been
completely revised;
e) a new Subclause 5.3 on default tolerances for the most common test parameters has been added;
f) the generic method of measuring resistance, now Sublause 5.6, has been separated from the test for
compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
g) the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior test 4.8,
variation of resistance with temperature, where the special concessions for resistors below 10 Ω have
been waived;
h) the single-pulse high-voltage overload test of Subclause 8.2 (prior 4.27) has been completely revised;
i) the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and a
corrected table of severities provided;
j) the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and streamlined to
only offer the severity historically applied in subordinate specifications;
k) the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the assessment
of detail dimensions (all parts of prior 4.4) have been completely revised;
l) the tests for robustness of terminations (prior 4.16) have been revised and separated into tests for the
robustness of solderable terminations, Subclause 9.5, and tests for the robustness of threaded stud or
screw terminations, Subclause 9.6;
m) the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21) have been
revised to reflect the merged relevant test standard EN 60068-2-29;
n) the accelerated damp heat, steady-state test of Subclause 10.5 (prior 4.37) has been amended with an
option for a reduced number of bias voltages;
o) the corrosion test of Subclause 10.6 has been completely revised in order to employ the better suitable
test method of EN 60068-2-52 instead of the prior used EN 60068-2-11;
p) the whisker growth test of 10.7 has been revised to reflect the changes of the new revision of the test
methods of EN IEC 60068-2-82;
q) the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering heat of
Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary option for the
variety of lead-bearing and lead-free solder alloys and respective process conditions;
r) the solvent resistance test of 11.3 combines the prior tests 4.29, component solvent resistance, and
4.30, solvent resistance of marking, in one test;
s) the accidental overload test of Subclause 12.3 (prior 4.26) has been completely revised.
Preceding documents on the subject covered by this specification have been:
— EN 60115-1:2001 + EN 60115-1:2001/A1:2001 + EN 60115-1:2001/A11:2007
— EN 140000:1993-12
— CECC 40 000:1973-00, 1979-00.
Clauses, subclauses, annexes, notes, tables and figures which are additional to those in IEC 60115-1:2020 are
prefixed “Z”.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A complete
listing of these bodies can be found on the CENELEC website.
1 Modification to the Introduction
Add the following new paragraph after the existing first paragraph:
“The explanation given in this introduction uses IEC documents as examples. Anyhow, the same principles
apply in unison to respective documents with EN or EN IEC prefix.”
2 Modification to Clause 1
Replace the first paragraph with the following:
“This part of EN 60115 is a generic specification and is applicable to fixed resistors for use in electronic
equipment.”
3 Modification to Clause 2
3.1 Modify the normative reference to IECQ 03-1:2018 as follows:
IECQ 03-1:2020, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
procedure — Part 1: General Requirements for all IECQ Schemes
3.2 Add the following two entries:
IECQ 03-3:2018, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
Procedure – Part 3: IECQ Approved Component Products, Related Materials and Assemblies Scheme
IECQ 03-3-1:2018, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
Procedure – Part 3-1: IECQ Approved Component Products, Related Materials and Assemblies Scheme, IECQ
Approved Component – Technology Certification (IECQ AC-TC)
4 Modification to Clause 5
In 5.1, replace the 4th paragraph with the following:
“The performance requirements prescribed by any relevant specification are absolute limits. The policy on
uncertainty of measurements and inset limits, as given in IECQ 03-1:2020, Annex C, shall be applied.”
5 Modification to Clause 9
Replace the 1st paragraph in 9.2.2.1, as well as the 1st paragraph in 9.3.2.1, with the following:
“The limiting dimensions are generally prescribed as absolute limits. The policy on inset limits in accordance
with IECQ 03-1:2020, Annex C, shall be applied to the preparation of gauges or other representations of the
required acceptance windows.”
6 Modification to Annex B
Replace Annex B with the following:
“
Annex B
(normative)
Rules for the preparation of detail specifications for resistors and
capacitors for electronic equipment for use within the IECQ system
B.1 The drafting of a complete detail specification, in line with the CEN/CENELEC Internal Regulations, shall
begin only when all the following conditions have been met:
a) the generic specification has been approved;
b) the sectional specification, if appropriate, has been circulated for approval according to the relevant system
rules (e.g. FDIS, or unanimously approved CDV, at IEC);
c) the associated blank detail specification has been circulated for approval according to the relevant system
rules (e.g. FDIS, or unanimously approved CDV, at IEC);
B.2 Detail specifications shall use the standard or preferred values, ratings and characteristics, and severities
for environmental tests, etc. which are given in the appropriate generic or sectional specifications.
An exception to this rule may only be granted for a specified detail specification, if agreed by the technical
committee.
B.3 The detail specification should not be circulated for approval according to the relevant system rules (e.g.
FDIS, or unanimously approved CDV, at IEC) until the sectional and blank detail specifications have been
approved for publication.”
7 Modification to Annex C
Replace Annex C with the following:
“
Annex C
(informative)
Example of a certified test record
Component manufacturer Veriohm Ltd.
Place of manufacture Amper Lane 8, Voltville
Detail specification and issue EN 140401-808:2021
Fixed low power film surface mount (SMD) resistors,
Description of component
Rectangular
Current three months period 2021-01-01 – 2021-03-31
This Certified Test Record is a completed and accurate record of the tests carried out in accordance with the
specified procedures.
Manufacturer
Designated Management Representative (T. Rustworthy)
IECQ Certification Body
Supervising Inspector (S. Crutiny)
“
8 Modification to Annex Q
8.1 Modify the indication of Annex Q from informative to normative, as follows:
“Annex Q
(normative)
Quality assessment procedures”
8.2 In Q.1.4, replace the 1st paragraph as follows:
“Rework is the rectification of a processing error, prior to the release of the component, by means not differing
from those used in the current process, or by an explicitly permitted rework process.”
8.3 In Q.1.9, replace the 1st paragraph as follows:
“Repair is the making good of an approved component which has been damaged or has become defective after
its release, and is not permitted under the Rules of Procedure.”
8.4 In Q.1.11, replace the paragraph as follows:
“An organisation may be covered by one certification for more than one location (site) (see IECQ 03-1:2020,
Clause 5 and Annex D, and IECQ 03-3:2018, Clause 5).”
8.5 In Q.2.1, replace the 1st paragraph as follows:
“An IECQ Approved Component certification may be granted to a manufacturer meeting the requirements given
in IECQ 03-1:2020, 9.2 and in IECQ 03-3:2018, Clause 8.”
8.6 In Q.3.5, replace the paragraph as follows:
“QA shall be granted by the Certification Body (CB) when all requirements have been met (see IECQ 03-1:2020,
9.7).”
8.7 In Q.4.2, replace the 1st paragraph as follows:
“An IECQ Approved Component – Capability Certification may be granted to a manufacturer
meeting the requirements given in IECQ 03-1:2020, 9.2 and in IECQ 03-3:2018, D.8.”
8.8 In Q.4.9, replace the 1st paragraph as follows:
“Quality conformance inspections shall be executed according to the provisions of IECQ 03-3:2018, 8.13.3 and
to the respective descriptions of the CM.”
8.9 In Q.5.2, replace the 1st paragraph as follows:
“An IECQ AC-TC may be granted to a manufacturer meeting the requirements given in IECQ 03-1:2018, 9.2
and in IECQ 03-3:2018, Clause 8.”
9 Modification to Annex R
Modify the indication of Annex R from informative to normative, as follows:
“Annex R
(normative)
Failure rate level evaluation, determination and qualification”
In R.1.2, replace the 2nd dash item with the following:
“
— IECQ Qualification Approval (QA), according to IECQ 03-3:2018, Annex C”;
10 Modification to Annex X
Replace the contents of Annex X with the following:
“This annex, providing cross references for references to IEC 60115-1:2008, has been deleted from this
document. In lieu thereof, see Annex ZX, which is providing cross references for references to EN 60115-1:2011
and EN 60115-1:2011/A11:2015.”
11 Addition of Annex ZA
Add the following new Annex ZA:
“
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references, the
latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60027 series Letters symbols to be used in electrical - -
technology
IEC 60050 series International electrotechnical vocabulary - -
IEC 60062 - Marking codes for resistors and capacitors EN 60062 -
IEC 60063 - Preferred number series for resistors and EN 60063 -
capacitors
IEC 60068-1 2013 Environmental testing - Part 1: General and EN 60068-1 2014
guidance
IEC 60068-2-1 - Environmental testing - Part 2–1: Tests - Test EN 60068-2-1 -
A: Cold
IEC 60068-2-2 - Environmental testing - Part 2–2: Tests - Test EN 60068-2-2 -
B: Dry heat
IEC 60068-2-6 - Environmental testing - Part 2–6: Tests - Test EN 60068-2-6 -
Fc: Vibration (sinusoidal)
IEC 60068-2-13 - Environmental testing - Part 2–13: Tests - Test EN 60068-2-13 -
M: Low air pressure
IEC 60068-2-14 - Environmental testing - Part 2–14: Tests - Test EN 60068-2-14 -
N: Change of temperature
IEC 60068-2-20 2008 Environmental testing - Part 2–20: Tests - Test EN 60068-2-20 2008
T: Test methods for solderability and resistance
to soldering heat of devices with leads
IEC 60068-2-21 2006 Environmental testing - Part 2–21: Tests - Test EN 60068-2-21 2006
U: Robustness of terminations and integral
mounting devices
IEC 60068-2-27 2008 Environmental testing - Part 2–27: Tests - Test EN 60068-2-27 2009
Ea and guidance: Shock
IEC 60068-2-30 - Environmental testing - Part 2–30: Tests - Test EN 60068-2-30 -
Db: Damp heat, cyclic (12 h + 12 h cycle)
Publication Year Title EN/HD Year
IEC 60068-2-45 1980 Basic environmental testing procedures - Part EN 60068-2-45 1992
+ AMD 1 1993 2–45: Tests - Test XA and guidance: Immersion + A1 1993
in cleaning solvents
IEC 60068-2-47 - Environmental testing - Part 2–47: Test - EN 60068-2-47 -
Mounting of specimens for vibration, impact and
similar dynamic tests
IEC 60068-2-52 - Environmental testing - Part 2–52: Test – Test EN IEC 60068-2-52 -
Kb: Salt mist, cyclic (sodium chloride solution)
IEC 60068-2-58 - Environmental testing - Part 2–58: Tests - Test EN 60068-2-58 -
Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering
heat of surface mounting devices (SMD)
IEC 60068-2-67 - Environmental testing - Part 2–67: Tests - Test EN 60068-2-67 -
Cy: Damp heat, steady-state, accelerated test
primarily intended for components
IEC 60068-2-78 - Environmental testing - Part 2–78: Tests - Test EN 60068-2-78 -
Cab: Damp heat, steady-state
IEC 60068-2-82 2019 Environmental testing - Part 2–82: Tests - Test EN IEC 60068-2-82 2019
Xw1: Whisker test methods for components and
parts used in electronic assemblies
IEC 60195 2016 Method of measurement of current noise EN 60195 2016
generated in fixed resistors
IEC 60286 series Packaging of components for automatic EN 60286 series
handling
IEC 60294 - Measurement of the dimensions of a cylindrical EN 60294 -
component with axial terminations
IEC 60440 2012 Method of measurement of nonlinearity in EN 60440 2012
resistors
IEC 60617-DB - Graphical symbols for diagrams - -
IEC 60695-11-5 - Fire hazard testing - Part 11–5: Test flames - EN 60695-11-5 -
Needle-flame test method - Apparatus,
confirmatory test arrangement and guidance
IEC 61191 series Printed board assemblies EN IEC 61191 series
IEC 61193-2 - Quality assessment systems - Part 2: Selection EN 61193-2 -
and use of sampling plans for inspection of
electronic components and packages
IEC 61340-3-1 - Electrostatics - Part 3–1: Methods for simulation EN 61340-3-1 -
of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms
IEC 61760-1 - Surface mounting technology - Part 1: Standard EN IEC 61760-1 -
method for the specification of surface
mounting components (SMDs)
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of
surface mounting devices (SMD) - Application
guide
Publication Year Title EN/HD Year
IEC 62090 - Product package labels for electronic - -
components using bar code and two-
dimensional symbologies
IEC 62812 2019 Low resistance measurements - Methods and EN IEC 62812 2019
guidance
IEC 80000 series Quantities and units EN 80000 series
IECQ 03-1 2020 IEC Quality Assessment System for Electronic - -
Components (IECQ System) – Rules of
procedure – Part 1: General Requirements for
all IECQ Schemes
ISO 80000 series Quantities and units EN ISO 80000 series
IECQ 03-3 2018 IEC Quality Assessment System for Electronic - -
Components (IECQ System) – Rules of
Procedure – Part 3: IECQ Approved
Component Products, Related Materials and
Assemblies Scheme
IECQ 03-3-1 2018 IEC Quality Assessment System for Electronic - -
Components (IECQ System) – Rules of
Procedure – Part 3–1: IECQ Approved
Component Products, Related Materials and
Assemblies Scheme, IECQ Approved
Component – Technology Certification (IECQ
AC-TC)
“
12 Addition of a new Annex ZX
Add the following new Annex ZX:
“
Annex ZX
(informative)
Cross-references for references to the prior revision of this document
The revision of this generic specification has resulted in changes of the clause and annex numbering, the figure
numbering and the table numbering. The following Table ZX.1 provides cross-references for all references to
specific clauses or annexes of the prior revision of this generic specification.
Table ZX.1 — Cross-references for references to clauses
EN 60115-1:2011
EN 60115-1:2021
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
1 — The former Clause 1 is split into Clauses 1 and 2:
1.1 1 — Scope
1.2 2 — Normative references
2 — The former Clause 2 is split into Clauses 3 and 4.
2.1 4.1
2.2 3.1
2.3 4.2
4.4
2.4
4.5
2.5 4.3
2.6 4.8
2.7 4.9
2.8 4.10
Annex Q
4 — The former Clause 4 is split into Clauses 5 to 12.
4.1 5.1
4.2 5.2
4.3 5.4
4.4 — The former Clause 4.4 is split into 9.1 to 9.3:
4.4.1 9.1 — Visual examination;
4.4.2 9.2 — Dimensions (Gauging);
4.4.3 9.3 — Dimensions (Detail)
4.5 — The former Clause 4.5 is split into 5.6 and 6.1:
4.5.1 5.6 — general method of resistance measurement;
4.5.2 6.1 — test for resistance and tolerance.
4.6 12.1
4.7 12.2
EN 60115-1:2011
EN 60115-1:2021
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
The title is changed to: Temperature coefficient of
4.8 6.2
resistance
4.9 6.3 The title is changed to: Inductance
4.10 6.5
4.11 6.4
4.12 6.6
4.13 8.1 The title is changed to: Short-term overload
4.14 6.7
4.15 9.4
4.16 — The former Clause 4.16 is split into 9.5 and 9.6 for:
4.16.2 9.5.4.2 — tensile test, e.g. for wire terminations;
4.16.3 9.5.4.3 — bending test, e.g. for wire terminations;
4.16.4 9.5.4.4 — torsion test, e.g. for wire terminations;
4.16.5 9.6.4 — resistors with threaded stud or screw terminations.
4.17 11.1 Solderability test for:
4.17.2 a) 11.1.4.4 — resistors for through-hole assembly;
4.17.2 b) 11.1.4.5 — resistors not for assembly on circuit boards;
4.17.2 c) 11.1.4.3 — SMD resistors.
4.18 11.2 Resistance to soldering heat test for:
4.18.2 a) 11.2.4.4 — resistors for through-hole assembly;
4.18.2 b) 11.2.4.5 — resistors not for assembly on circuit boards;
4.18.2 c) 11.2.4.3 — SMD resistors.
4.19 10.1
4.20 9.9
4.21 9.10
4.22 9.11
4.23 10.3
4.24 10.4
4.25 — Endurance tests are given in Clause 7:
4.25.1 7.1 — Endurance at the rated temperature 70 °C;
4.25.2 7.2 — Endurance at room temperature;
4.25.3 7.3 — Endurance at a maximum temperature (e.g. UCT).
4.26 12.3
4.27 8.2
4.28 8.3
4.29
11.3 The solvent resistance tests are merged into 11.3.
4.30
4.31 5.5.2
4.32 9.7
4.33 9.8
EN 60115-1:2011
EN 60115-1:2021
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
4.34 10.6 The corrosion test employs a different test method.
4.35 12.4
4.36 10.2
4.37 10.5
4.38 8.5
This legacy test is presented only with a traditionally
4.39 8.4
applied severity.
4.40 10.7
4.41 10.8
— — EN 60115-1:2011 does not contain Annexes A, D, E
Annex B Annex B
Annex C — The content of this Annex is merged into 8.3.
Annex F Annex A
Annex G — The overview on tests is given in the table of contents.
Annex Q Annex Q
Annex ZA Annex C
Annex ZR Annex R
Annex ZX Annex ZX
Table ZX.2 provides cross-references for all references to specific figures of the prior revision of this generic
specification.
Table ZX.2 — Cross-references for references to figures
EN 60115-1:2011
EN 60115-1:2020
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
Figure 1 Figure 25 The designation is changed to: Parallel clamp fixture
Figure 2 Figure 26 The designation is changed to: V-clamp fixture
Figure 3 Figure 9
Figure 4 Figure 10
Figure 5 Figure 19
Figure 6 Figure 12
Figure 7 Figure 13
Figure 8 Figure 14
Figure 9 Figure 15
Figure 10 Figure 27
Figure 11 Figure 17
Figure 12 Figure 18
Figure C.1
— The subject is covered in 8.3.4.1.
Figure C.2
Table ZX.3 provides cross-references for all references to specific tables of the prior revision of this generic
specification.
Table ZX.3 — Cross reference for references to tables
EN 60115-1:2011
EN 60115-1:2020
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
Table 1 Table 2
Table 2 Table 9
Table 3
— The subject is covered in 6.2.5.
Table 4
Table 5 Table 13
Table 6 Table 14
Table 7 Table 20
Table 8 Table 11
Table 9 Table 12
Table 10 — The subject is covered in 8.4.4.
Table ZR.1 Table R.1
Table ZR.2 Table R.2
Table ZR.3 Table R.3
Table ZR.4 Table R.4
“
13 Modification of the Bibliography
Replace the Bibliography as follows:
EN 60060-1, High-voltage test techniques - Part 1: General definitions and test requirements
EN 60068-2-11, Environmental testing - Part 2: Tests - Test Ka: Salt mist
1)
EN 60068-2-29 , Environmental testing. Part 2: Tests. Test Eb and guidance: Bump (IEC 60068-2-29)
EN 60068-2-69, Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic
components and printed boards by the wetting balance (force measurement) method
EN IEC 60068-3-5, Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation
of the performance of temperature chambers
EN 60068-3-13, Environmental testing - Part 3-13: Supporting documentation and guidance on Test T -
Soldering
EN IEC 60721-3-1, Classification of environmental conditions - Part 3-1: Classification of groups of
environmental parameters and their severities - Storage
EN IEC 60721-3-2, Classification of environmental conditions - Part 3-2: Classification of groups of
environmental parameters and their severities - Transportation and Handling
EN IEC 60749-26, Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic
discharge (ESD) sensitivity testing - Human body model (HBM)
EN 61000-4-5:2014, Electromagnetic compatibility (EMC) - Part 4-5: Testing and measurement techniques -
Surge immunity test
EN IEC 61190-1-3, Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
EN 61249-2-22, Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base
materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of
defined flammability (vertical burning test), copper-clad
EN 61249-2-35, Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base
materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability
(vertical burning test), copper-clad for lead-free assembly
IEC/TR 60068-3-12, Environmental testing - Part 3-12: Supporting documentation and guidance - Method to
evaluate a possible lead-free solder reflow temperature profile
2)
IEC 60410 , Sampling plans and procedures for inspection by attributes
IEC CA 01, IEC Conformity Assessment Systems – Basic Rules

1)
EN 60068-2-29:1993 has been withdrawn as its contents has been merged into EN 60068-2-27:2009.
2)
IEC 60410:1973 has been withdrawn in 2015.
3)
IEC QC 001002-3 , IEC Quality Assessment System for Electronic Components (IECQ) - Rules of Procedure
- Part 3: Approval procedures
4)
IEC Q 01 , IEC Quality Assessment System for Electronic Components (IECQ System) – Basic Rules
IECQ 01-S, IEC Quality Assessment System for Electronic Components (IECQ System) – IECQ Supplement
to Harmonized Basic Rules IEC CA 01
EN ISO 9001, Quality management systems - Requirements (ISO 9001:2015)
ISO 3, Preferred numbers — Series of preferred numbers
ISO 17, Guide to the use of preferred numbers and of series of preferred numbers
ISO 497, Guide to the choice of series of preferred numbers and of series containing more rounded values of
preferred numbers
5)
ISO 1000 , SI units and recommendations for the use of their multiples and of certain other units
ISO 2533, Standard Atmosphere
AEC-Q100, Failure mechanism based stress test qualification for integrated circuits
AEC-Q100-002, Human body model (HBM) electrostatic discharge (ESD) test
AEC-Q101, Failure mechanism based stress test qualification for discrete semiconductors in automotive
applications
AEC-Q101-001, Electrostatic discharge test – Human body model
AEC-Q200, Stress test qualification for passive components
AEC-Q200-002, Human body model electrostatic discharge test
ASTM B809, Standard test method for porosity in metallic coatings by humid sulfur vapor (“Flowers-of-Sulfur”)
(Revision 1995, reapproved 2003, 2008, 2013, 2018)
6)
CECC 00 114 (all parts) , Rule of procedure: Quality assessment procedures
CECC 240 001, Technology Approval Schedule: Fixed low power film resistors (leaded / unleaded)
7)
EN 100114 , (all parts) Rule of procedure: Quality assessment procedures

3)
IEC QC 001002-3:2005 has been succeeded in 2010 by the IECQ 03-1 rules of procedure.
4)
IECQ 01:2014 has been withdrawn in 2017, and is succeeded by IEC CA 01, with the supplement IECQ 01-S
for application in the IEC Quality Assessment System for Electronic Components (IECQ).
5)
ISO 1000:1992 has been succeeded in 2009 by the ISO 80000 and IEC 80000 series of standards.
6),
The CECC 00 114 rules of procedure have been succeeded by the series of EN 100114 documents.
7)
The EN 100 114 rules of procedure have been succeeded by the IEC QC 001002 series of documents.
IPC-A-610, Acceptability of electronic assemblies
ITU-T K.21, Resistibility of telecommunication equipment installed in customer premises to overvoltages and
overcurrents
ITU-T K.44, Resistibility tests for telecommunication equipment exposed to overvoltages and overcurrents –
Basic recommendation
JESD22-A114, Electrostatic discharge (ESD) sensitivity testing human body model (HBM)
MIL-HDBK-217F (1991), Military Handbook – Reliability prediction of electronic equipment, with Notice 2
(1995)
MIL-STD-883, Test method standard – Microcircuits, – Method 3015, Electrostatic discharge sensitivity
classification
IEC 60115-1 ®
Edition 5.0 2020-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fixed resistors for use in electronic equipment –

Part 1: Generic specification
Résistances fixes utilisées dans les équipements électroniques –

Partie 1: Spécification générique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.10 ISBN 978-2-8322-7904-5

– 2 – IEC 60115-1:2020 © IEC 2020
CONTENTS
FOREWORD . 6
INTRODUCTION . 9
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product technologies and product classifications . 13
3.1 Terms and definitions . 13
3.2 Product technologies . 20
3.3 Resistor encapsulations . 23
3.4 Product classification . 24
4 General requirements . 25
4.1 Units and symbols. 25
4.2 Preferred values . 25
4.3 Coding . 26
4.4 Marking of the resistors. 26
4.5 Marking of the packaging . 26
4.6 Ordering designation . 27
4.7 Permissible substitutions . 27
4.8 Packaging . 28
4.9 Storage . 29
4.10 Transportation . 29
5 General provisions for measurements and test methods . 30
5.1 General . 30
5.2 Standard atmospheric conditions . 30
5.3 Tolerances on test severity parameters . 32
5.4 Drying . 33
5.5 Mounting of specimens . 33
5.6 Measurement of resistance . 35
6 Electrical measurements and tests . 37
6.1 Resistance . 37
6.2 Temperature coefficient of resistance . 39
6.3 Inductance . 42
6.4 Voltage coefficient of resistance . 44
6.5 Non-linearity . 45
6.6 Current noise . 46
6.7 Temperature rise . 47
7 Endurance tests . 48
7.1 Endurance at the rated temperature 70 °C . 48
7.2 Endurance at room temperature . 50
7.3 Endurance at a maximum temperature . 55
8 Electrical overload tests. 59
8.1 Short-term overload . 59
8.2 Single-pulse high-voltage overload test . 61
8.3 Periodic-pulse high-voltage overload test . 66
8.4 Periodic-pulse overload test . 68
8.5 Electrostatic discharge . 70

IEC 60115-1:2020 © IEC 2020 – 3 –
9 Mechanical measurements and tests . 71
9.1 Visual examination . 71
9.2 Gauging of dimensions . 72
9.3 Detail dimensions . 73
9.4 Robustness of the resistor body . 74
9.5 Robustness of terminations . 75
9.6 Robustness of threaded stud or screw terminations . 78
9.7 Shear test . 79
9.8 Substrate bending test . 81
9.9 Bump . 83
9.10 Shock . 84
9.11 Vibration . 85
10 Environmental and climatic tests . 87
10.1 Rapid change of temperature . 87
10.2 Operation at low temperature . 88
10.3 Climatic sequence. 89
10.4 Damp heat, steady state . 92
10.5 Damp heat, steady state, accelerated . 95
10.6 Corrosion . 97
10.7 Whisker growth test . 99
10.8 Hydrogen sulphide test . 100
11 Tests related to component assembly . 101
11.1 Solderability . 101
11.2 Resistance to soldering heat . 105
11.3 Solvent resistance . 107
12 Tests related to safety . 109
12.1 Insulation resistance . 109
12.2 Voltage proof . 114
12.3 Accidental overload test . 115
12.4 Flammability . 120
13 Quality assessment procedures . 121
Annex A (normative) Symbols and abbreviated terms . 123
A.1 Symbols . 123
A.2 Abbreviated terms . 126
Annex B (normative) Rules for the preparation of detail specifications for resistors
and capacitors for electronic equipment for use within the IECQ system . 129
Annex C (informative) Example of a cer
...