SIST EN 60352-8:2011

SLOVENSKI STANDARD
SIST EN 60352-8:2011
01-maj-2011
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Solderless connections - Part 8: Compression mount connections - General
requirements, test methods and practical guidance (IEC 60352-8:2011)
Lötfreie Verbindungen - Teil 8: Druckmontage-Verbindungen - Allgemeine
Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 60352-8:2011)
Connexions sans soudure - Partie 8: Connexions par compression - Exigences
générales, méthodes d'essai et guide pratique (CEI 60352-8:2011)
Ta slovenski standard je istoveten z: EN 60352-8:2011
ICS:
29.120.20 Spojni elementi Connecting devices
SIST EN 60352-8:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60352-8:2011

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SIST EN 60352-8:2011

EUROPEAN STANDARD
EN 60352-8

NORME EUROPÉENNE
March 2011
EUROPÄISCHE NORM

ICS 13.220.10


English version


Solderless connections -
Part 8: Compression mount connections -
General requirements, test methods and practical guidance
(IEC 60352-8:2011)


Connexions sans soudure -  Lötfreie Verbindungen -
Partie 8: Connexions par compression - Teil 8: Druckmontage-Verbindungen -
Exigences générales, méthodes d'essai et Allgemeine Anforderungen, Prüfverfahren
guide pratique und Anwendungshinweise
(CEI 60352-8:2011) (IEC 60352-8:2011)




This European Standard was approved by CENELEC on 2011-03-17. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60352-8:2011 E

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SIST EN 60352-8:2011
EN 60352-8:2011 - 2 -
Foreword
The text of document 48B/2223/FDIS, future edition 1 of IEC 60352-8, prepared by SC 48B, Connectors,
of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60352-8 on
2011-03-17.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-12-17
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2014-03-17
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60352-8:2011 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 60352-8:2011
- 3 - EN 60352-8:2011

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60050-581 2008 International Electrotechnical Vocabulary - - -
Part 581: Electromechanical components
for electronic equipment



IEC 60068-1 1988 Environmental testing - EN 60068-1 1994
+ A1 1992 Part 1: General and guidance


IEC 60512 Series Connectors for electronic equipment - EN 60512 Series
Tests and measurements


IEC 60512-1 - Connectors for electronic equipment - EN 60512-1 -
Tests and measurements -
Part 1: General


IEC 60512-1-100 - Connectors for electronic equipment - EN 60512-1-100 -
Tests and measurements -
Part 1-100: General - Applicable publications


IEC 61249-2-7 2002 Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad

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SIST EN 60352-8:2011

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SIST EN 60352-8:2011

IEC 60352-8
®

Edition 1.0 2011-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Solderless connections –
Part 8: Compression mount connections – General requirements, test methods
and practical guidance

Connexions sans soudure –
Partie 8: Connexions par compression – Exigences générales, méthodes d’essai
et guide pratique


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX S
ICS 13.220.10 ISBN 978-2-88912-363-6

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 60352-8:2011
– 2 – 60352-8  IEC:2011
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope and object . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Requirements . 8
4.1 General . 8
4.2 Mounting tools . 8
4.3 Compression mount contact . 8
4.3.1 Materials . 8
4.3.2 Design features . 8
4.3.3 Surface finishes . 8
4.4 Connector body . 9
4.4.1 Materials . 9
4.4.2 Design features . 9
4.5 Printed wiring board . 9
4.5.1 Materials . 9
4.5.2 Design features . 9
4.5.3 Surface finishes . 9
4.6 Stiffener . 9
5 Tests . 9
5.1 General . 9
5.1.1 Standard conditions for testing . 9
5.1.2 Mounting of the specimen . 10
5.2 Test and measuring methods . 10
5.2.1 General examination. 10
5.2.2 Mechanical tests . 10
5.2.3 Electrical tests . 11
5.2.4 Climatic tests . 12
5.3 Test schedule . 13
5.3.1 General . 13
5.3.2 Basic test schedule . 14
5.3.3 Full test schedule . 14
6 Practical guidance . 17
6.1 Advantages for compression mount connection . 17
6.2 Current-carrying capacity . 18
6.3 Compression mount contact . 18
6.4 Connector housing and printed wiring board . 18
6.4.1 General . 18
6.4.2 Connector housing . 18
6.4.3 Printed wiring board . 18
Bibliography . 20

Figure 1 – Wiring arrangement for contact resistance test . 12
Figure 2 – An example of compression mount connection within a connector . 17

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SIST EN 60352-8:2011
60352-8  IEC:2011 – 3 –

Table 1 – Vibration, preferred test severities . 11
Table 2 – Group P – basic test . 14
Table 3 – Group A – corrosion test . 15
Table 4 – Group B – mechanical test . 15
Table 5 – Group C – climatic test . 16
Table 6 – Group D – current carrying capacity test . 16

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SIST EN 60352-8:2011
– 4 – 60352-8  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SOLDERLESS CONNECTIONS –

Part 8: Compression mount connections –
General requirements, test methods and practical guidance


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60352-8 has been prepared by subcommittee 48B: Connectors, of
IEC technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48B/2223/FDIS 48B/2229/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60352 series, published under the general title Solderless
connections, can be found on the IEC website.

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SIST EN 60352-8:2011
60352-8  IEC:2011 – 5 –
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

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SIST EN 60352-8:2011
– 6 – 60352-8  IEC:2011
INTRODUCTION
This part of IEC 60352 includes requirements, tests and practical guidance information.
Two test schedules are provided:
A basic test schedule applies to compression mount connections which conform to all of the
requirements given in Clause 4.
A full test schedule applies to compression mount connections which are part of a new
component and have already passed the basic test schedule or to connections of the same kind
which do not fully comply with the requirements of Clause 4.
Requirements given in Clause 4 are derived from experience with successful applications of
such compression mount connections.
IEC Guide 109 advocates the need to minimize the impact of a product on the natural
environment throughout the product life cycle.
It is understood that some of the materials permitted in this standard may have a negative
environmental impact.
As technological advances lead to acceptable alternatives for these materials, they will be
eliminated from the standard.

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SIST EN 60352-8:2011
60352-8  IEC:2011 – 7 –
SOLDERLESS CONNECTIONS –

Part 8: Compression mount connections –
General requirements, test methods and practical guidance



1 Scope and object
This part of IEC 60352 is applicable to compression mount connections with metallic spring
contacts for use in telecommunication equipments and in other electronic devices employing
similar techniques.
Information on materials and data from industrial experience are included in addition to the test
procedures to provide electrically stable connections under prescribed environmental
conditions.
The object of this part of IEC 60352 is to determine the suitability of compression mount
connections under specified electrical, mechanical and atmospheric conditions and to provide a
means of comparing test results when the tools used to make the connectors are of different
designs or manufacture.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of the
referenced document (including any amendments) applies.
IEC 60050(581):2008, International Electrotechnical Vocabulary (IEV) – Part 581:
Electromechanical components for electronic equipment
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992)
IEC 60512 (all parts), Connectors for electric equipment – Tests and measurements
IEC 60512-1, Connectors for electronic equipment – Tests and measurements – Part 1: General
IEC 60512-1-100, Connectors for electric equipment – Tests and measurements – Part 1-100:
General – Applicable publications
IEC 61249-2-7:2002, Materials for printed boards and other interconnecting structures –
Part 2-7: Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet
of defined flammability (vertical burning test), copper-clad
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050(581) and
IEC 60512-1 as well as the following (additional) terms and definitions apply.
3.1
compression mount connection
solderless connection between a compression mount contact and a contact pad which is
established by a continuous compression force

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SIST EN 60352-8:2011
– 8 – 60352-8  IEC:2011
3.2
compression mount contact
conductive element in a compression mount connector which makes contact with its
corresponding contact pad on a printed wiring board to provide an electrical path
3.3
contact pad (land)
conductive element on a printed wiring board which makes contact with its corresponding
compression mount contact of a connector to provide an electrical path
NOTE Usually the contact area on devices such as on semiconductors is called “land”.
3.4
stiffener
component used to provide resistance against warpage of a printed wiring board
3.5
locating pin
guiding element equipped w
...