SIST EN IEC 62239-1:2019

SLOVENSKI STANDARD
01-februar-2019
8SUDYOMDQMHSURFHVRYYDYLRQLNL1DþUWXSUDYOMDQMDGHO3ULSUDYDLQY]GUåHYDQMH
QDþUWDXSUDYOMDQMDHOHNWURQVNLKNRPSRQHQW
Process management for avionics - Management plan - Part 1: Preparation and
maintenance of an electronic components management plan
Luftfahrtelektronik-Prozessmanagement -Managementplan - Teil 1: Erstellung und
Überarbeitung eines Managementplanes für elektronische Bauelemente
Gestion des processus pour l'avionique - Plan de gestion - Partie 1: Préparation et
maintenance d'un plan de gestion des composants électroniques
Ta slovenski standard je istoveten z: EN IEC 62239-1:2018
ICS:
03.100.50 Proizvodnja. Vodenje Production. Production
proizvodnje management
31.020 Elektronske komponente na Electronic components in
splošno general
49.060 /HWDOVNDLQYHVROMVND Aerospace electric
HOHNWULþQDRSUHPDLQVLVWHPL equipment and systems
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62239-1

NORME EUROPÉENNE
EUROPÄISCHE NORM
December 2018
ICS 03.100.50; 31.020; 49.060
English Version
Process management for avionics - Management plan - Part 1:
Preparation and maintenance of an electronic components
management plan
(IEC 62239-1:2018)
Gestion des processus pour l'avionique - Plan de gestion - Luftfahrtelektronik-Prozessmanagement - Managementplan
Partie 1: Préparation et maintenance d'un plan de gestion - Teil 1: Erarbeitung und Instandhaltung eines
des composants électroniques Managementplanes für elektronische Bauelemente
(IEC 62239-1:2018) (IEC 62239-1:2018)
This European Standard was approved by CENELEC on 2018-10-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62239-1:2018 E

European foreword
The text of document 107/320/CDV, future edition 1 of IEC 62239-1, prepared by IEC/TC 107
"Process management for avionics" was submitted to the IEC-CENELEC parallel vote and approved
by CENELEC as EN IEC 62239-1:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-07-29
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-10-29
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62239-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC 60695-11-5 NOTE Harmonized as EN 60695-11-5
IEC 61193-2 NOTE Harmonized as EN 61193-2
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1
IEC/TR 61340-5-2 NOTE Harmonized as CLC/TR 61340-5-2
IEC 61760-4 NOTE Harmonized as EN 61760-4
IEC 61967 (series) NOTE Harmonized as EN 61967 (series)
IEC 61967-1 NOTE Harmonized as EN 61967-1
IEC 62435-1 NOTE Harmonized as EN 62435-1
IEC 62132 (series) NOTE Harmonized as EN 62132 (series)
IEC 62402 NOTE Harmonized as EN 62402
IEC 62435-1 NOTE Harmonized as EN 62435-1
ISO 9000 NOTE Harmonized as EN ISO 9000
ISO 9001 NOTE Harmonized as EN ISO 9001
ISO 9004 NOTE Harmonized as EN ISO 9004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 62396 series Process management for avionics - Atmospheric - -
radiation effects
IEC 62396-1 2016 Process management for avionics - Atmospheric - -
radiation effects - Part 1: Accommodation of
atmospheric radiation effects via single event effects
within avionics electronic equipment
IEC/TS 62647-1 -  Process management for avionics - Aerospace and - -
defence electronic systems containing lead-free
solder - Part 1: Preparation for a lead-free control plan
GEIA-STD-0005-1 - Performance Standard for Aerospace and High - -
Performance Electronic Systems Containing Lead-
Free Solder
IPC/JEDEC J- - Moisture/Reflow Sensitivity Classification for - -
STD-20 Nonhermetic Solid State Surface Mount Devices

IEC 62239-1 ®
Edition 1.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Management plan –

Part 1: Preparation and maintenance of an electronic components management

plan
Gestion des processus pour l'avionique – Plan de gestion –

Partie 1: Préparation et maintenance d'un plan de gestion des composants

électroniques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-6033-3

– 2 – IEC 62239-1:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 12
4 Technical requirements . 14
4.1 General . 14
4.2 Component selection . 14
4.2.1 General. 14
4.2.2 Application conditions for use . 15
4.2.3 Availability and durability . 15
4.2.4 Additional performance . 15
4.2.5 Component identification . 15
4.3 Component application . 16
4.3.1 General. 16
4.3.2 Electromagnetic compatibility (EMC) . 16
4.3.3 Derating and stress analysis . 16
4.3.4 Thermal analysis . 18
4.3.5 Mechanical analysis . 18
4.3.6 Testing, testability, and maintainability . 19
4.3.7 Avionics radiation environment . 19
4.3.8 Management of lead-free termination finish and soldering . 19
4.3.9 Counterfeited, fraudulent and recycled component avoidance . 20
4.3.10 Moisture and corrosion . 20
4.3.11 Additional customer related application requirements . 20
4.4 Component qualification . 20
4.4.1 General. 20
4.4.2 Minimum component qualification requirements . 21
4.4.3 Original component manufacturer quality management . 21
4.4.4 Original component manufacturer process management approval . 21
4.4.5 Demonstration of component qualification . 22
4.4.6 Qualification of components from a supplier that is not qualified . 23
4.4.7 Distributor process management approval . 24
4.4.8 Subcontractor assembly facility quality and process management
approval . 24
4.5 Continuous component quality assurance . 25
4.5.1 General quality assurance requirements . 25
4.5.2 Ongoing component quality assurance . 25
4.5.3 Plan owner in-house continuous monitoring . 25
4.5.4 Component design and manufacturing process change monitoring . 26
4.6 Component dependability . 26
4.6.1 General. 26
4.6.2 Component availability and associated risk assessment . 26
4.6.3 Component obsolescence . 27
4.6.4 Proactive measures . 27

IEC 62239-1:2018 © IEC 2018 – 3 –
4.6.5 Component obsolescence awareness . 27
4.6.6 Reporting . 27
4.6.7 Semiconductor reliability, wear out and lifetime . 28
4.6.8 Reliability assessment . 28
4.7 Component compatibility with the equipment manufacturing process . 28
4.8 Component data . 29
4.8.1 General. 29
4.8.2 Minimum component data requirements . 30
4.9 Configuration control . 30
4.9.1 General. 30
4.9.2 Alternative components. 30
4.9.3 Alternative sources . 30
4.9.4 Equipment change documentation . 31
4.9.5 Customer notifications and approvals . 31
4.9.6 Focal organization . 31
5 Plan administration requirements . 31
5.1 Plan organization . 31
5.2 Plan terms and definitions . 31
5.3 Plan focal point . 31
5.3.1 Primary interface . 31
5.3.2 Plan focal point responsibilities . 32
5.4 Plan references. 32
5.5 Plan applicability . 32
5.6 Plan implementation . 32
5.6.1 ECMP compliance . 32
5.6.2 Plan objectives . 32
5.6.3 Plan owner's subcontracted activities . 33
5.7 Plan acceptance . 33
5.8 Plan maintenance . 33
Annex A (informative) Requirement matrix for IEC 62239-1 . 34
Annex B (informative) Typical qualification requirements and typical component

minimum qualification requirements . 50
Annex C (informative) IEC 62239-1 cross-references to SAE EIA-STD-4899 for
guidance . 53
Annex D (informative) Guidelines for environmental protection techniques and for
comparison of components specifications . 56
Bibliography . 70

Figure 1 – Suspect components perimeter . 20

Table A.1 – Requirements matrix . 34
Table B.1 – Typical qualification requirements and typical component minimum
qualification requirements . 50
Table C.1 – Cross-reference overview between IEC 62239-1 and SAE EIA-STD-4899,
for guidance . 53
Table D.1 – Environmental protection techniques to be considered during the avionics
design process . 56
Table D.2 – Guidelines for the comparison of internationally available component
a
specifications – Microcircuits . 61

– 4 – IEC 62239-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of
an electronic components management plan

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62239-1 has been prepared by IEC technical committee 107:
Process management for avionics.
IEC 62239-1 cancels and replaces IEC TS 62239-1 published in 2015.
This first edition cancels and replaces the first edition of IEC TS 62239-1 published in2015.
This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR
62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA
STD 0008;
IEC 62239-1:2018 © IEC 2018 – 5 –
b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference
table to SAE EIASTD4899 rev C clauses/subclauses for guidance purposes only;
c) added the analysis of component technical erratum in 4.8.2;
d) updated Bibliography and reference documents.
The text of this international standard is based on the following documents:
CDV Report on voting
107/320/CDV 107/333/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62239 series under the general title Process management for
avionics – Management plan, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 62239-1:2018 © IEC 2018
INTRODUCTION
This document provides the structure for avionics equipment manufacturers, subcontractors,
maintenance facilities, and other aerospace component users to develop their own electronic
component management plan (ECMP), hereinafter also referred to as ‘plan’. This document
states objectives to be accomplished. The plan does not describe specific requirements and
those who prepare plans in compliance with this document will document processes that are
the most effective and efficient for them in accomplishing the objectives of this document. In
order to allow flexibility in implementing and updating the documented processes, plan owners
are encouraged to refer to their own internal process documents instead of including detailed
process documentation within their plans.
NOTE The equipment manufacturer, often called in the industry the original equipment manufacturer (OEM) is in
general considered as the plan owner.
This component management document is intended for aerospace users of electronic
components. This document is not intended for use by the manufacturers of electronic
components. Components selected and managed according to the requirements of a plan
compliant with this document may be approved by the concerned parties for the proposed
application, and for other applications with equal or less severe requirements.
Organizations that prepare such plans may prepare a single plan and use it for all relevant
products supplied by the organization or may prepare a separate plan for each relevant
product or customer.
IEC 62239-1:2018 © IEC 2018 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of
an electronic components management plan

1 Scope
This part of IEC 62239 defines the requirements for developing an electronic components
management plan (ECMP) to guarantee to customers that all of the electronic components in
the equipment of the plan owner are selected and applied in controlled processes compatible
with the end application and that the technical requirements detailed in Clause 4 are
accomplished.
In general, the plan owner of a complete electronic components management plan (ECMP) is
the avionics original equipment manufacturer (OEM).
NOTE SAE EIA-STD-4899 can be used to comply with the requirements of IEC 62239-1 where applicable (see
Annex C), to enable the plan owner to harmonise its plan for both documents.
This document provides an aid in the aerospace certification process.
Although developed for the avionics industry, this process can be applied by other industrial
sectors.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62396 (all parts), Process management for avionics – Atmospheric radiation effects
IEC 62396-1:2016, Process management for avionics – Atmospheric radiation effects –
Part 1: Accommodation of atmospheric radiation effects via single event effects within
avionics electronic equipment
IEC TS 62647-1, Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic
Systems Containing Lead-Free Solder
IPC/JEDEC J-STD-20, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices
– 8 – IEC 62239-1:2018 © IEC 2018
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms, definitions and abbreviated terms
apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
NOTE In their plan, plan owners can use alternative definitions consistent with convention in their company.
3.1 Terms and definitions
3.1.1
environment
applicable environmental conditions (as described in the equipment specification) that the
equipment is able to withstand without loss or degradation in equipment performance
throughout its manufacturing cycle and maintenance life (the length of which is defined by the
plan owner in conjunction with customers)
3.1.2
purchased
bought outside the plan owner's organization, from an independent supplier
Note 1 to entry: This indicates that the plan owner does not manufacture this in-house.
3.1.3
capable
capacity of a component to be used successfully in the intended application
3.1.4
certified
assessed to and compliant with an applicable certification body
3.1.5
characterization
process of testing a sample of components to determine the key electrical parameter values
that can be expected of all produced components of the type tested
3.1.6
component application
domain of use where the component meets the design requirements
3.1.7
component manufacturer
organization responsible for the component specification and its production
3.1.8
component obsolescence
absence of availability of a component which is not procurable due to the manufacturer(s)
ceasing production
Note 1 to entry: Component obsolescence management is considered an element of component dependability.

IEC 62239-1:2018 © IEC 2018 – 9 –
3.1.9
component qualification
process used to demonstrate that the component is capable of meeting its specification for all
the required conditions and environments
3.1.10
component quality assurance
activities and processes to provide adequate confidence that each individual component
meets the performance and environmental requirements
3.1.11
component selection
process of choosing a specific component for a specific application
3.1.12
component standardization
process of developing and agreeing by consensus on uniform engineering criteria for products
and methods for achieving compatibility, interoperability, interchangeability, or commonality of
material
Note 1 to entry: Standardization is used to reduce proliferation of components into inventory.
3.1.13
counterfeit, verb
action of simulating, reproducing or modifying a material good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to wilful trade mark infringement.
[SOURCE: IEC TS 62668-1:2016, 3.1.4]
3.1.14
counterfeited component
material good imitating or copying an authentic material good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty
etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use etc.
[SOURCE: IEC TS 62668-1:2016, 3.1.5]
3.1.15
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes, but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
(1) a stolen component;
(2) a component scrapped by the original component manufacturer (OCM) or by any user;
(3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled component
resold as new component (see Figure 1), where typically there is evidence of prior use and rework (e.g.
solder, re-plating or lead re-attachment activity) on the package terminations;
(4) a counterfeit component, copy, imitation, full or partial substitute of brands;

– 10 – IEC 62239-1:2018 © IEC 2018
(5) fraudulent designs, models, patents, software or copyright sold as being new and authentic. For example: a
component whose production and distribution are not controlled by the original manufacturer;
(6) unlicensed copies of a design;
(7) a disguised component (remarking of original manufacturer name, reference date/code or other identifiers
etc.), which may be a counterfeit component; see Figure 1;
(8) component without an internal silicon die or with substituted silicon die which is not the original
manufacturer’s silicon die.
[SOURCE: IEC TS 62668-1:2016, 3.1.10]
3.1.16
dependability
capability of a product enabling it to achieve the specified functional performance at the
appropriate time and for the planned duration, without damage to itself or its environment
Note 1 to entry: Dependability is generally characterised by the following four parameters: reliability,
maintainability, availability, safety.
3.1.17
franchised distributor or agent
individual or corporate organization that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and who agrees under contract to
distribute products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be dispatched either direct from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
[SOURCE: IEC TS 62668-1:2016, 3.1.9]
3.1.18
electronic components management plan
ECMP
plan owner's document that defines the processes and practices for applying components to
an equipment or range of equipment and which generally addresses all relevant aspects of
controlling components during system design, development, production, and post-production
support
Note 1 to entry: This note applies to the French language only.
3.1.19
electronic components
electronic parts
piece parts
electrical or electronic devices that are not subject to disassembly without destruction or
impairment of design use
Note 1 to entry: Resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits,
wound components and relays are examples of electronic component.
3.1.20
electronic equipment
functioning electronic device produced by the plan owner, which incorporates electronic
components
Note 1 to entry: End items, sub-assemblies, line-replaceable units and shop-replaceable units are examples of
electronic equipment.
IEC 62239-1:2018 © IEC 2018 – 11 –
3.1.21
flight equipment
equipment used for the active flying of the aircraft (UAV, etc.) and associated with active
flying of the aircraft such as flight recorders, etc.
Note 1 to entry: This excludes equipment fitted to the aircraft not actively involved with the flying of the aircraft,
such as in-flight entertainment, galley equipment, etc.
3.1.22
NAND
Negative-AND
logic gate which produces, in digital electronics, an output that is false (0) only if all its inputs
are true (1) and an output true (1) if one or both inputs are false (0)
3.1.23
NOR
Negative-OR
logic gate which produces, in digital electronics, an output that is true (1) if both the inputs are
false (0) and an output false (0) if one or both inputs are true (1)
3.1.24
obsolete component
component which is no longer manufactured, and may or may not still be available
3.1.25
package type
generic package family describing the physical outline and lead style
Note 1 to entry: Plastic quad flat-package, ball grid array, chip scale package, SOIC package, SOT23, etc., are
examples of package type.
3.1.26
plan owner
original design authority responsible for all aspects of the design, functionality and reliability
of the delivered equipment in the intended application and responsible for writing and
maintaining their specific ECMP
3.1.27
recycled component
electrical component removed from its original product or assembly and available for reuse
Note 1 to entry: The component has authentic logos, trademarks and markings. However, it typically has no
output to measure the useful life remaining for its reuse. A recycled component can fail earlier than a new one
when re-assembled into another product or assembly. A recycled component may also be physically or ESD
damaged during the removal process.
[SOURCE: IEC TS 62668-1:2016, 3.1.17]
3.1.28
risk
measure of the potential inability to achieve overall program objectives within defined cost,
schedule, and technical constraints
3.1.29
risk management
act or practice of dealing with risk that includes planning for risk, assessing (identifying and
analysing) risk areas, developing risk handling options, monitoring risks to determine how
risks have changed, and documenting the overall risk management program

– 12 – IEC 62239-1:2018 © IEC 2018
3.1.30
single event effect
SEE
response of a component caused by the impact of a single particle (for example galactic
cosmic rays, solar energetic particles, energetic neutrons and protons)
Note 1 to entry: The range of responses can include both non-destructive (for example upset) and destructive (for
example latch-up or gate rupture) phenomena.
Note 2 to entry: This note applies to the French language only.
[SOURCE: IEC 62396-1:2016, 3.53, modified – Note 2 has been added.]
3.1.31
subcontractor assembly facilities
location where the subcontractor conducts assembly processes and uses approved test
equipment to the plan owners’ drawings and bills of material and test specifications without
owning the intellectual property rights to the equipment
3.1.32
subcontractor
person or entity to whom the holder of obligations under a contract has delegated part or all of
such obligations
3.1.33
substitute component
component used as a replacement in equipment after the equipment design has been
approved
Note 1 to entry: In some contexts, the term “alternate component” is used to describe a substitute component that
is equal to or better than the original component.
3.1.34
suspect component
electronic component which has lost supply chain traceability back to the original
manufacturer and which may have been misrepresented by the supplier or manufacturer and
may meet the definition of fraudulent or counterfeit component
Note 1 to entry: Suspect components may include but are not limited to:
1) counterfeit components;
2) recycled components coming from uncontrolled recycling operations carried outside of the OEM. Franchised
network and OEM business where typically it has been fraudulently sold to the OEM as being in a new
unused condition.
[SOURCE: IEC TS 62668-1:2016, 3.1.21]
3.1.35
validation
method of qualifying components at the plan owner, when no in-service data from prior use is
available and there is no manufacturer’s qualification data to analyse
3.2 Abbreviated terms
AC approved component
AQEC aerospace qualified electronic component (see IEC TS 62564-1)
AQP  automotive qualification programme
BGA ball grid array (related to an electronic component package)
CECC Cenelec Electronic Components committee
COTS commercial off the shelf
IEC 62239-1:2018 © IEC 2018 – 13 –
CTE coefficient of thermal expansion
DDR double data rate
DMSMS diminishing manufacturing sources and materials shortages
DPMO defects per million opportunities
DRAM dynamic random access memory
DLA Defence Logistics Agency
DSCC  Defence Supply Centre Columbus (now known as the DLA)
ECMP electronic components management plan
ELFR early life failure rate
EM electro-migration
EMC electromagnetic compatibility
ESD electrostatic discharge
ESS environmental stress screening
FITS failures in time
FPGA field-programmable gate array
H3TRB high humidity, high temperature reverse bias
HAST highly accelerate stress testing
HCI hot carrier injection
HTOL high temperature operating life
HTRB high temperature reverse bias
IATF International Automotive Task Force
IECQ international electrotechnical system quality
ILD inter-level dielectric
IMD intra-metal dielectric
JEDEC Joint Electron Device Engineering Council
LCC leadless chip carrier (related to an electronic component package)
LED light emitting diode
MRAM magnetic random access memory
MSD moisture sensitivity damage
MSL moisture sensitivity level
OEM original equipment manufacturer
OCM original component manufacturer
PCB printed circuit board
PCN product/process change notice (in this abbreviation “Product” stands for
“electronic component”)
PIND particle impact noise detection
PPM parts per million
RH relative humidity
RTV room temperature vulcanization
SDRAM synchronous dynamic random access memory
SEB single event burn-out
SEE single event effects
SEFI single event functional interrupt

– 14 – IEC 62239-1:2018 © IEC 2018
SEL single event latch-up
SEM scanning electron microscopy
SEU single event upset
SMT surface-mount technology
SPC statistical process control
SRAM static random access memory
TDDB time dependent dielectric breakdown
THB temperature humidity bias
TVS transient voltage suppressor
UAV unmanned avionic vehicle
4 Technical requirements
4.1 General
The plan shall document the processes used by the plan owner to accomplish the following
requirements which apply to all electronic components, including off-the-shelf components,
which are defined by the component manufacturer's data sheet, and custom components,
which are defined by the plan owner:
a) component selection;
b) component application;
c) component qualification;
d) component quality assurance;
e) component dependability;
f) component compatibility with the equipment manufacturing process;
g) component data;
h) configuration control.
The plan owner is responsible for these requirements even when subcontracting out, see
4.4.8 and 5.6.3.
Table A.1 provides a requirements matrix that may be used to document the accomplishments
of the technical requirements for IEC 62239-1.
Table D.1 provides guidelines for environmental protection techniques to be considered
during the avionics design process.
4.2 Component selection
4.2.1 General
All components shall be selected according to documented processes and satisfy the
requirements of 4.2 regardless of additional criteria such as standardization, order
of preference, etc.
Because of the highly individual nature of most plan owners’ administrative processes, no
detail is included here. Component selection can include the use of a preferred COTS
component list, provided the requirements of 4.2 are met when the components are placed
onto the standard list. Components should then be selected from the standard list for use in
specific applications. The selection process m
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