SIST EN 61192-4:2003

SLOVENSKI SIST EN 61192-4:2003

STANDARD
november 2003
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal
assemblies
ICS 31.190 Referenčna številka
SIST EN 61192-4:2003(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 61192-4
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2003

ICS 31.190


English version


Workmanship requirements for soldered electronic assemblies
Part 4: Terminal assemblies
(IEC 61192-4:2002)


Exigences relatives à la qualité Anforderungen an die Ausführungsqualität
d'exécution des assemblages von Lötbaugruppen
électroniques brasés Teil 4: Baugruppen mit Lötstützpunkten
Partie 4: Assemblage au moyen (IEC 61192-4:2002)
de bornes
(CEI 61192-4:2002)



This European Standard was approved by CENELEC on 2003-03-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61192-4:2003 E

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EN 61192-4:2003 - 2 -
Foreword

The text of document 91/335/FDIS, future edition 1 of IEC 61192-4, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 61192-4 on 2003-03-01.

The following dates were fixed:

– latest date by which the EN has to be implemented
 at national level by publication of an identical
 national standard or by endorsement (dop) 2003-12-01

– latest date by which the national standards conflicting
 with the EN have to be withdrawn (dow) 2006-03-01

This standard should be used in conjunction with the following parts of EN 61192, under the general title
Workmanship requirements for soldered electronic assemblies:

Part 1: General
Part 2: Surface-mount assemblies
Part 4: Terminal assemblies

Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________

Endorsement notice

The text of the International Standard IEC 61192-4:2002 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 61192-4:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions

IEC 60749 1996 Semiconductor devices - Mechanical EN 60749 1999
 and climatic test methods
A2 2001 A2 2001

1)
2)
IEC 61189-3 - Test methods for electrical materials, EN 61189-3 1997
printed boards and other
interconnection structures and
assemblies
Part 3: Test methods for interconnection
structures (printed boards)

1) 2)
IEC 61191-1 - Printed board assemblies EN 61191-1 1998
Part 1: Generic specification -
Requirements for soldered electrical
and electronic assemblies using surface
mount and related assembly
technologies

1) 2)
IEC 61191-4 - Part 4: Sectional specification - EN 61191-4 1998
Requirements for terminal soldered
assemblies

1) 2)
IEC 61192-1 - Workmanship requirements for soldered EN 61192-1 2003
electronic assemblies
Part 1: General

1)
IEC 61192-2 - Part 2: Surface-mount assemblies - -

1) 2)
IEC 61192-3 - Part 3: Through-hole mount assemblies EN 61192-3 2003




1)
Undated reference.
2)
Valid edition at date of issue.

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For price, see current catalogue

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61192-4 © IEC:2002 – 3 –
CONTENTS
FOREWORD . 7
INTRODUCTION .11
 1 Scope .13
 2 Normative references.13
 3 Terms and definitions.15
 4 General requirements.15
4.1 Classification .15
4.2 Conflict .15
4.3 Inspection technique .15
4.4 Interpretation of requirements .15
 5 Process characterization .17
5.1 Wire preparation processes .17
5.2 Terminal mounting processes .17
5.3 Soldering terminal.21
5.4 Solderability.21
5.5 Preconditioning .23
5.6 Mechanical securing .23
 6 Wire preparation attributes .33
6.1 Insulation stripping.33
6.2 Twisted strands.35
 7 Connector pins and terminals .37
7.1 Soldered connector pins.37
 8 Discrete wiring (jumper wires) .41
8.1 Wire selection.41
8.2 Wire routing.41
8.3 Staking .43
8.4 Termination .43
 9 Discrete wiring (jumper wires) attributes .45
10 Solder joint acceptance .51
10.1 Post terminations .53
Figure 1 – Funnel flange, controlled split.19
Figure 2 – Funnel flange, funnel set.21
Figure 3 – Wire and lead wrap-around .25
Figure 4 – Minimum lead wrap-around .25
Figure 5 – Side route connection, bifurcated terminal – Target .25
Figure 6 – Side route connection, bifurcated terminal – Acceptable .27
Figure 7 – Side route connection, bifurcated terminal – Nonconforming.27
Figure 8 – Straight-through insertion in bifurcated terminals – Acceptable .27
Figure 9 – Bottom-route terminal connection.29
Figure 10 – Continuous run wire wraps – Acceptable .29

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61192-4 © IEC:2002 – 5 –
Figure 11 – Stress relief for lead wiring.31
Figure 12 – Insulation clearance measurement .31
Figure 13 – Wire lead insulation .33
Figure 14 – Damaged insulation – Acceptable.33
Figure 15 – Damaged insulation – Nonconforming .33
Figure 16a – Untouched wires .35
Figure 16b – Retwisted wires.35
Figure 16c – Birdcaged wires.35
Figure 16d – Cut-wire strands.35
Figure 16 – Wire lead conductor .35
Figure 17a – Wire tinning .37
Figure 17b – Excessive wire tinning .37
Figure 17 – Solder tinning.37
Figure 18 – Acceptable fillets for levels A, B, and C .37
Figure 19 – Acceptable solder fillets for levels A and B .39
Figure 20 – Nonconforming solder coverage for levels A, B, and C.39
Figure 21 – Solder wicking conditions for levels A, B, and C.39
Figure 22 – Termination, surface mount, leaded .45
Figure 23 – Termination, surface mount, leadless .45
Figure 24 – Wire routing .47
Figure 25 – Wire routed under or over components.47
Figure 26 – Routing near lands .49
Figure 27 – Wire in component area .49
Figure 28 – Wire staking.49
Figure 29 – Unsecured wire .51
Figure 30 – Termination to projecting component leads and plated holes .51
Figure 31 – Acceptable solder joint .51
Figure 32 – Acceptable solder joint .53
Figure 33 – Nonconforming fractured solder joint .53
Figure 34 – Acceptable post termination .53
Figure 35 – Acceptable bifurcated terminal .55
Figure 36 – Nonconforming post termination.55
Figure 37 – Acceptable wire strip gap .55
Figure 38 – Insulation damage.57
Figure 39 – Zero and near zero strip gap conditions.57
Figure 40 – Excessive strip gap conditions.59
Figure 41 – Excessive insulation damage .59
Table 1 – Nicked or broken strand limits .17

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61192-4 © IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
WORKMANSHIP REQUIREMENTS
FOR SOLDERED ELECTRONIC ASSEMBLIES –
Part 4: Terminal assemblies
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61192-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/335/FDIS 91/352/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This standard should be used in conjunction with the following parts of IEC 61192, under the
general title, Workmanship requirements for soldered electronic assemblies:
Part 1: General
Part 2: Surface-mount assemblies
Part 3: Through-hole mount assemblies

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61192-4 © IEC:2002 – 9 –
The committee has decided that the contents of this publication will remain unchanged until
2008. At this date, the publication will be
 reconfirmed;
 withdrawn;
 replaced by a revised edition, or
 amended.

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61192-4 © IEC:2002 – 11 –
INTRODUCTION
This part of IEC 61192, combined with IEC 61192-1, is used to meet the end-product
requirements defined in IEC 61191-1 and IEC 61191-4.
This standard may be used to enable the suppliers and users of terminal electronic assemblies
to specify good manufacturing practices as part of a contract.
The respective requirements and guidelines for surface-mount assemblies, and through-hole
attachment, are included in separate but related standards.

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61192-4 © IEC:2002 – 13 –
WORKMANSHIP REQUIREMENTS
FOR SOLDERED ELECTRONIC ASSEMBLIES –
Part 4: Terminal assemblies
1 Scope
This part of IEC 61192 specifies general requirements for workmanship in terminal soldered
assemblies on organic substrates, on printed boards, and on similar laminates attached to the
surface(s) of inorganic substrates.
It applies to assemblies that are totally terminals or mixed assemblies that include surface-
mounting or other related assembly technologies, for example through-hole, wires.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 60749:1996, Semiconductor devices – Mechanical and climatic test methods
Amendment 2:2001
IEC 61189-3, Test methods for electrical materials, interconnection structures and assemblies –
Part 3: Test methods for interconnection structures (printed boards)
IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for
soldered electrical and electronic assemblies using surface mount and related assembly
technologies
IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for
terminal soldered assemblies
IEC 61192-1, Workmanship requirements for soldered electronic assemblies – Part 1: General
IEC 61192-2, Workmanship requirements for soldered electronic assemblies – Part 2: Surface-
mount assemblies
IEC 61192-3, Workmanship requirements for soldered electronic assemblies – Part 3: Through-
hole mount assemblies

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61192-4 © IEC:2002 – 15 –
3 Terms and definitions
For the purposes of this part of IEC 61192, the definitions of IEC 60194 apply.
4 General requirements
The requirements of IEC 61192-1 are mandatory for this standard.
4.1 Classification
The classification of assemblies is divided into three levels, levels A, B, and C. Definitions of
the classification categories and the status of product for each level are given in IEC 61192-1.
In general, status is divided into three workmanship conditions as follows:
a) Target
b) Acceptable
c) Nonconforming
4.2 Conflict
Accept and/or reject decisions shall be based on applicable documentation such as contracts,
drawings, specifications and reference documents.
In the event of conflict, the following order of precedence shall apply:
a) procurement documents as agreed between user and supplier;
b) master assembly drawing;
c) IEC 61191-1 and IEC 61192-1;
d) this standard;
e) other documents to the extent that they are specified in this standard.
4.3 Inspection technique
For visual inspection, individual specifications may call for magnification aids for examining
printed-board assemblies.
Binocular vision should be used, and may be accomplished with a single large field magnifier.
Magnification of at least 3× shall be used for conventional inserted printed board assemblies.
Higher magnifications than 10× will not be found practicable for routine high-speed scanning
inspection but will be needed sometimes for detailed diagnosis or referee purposes.
4.4 Interpretation of requirements
Unless otherwise specified by the user, the word "shall", signifies that the requirement is
mandatory. Deviation from any "shall" requirement requires written acceptance by the user,
for example via assembly drawing, specification or contract provision.
The words "should" and "may" reflect recommendations and guidance, respectively, and are
used whenever it is intended to express non-mandatory provisions.

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61192-4 © IEC:2002 – 17 –
5 Process characterization
5.1 Wire preparation processes
Sufficient insulation shall be stripped from the wire or leads to provide for insulation clearances
as specified. Chemical stripping agents shall be used for solid wire only and shall be
neutralized or removed prior to soldering. After insulation removal, deformation of remaining
insulation shall not exceed 20 % of the insulation thickness. In stripping insulation, care should
be taken to avoid nicking or otherwise damaging the wire or the remaining insulation.
For level A or B assemblies, the number of damaged or severed strands in a single wire shall
not exceed the limits given in Table 1. For wires used at a potential of 6 kV, or greater, or for
level C assemblies, there shall be no broken strands; nicked strands shall be according to
Table 1. Insulation discoloration resulting from thermal stripping is permissible.
Table 1 – Nicked or broken strand limits
Maximum allowable nicked or broken strands
Number of strand
Level A and B Level C
Less than 7 0 0
7-15 1 0
16-18 2 0
19-25 3 0
26-36 4 0
37-40 5 0
41 or more 6 0
Portions of stranded wire which will be soldered shall be tinned prior to mounting. The solder
shall penetrate to the inner strands of the wire and shall wet the tinned portion of the wire.
Wicking of solder under the insulation shall be minimized.
5.2 Terminal mounting processes
Terminals not connected to printed wiring or ground planes shall be of the rolled flange
configuration (see Figure 1). A printed foil land may be used as a seating surface for a rolled
flange provided that the land is isolated and not connected to active printed wiring or ground
plane.
The shank of the terminal shall be neither perforated nor split, cracked, or otherwise
discontinuous to the extent that oils, flux, inks, or other substances utilized for processing the
printed board can be entrapped. Circumferential cracks or splits in the shank are not
acceptable regardless of extent.
The rolled flange shall not be split, cracked, or otherwise discontinuous to the extent that flux,
oils, inks, or other liquid substances utilized for processing the printed board can be entrapped
within the mounting hole. After rolling, the rolled area shall be free of circumferential splits
or cracks, but may have a maximum of three radial splits or cracks provided that the splits or
cracks are separated by at least 90° and do not extend into the barrel of the terminal
(see Figure 1).

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61192-4 © IEC:2002 – 19 –
Flared flange terminals shall be mounted in non-interfacial plated through-holes provided the
mounting is in conjunction with a land or ground plane on the flared side as shown in Figure 2;
they shall not be flared to the base material of the printed board. Funnel shoulder terminals
shall not be used.
Flared flanges shall be formed to an included angle of between 35° and 120° and, shall extend
between 0,4 mm and 1,5 mm beyond the surface of the land, provided minimum electrical
spacing requirements are maintained and the flare diameter does not exceed the diameter of
the land.
Target – Level A, B, C
1 Funnel set uniformly, split and formed
concentric to hole.
Acceptable – Level A, B
Nonconforming – Level C
1 Flange splits down to board but not into
barrel.
IEC  2918/02
Figure 1 – Funnel flange, controlled split

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61192-4 © IEC:2002 – 21 –
Acceptable – Level A, B
1 Funnel set uniformly and concentric to
hole.
2 Split in set flange, but not in barrel.
Nonconforming – Level B, C
1 Funnel set periphery uneven or jagged.
2 Splits enter into barrel.
Acceptable – Level A
May be acceptable if soldered after
swagging.
IEC  2919/02
Figure 2 – Funnel flange, funnel set
The flared flange of a terminal shall not be perforated, split, cracked, or otherwise
discontinuous to the extent that flux, oils, inks or other substances utilized for processing the
printed board can be entrapped.
5.3 Soldering terminal
Solder terminals shall be finished with a solderable material and should be provided with guide
slots. holes, grooves or similar features to ensure proper attachment of wire(s) or leads to the
terminals. Terminal slots and solder cups shall not be modified to accept oversize conductors
and conductors shall not be modified to fit undersized terminals. Terminals made of brass shall
have a barrier plate of copper or nickel over the brass.
5.4 Solderability
Solderability of parts shall be the responsibility of the supplier and shall meet the requirements
of the manufacturer. Electronic/mechanical components and wires shall meet the requirements
of IEC 60749, amendment 2 or equivalent; printed boards shall meet the requirements of IEC
61189-3 or equivalent. Prior to acceptance of parts for storage or use, the manufacturer shall
ensure that the parts to be soldered have been solderability tested in accordance with a
sampling plan and conform to the requirements of the applicable solderability specifications.

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61192-4 © IEC:2002 – 23 –
5.5 Preconditioning
Solder used for preconditioning, gold removal, tinning of parts and machine soldering shall be
analysed, replaced or replenished at a frequency to ensure compliance with the limits specified
in Table 1 of IEC 61191-1. The frequency of analysis should be determined on the basis of
historical data or monthly analyses. If contamination exceeds the limits defined, i
...