kSIST FprEN IEC 60115-2:2025

SLOVENSKI STANDARD
oSIST prEN IEC 60115-2:2024
01-december-2024
Stalni upori za elektronsko opremo - 2. del: Področna specifikacija: Tankoplastni
upori nizke moči z izvodi za montažo skozi prehodne luknje tiskanih vezij
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-
power film resistors with leads for through-hole assembly on circuit boards (THT)
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 2:
Rahmenspezifikation: Niedrigbelastbare Schichtwiderstände mit Drahtanschlüssen für
Durchsteckmontage auf Leiterplatten (THT)
Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification
intermédiaire: Résistances à couches et à faible dissipation équipées de broches pour
assemblage par trous traversants sur circuits imprimés (THT)
Ta slovenski standard je istoveten z: prEN IEC 60115-2:2024
ICS:
31.040.10 Fiksni upor Fixed resistors
oSIST prEN IEC 60115-2:2024 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 60115-2:2024
oSIST prEN IEC 60115-2:2024
EUROPEAN STANDARD DRAFT
prEN IEC 60115-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2024
ICS 31.040.10 Will supersede EN 60115-2:2015
English Version
Fixed resistors for use in electronic equipment - Part 2: Sectional
specification: Low-power film resistors with leads for through-
hole assembly on circuit boards (THT)
(IEC 60115-2:2023)
To be completed Festwiderstände zur Verwendung in Geräten der Elektronik
(IEC 60115-2:2023) - Teil 2: Rahmenspezifikation: Niedrigbelastbare
Schichtwiderstände mit Drahtanschlüssen für
Durchsteckmontage auf Leiterplatten (THT)
(IEC 60115-2:2023)
This draft European Standard is submitted to CENELEC members for enquiry.
Deadline for CENELEC: 2024-12-27.

The text of this draft consists of the text of IEC 60115-2:2023 (40/2943/CDV).

If this draft becomes a European Standard, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

This draft European Standard was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 78789 Ref. No. prEN IEC 60115-2:2024 E

oSIST prEN IEC 60115-2:2024
prEN IEC 60115-2:2024 (E)
European foreword
This document (prEN IEC 60115-2:2024) consists of the text of document IEC 60115-2:2023, prepared
by IEC/TC 40 " Capacitors and resistors for electronic equipment".
This document is currently submitted to the Enquiry.
The following dates are proposed:
• latest date by which the existence of this document (doa) dor + 6 months
has to be announced at national level
• latest date by which this document has to be (dop) dor + 12 months
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) dor + 36 months
conflicting with this document have to be withdrawn (to be confirmed or
modified when voting)
This document will supersede EN 60115-2:2015 and all of its amendments and corrigenda (if any).
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure of the generic specification EN 60115-1:2023, where
the tests of prior Clause 4 are given in Clauses 6 to 12 now;
b) the definitions of product technologies and product classification levels of the generic specification,
EN 60115-1:2023, have been adopted;
c) the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA-0922 has
been removed;
d) a basis for the optional specification of the lead eccentricity of axial leaded resistors has been
amended in 4.2;
e) the ‘periodic-pulse high-voltage overload test’ of EN 60115-1:2023, 8.3 has been adopted as default
test method in 5.3.8, thereby replacing the legacy test ‘periodic-pulse overload test’ of EN 60115-
1:2023, 8.4;
f) the revised solderability test of EN 60115-1:2023, 11.1 has been adopted in 5.3.19 and 5.3.20;
g) the combined solvent resistance test of EN 60115-1:2023, 11.3 has been adopted in in 5.3.22;
h) the ‘endurance at room temperature test’ of EN 60115-1:2023, 7.2 (prior Annex C of
EN 60115-2:2015) has been adopted as an optional test in 5.4.1;
i) the ‘single-pulse high-voltage overload test’ of EN 60115-1:2023, 8.2, applied with the pulse shape
10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50
in 5.4.2;
j) climatic tests for ‘operation at low temperature’ of EN 60115-1:2023, 10.2, and for ‘damp heat,
steady state, accelerated’ of EN 60115-1:2023, 10.5, have been adopted as optional tests in 5.4.4.
and 5.4.5, respectively;
oSIST prEN IEC 60115-2:2024
prEN IEC 60115-2:2024 (E)
k) new guidance is provided in 6.2 on the presentation of stability requirements with their permissible
absolute and relative deviations;
l) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
m) visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2
n) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
o) a new Annex C has been added to summarize workmanship requirements for the assembly of
leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
p) the informative Annex F (prior Annex B) on radial formed styles has been amended with details on
a formed Z-bend style for surface-mount assembly.
Preceding documents on the subject covered by this specification have been:
— EN 60115-2:2015
— EN 140100:2008, EN 140100:1996 + EN 140100:1996/A1:2001
— CECC 40 100:1980-00, 1973-00

oSIST prEN IEC 60115-2:2024
oSIST prEN IEC 60115-2:2024
IEC 60115-2 ®
Edition 4.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –

Part 2: Sectional specification: Low-power film resistors with leads for through-

hole assembly on circuit boards (THT)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6467-6

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CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
3.1 Terms . 10
3.2 Product technologies . 11
3.3 Product classification . 11
4 Preferred characteristics . 11
4.1 General . 11
4.2 Style and dimensions . 11
4.2.1 Preferred styles and outline dimensions. 11
4.2.2 Length of excessive coating or welding bead . 13
4.2.3 Lead wire spacing . 13
4.2.4 Lead eccentricity . 14
4.3 Preferred climatic categories . 15
4.4 Resistance . 16
4.5 Tolerances on resistance . 16
4.6 Rated dissipation P . 16
4.7 Limiting element voltage U . 16
max
4.8 Insulation voltage U . 17
ins
4.9 Insulation resistance R . 17
ins
5 Tests and test severities . 17
5.1 General provisions for tests applied by this specification . 17
5.2 Preparation of specimens . 18
5.2.1 Drying . 18
5.2.2 Mounting of components on test boards . 18
5.2.3 Mounting of components on a test rack . 21
5.3 Details of applied tests . 23
5.3.1 Resistance . 23
5.3.2 Temperature coefficient of resistance . 23
5.3.3 Temperature rise . 23
5.3.4 Endurance at the rated temperature 70 °C . 23
5.3.5 Endurance at a maximum temperature: UCT . 24
5.3.6 Short-term overload . 24
5.3.7 Single-pulse high-voltage overload test . 25
5.3.8 Periodic-pulse high-voltage overload test . 26
5.3.9 Electrostatic discharge (ESD) test . 27
5.3.10 Visual examination . 27
5.3.11 Gauging of dimensions . 28
5.3.12 Detail dimensions . 28
5.3.13 Robustness of terminations . 28
5.3.14 Vibration . 29
5.3.15 Rapid change of temperature . 29
5.3.16 Rapid change of temperature, ≥ 100 cycles . 29
5.3.17 Climatic sequence . 29
5.3.18 Damp heat, steady state . 30

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5.3.19 Solderability, with lead-free solder . 30
5.3.20 Solderability, with SnPb solder . 31
5.3.21 Resistance to soldering heat . 32
5.3.22 Solvent resistance . 32
5.3.23 Insulation resistance . 32
5.3.24 Voltage proof . 32
5.3.25 Flammability . 33
5.4 Optional and/or additional tests . 33
5.4.1 Endurance at room temperature . 33
5.4.2 Single-pulse high-voltage overload test . 34
5.4.3 Periodic-pulse overload test . 34
5.4.4 Operation at low temperature. 35
5.4.5 Damp heat, steady state, accelerated . 35
6 Performance requirements. 36
6.1 General . 36
6.2 Limits for change of resistance at tests . 36
6.3 Temperature coefficient of resistance . 39
6.4 Temperature rise . 39
6.5 Visual examination . 40
6.5.1 General visual criteria . 40
6.5.2 Visual criteria after tests . 40
6.5.3 Visual criteria for the packaging . 40
6.6 Solderability . 40
6.7 Insulation resistance . 41
6.8 Flammability . 41
7 Marking, packaging and ordering information . 41
7.1 Marking of the component . 41
7.2 Packaging . 41
7.3 Marking of the packaging . 41
7.4 Ordering information . 42
8 Detail specifications . 42
8.1 General . 42
8.2 Information to be specified in a detail specification . 42
8.2.1 Outline drawing or illustration . 42
8.2.2 Style and dimensions . 42
8.2.3 Climatic category . 43
8.2.4 Resistance range . 43
8.2.5 Tolerances on resistance . 43
8.2.6 Rated dissipation P . 43
8.2.7 Limiting element voltage U . 43
max
8.2.8 Insulation voltage U . 43
ins
8.2.9 Insulation resistance R . 43
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 44
8.2.14 Ordering information . 44
8.2.15 Mounting . 44

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8.2.16 Storage. 44
8.2.17 Transportation . 44
8.2.18 Additional information . 44
8.2.19 Quality assessment procedures . 44
8.2.20 0 Ω resistors . 44
9 Quality assessment procedures . 45
9.1 General . 45
9.2 Definitions. 45
9.2.1 Primary stage of manufacture . 45
9.2.2 Structurally similar components . 45
9.2.3 Assessment level EZ . 45
9.3 Formation of inspection lots . 45
9.4 Approved component (IECQ AC) procedures . 46
9.5 Qualification approval (QA) procedures . 46
9.5.1 General . 46
9.5.2 Qualification approval . 47
9.5.3 Quality conformance inspection . 47
9.6 Capability certification (IECQ AC-C) procedures . 47
9.7 Technology certification (IECQ-AC-TC) procedures . 47
9.8 Periodical evaluation of termination plating . 47
9.9 Delayed delivery . 47
9.10 Certified test records. 48
9.11 Certificate of conformity (CoC) . 48
Annex A (normative) Symbols and abbreviated terms . 58
A.1 Symbols . 58
A.2 Abbreviated terms . 61
Annex B (normative) Visual examination acceptance criteria . 63
B.1 General . 63
B.2 Criteria for general visual inspection of specimens . 63
B.3 Criteria for visual inspection of specimens after tests . 63
Annex C (normative) Workmanship requirements for the assembly of leaded film
resistors . 64
C.1 General . 64
C.2 Lead forming . 64
C.2.1 General . 64
C.2.2 Means for support of mounting height . 65
C.3 Mounting . 66
C.3.1 General . 66
C.3.2 Lateral mounting . 67
C.3.3 Upright mounting . 68
C.4 Lead trimming . 69
Annex D (normative) Zero Ohm resistors (jumpers). 71
D.1 General . 71
D.2 Preferred characteristics . 71
D.3 Tests and test severities . 71
D.4 Performance requirements . 72
D.5 Marking, packaging and ordering information . 72
D.6 Detail specification . 73

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D.7 Quality assessment procedures . 73
Annex E (informative) Guide on the application of optional and additional tests . 74
E.1 General . 74
E.2 Endurance at room temperature . 74
E.3 Single-pulse high-voltage overload test . 75
E.4 Periodic- pulse overload test . 76
E.5 Operation at low temperature . 76
E.6 Damp heat, steady state, accelerated . 77
Annex F (informative) Radial formed types. 79
F.1 General . 79
F.1.1 Applicability of this annex . 79
F.1.2 Denomination of radial formed types . 79
F.1.3 Coated lead wires . 81
F.1.4 Means for support of mounting height . 81
F.1.5 Means for retention . 82
F.2 Radial formed types for through-hole assembly . 82
F.2.1 Radial formed type with lateral body position . 82
F.2.2 Radial formed type with upright body position . 84
F.3 Radial formed types for surface-mount assembly . 87
F.4 Packaging . 88
F.4.1 Packaging of resistors formed for through-hole assembly . 88
F.4.2 Packaging of resistors formed for surface-mount assembly . 89
F.5 Quality assessment . 89
F.5.1 General . 89
F.5.2 Quality assessment of formed resistors . 89
F.5.3 Forming of finished resistors of assessed quality . 90
F.5.4 Special inspection requirements . 90
Annex X (informative) Cross-references for the prior revision of this specification . 91
Bibliography . 94

Figure 1 – Illustration of a typical axial leaded resistor . 10
Figure 2 – Illustrations of typical radial leaded resistors . 10
Figure 3 – Shape and dimension of axial leaded resistors . 12
Figure 4 – Alternative methods for specification of the length of excessive protective
coating on axial leaded resistors . 13
Figure 5 – Lead-wire spacing of axial leaded resistors with bent leads . 14
Figure 6 – Specification of the lead eccentricity of axial leaded resistors . 15
Figure 7 – Derating curve . 16
Figure 8 – Basic layout for mechanical, environmental and electrical tests . 19
Figure 9 – Assembly of specimens to the test board . 20
Figure 10 – Mounting of axial leaded specimens on a rack, top view . 22
Figure 11 – Examples of specimen lead fixation devices . 23
Figure C.1 – Lead forming dimensions . 64
Figure C.2 – Examples of mounting height support . 66
Figure C.3 – Clearance between coating and solder . 67
Figure C.4 – Lateral mounting . 67

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Figure C.5 – Upright mounting . 68
Figure C.6 – Lead protrusion . 69
Figure C.7 – Lead end distortion . 70
Figure F.1 – Production flow and different scopes of quality assurance . 80
Figure F.2 – Shape and dimensions of radial formed resistor for lateral body position . 82
Figure F.3 – Shape and dimensions of radial formed resistor for lateral body position
with kinked lead wires . 83
Figure F.4 – Shape and dimensions of radial formed resistor for upright body position. 84
Figure F.5 – Shape and dimensions of radial formed resistor for upright body position

and wide spacing . 85
Figure F.6 – Shape and dimensions of radial formed resistor for upright body position
and wide spacing, with kinked lead wire . 85
Figure F.7 – Shape and dimensions of radial formed resistor for surface-mount
assembly (Z-bend) . 87
Figure F.8 – Land pattern dimensions for surface-mount assembly . 88

Table 1 – Preferred styles of axial leaded resistors . 12
Table 2 – Test board dimensions . 20
Table 3 – Preferred aggravated overload conditions . 27
Table 4 – Limits for the change of resistance at tests . 38
Table 5 – Permitted change of resistance due to the variation of temperature . 39
Table 6 – Test schedule for the qualification approval . 48
Table 7 – Test schedule for the quality conformance inspections . 53
Table C.1 – Lead bend radius . 65
Table C.2 – Recommended circuit board bore diameters . 66
Table C.3 – Clearance of lateral mounted resistors . 68
Table E.1 – Implementation of the test endurance at room temperature . 74
Table E.2 – Implementation of the single-pulse high-voltage overload test . 75
Table E.3 – Implementation of the periodic-pulse overload test . 76
Table E.4 – Implementation of the operation at low temperature test . 77
Table E.5 – Implementation of the test damp heat, steady state, accelerated . 78
Table F.1 – Feasible lead-wire spacing of radial formed resistor for lateral body
position . 84
Table F.2 – Feasible lead-wire spacing of radial formed resistor for upright body
position . 87
Table X.1 – Cross reference for references to clauses . 91
Table X.2 – Cross reference for references to figures . 93
Table X.3 – Cross reference for references to table . 93

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IEC 60115-2:2023 © IEC 2023 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 2: Sectional specification: Low-power film resistors with leads
for through-hole assembly on circuit boards (THT)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60115-2 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This fourth edition cancels and replaces the third edition published in 2014. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the definitions of product technologies and product classification levels of the generic
specification, IEC 60115‑1:2020, have been adopted;
b) the preferred dimensions given in Table 1 have been reviewed, and the legacy style
RA_0922 has been removed;
c) a basis for the optional specification of the lead eccentricity of axial leaded resistors has
been amended in 4.2;
oSIST prEN IEC 60115-2:2024
– 8 – IEC 60115-2:2023 © IEC 2023
d) the 'period-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been adopted as
default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test'
of IEC 60115‑1:2020, 8.4;
e) the revised solderability test of IEC 60115‑1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20;
f) the combined solvent resistance test of IEC 60115‑1:2020, 11.3 has been adopted in 5.3.22;
g) the 'endurance at room temperature test' of IEC 60115‑1:2020, 7.2 (prior IEC 60115 2:2014,
Annex C) has been adopted as an optional test in 5.4.1;
h) the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse
shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse
shape 1,2/50 in 5.4.2;
i) climatic tests for 'operation at low temperature' of IEC 60115‑1:2020, 10.2, and for 'damp
heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional
tests in 5.4.4 and 5.4.5, respectively;
j) new guidance is provided in 6.2 on the presentation of stability requirements with their
permissible absolute and relative deviations;
k) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
l) visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2;
m) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
n) the revised test clause numbering of IEC 60115‑1:2020 has been applied;
o) a new Annex C has been added to summarize workmanship requirements for the assembly
of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
p) the informative Annex F (prior Annex B) on radial formed styles has been amended with
details on a formed Z-bend style for surface-mount assembly.
The text of this International Standard is based on the following documents:
Draft Report on voting
40/2943/CDV 40/3001/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
A list of all parts in the IEC 60115 series, published under the general title Fixed resistors for
use in electronic equipment, can be found on the IEC website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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IEC 60115-2:2023 © IEC 2023 – 9 –
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 2: Sectional specification: Low-power film resistors with leads
for through-hole assembly on circuit boards (THT)

1 Scope
This part of IEC 60115 is applicable to fixed low-power film resistors with termination leads for
use in electronic equipment, which are typically assembled in through-hole technology (THT)
on circuit boards.
These resistors are typically described according to types (different geometric shapes) and
styles (different dimensions) and product technology. The resistive element of these resistors
is typically protected by a conformal lacquer coating. These resistors have wire terminations
and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this document is to state preferred ratings and characteristics and to select from
IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and
to give general performance requirements for this type of resistor.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60062:2016, Marking codes for resistors and capacitors
IEC 60063:2015, Preferred number series for resistors and capacitors
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-6:2007, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-20:2021, Environmental testing – Part 2-20: Tests – Test Ta and Tb – Test
methods for solderability and resistance to soldering heat of devices with leads
IEC 60115-1:2020, Fixed resistors for use in electronic equipment – Part 1: Generic
specification
IEC 60286-1, Packaging of components for automatic handling – Part 1: Tape packaging of
components with axial leads on continuous tapes
IEC 60294:2012, Measurement of the dimensions of a cylindrical component with axial
terminations
IEC 60301, Preferred diameters of wire terminations of capacitors and resistors
IEC 61193-2:2
...