SIST EN 61192-2:2003

SIST EN 61192-2:2003SLOVENSKInovember 2003
STANDARDWorkmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 61192-2:2003(en)ICS31.190







EUROPEAN STANDARD
EN 61192-2 NORME EUROPÉENNE EUROPÄISCHE NORM
April 2003 CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61192-2:2003 E
ICS 31.190
English version
Workmanship requirements for soldered electronic assemblies Part 2: Surface-mount assemblies (IEC 61192-2:2003)
Exigences relatives à la qualité d'exécution des assemblages électroniques brasés Partie 2: Assemblage par montage
en surface (CEI 61192-2:2003)
Anforderungen an die Ausführungsqualität von Lötbaugruppen Teil 2: Baugruppen
in Oberflächenmontage (IEC 61192-2:2003)
This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.



EN 61192-2:2003 - 2 - Foreword
The text of document 91/357/FDIS, future edition 1 of IEC 61192-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61192-2 on 2003-04-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2006-04-01
This standard should be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 1: General Part 2: Surface-mount assemblies Part 4: Terminal assemblies
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A and ZA are normative. Annex ZA has been added by CENELEC. __________
Endorsement notice
The text of the International Standard IEC 61192-2:2003 was approved by CENELEC as a European Standard without any modification. __________



- 3 - EN 61192-2:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60194 - 1) Printed board design, manufacture and assembly - Terms and definitions
- - IEC 61191-1 - 1) Printed board assemblies Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61191-1 1998 2) IEC 61191-2 - 1) Part 2: Sectional specification - Requirements for surface mount soldered assemblies
EN 61191-2 1998 2) IEC 61191-3 - 1) Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
EN 61191-3 1998 2) IEC 61191-4 - 1) Part 4: Sectional specification - Requirements for terminal soldered assemblies
EN 61191-4 1998 2) IEC 61192-1 - 1) Workmanship requirements for soldered electronic assemblies Part 1: General
EN 61192-1 2003 2) IEC 61192-3 - 1) Part 3: Through-hole mount assemblies EN 61192-3 2003 2) IEC 61192-4 - 1) Part 4: Terminal assemblies
EN 61192-4 2003 2) IEC 61193-1 - 1) Quality assessment systems Part 1: Registration and analysis of defects on printed board assemblies
EN 61193-1 2002 2)
1) Undated reference.
2) Valid edition at date of issuie.



EN 61192-2:2003 - 4 - Publication Year Title EN/HD Year ISO 9001 - 1) Quality management systems - Requirements
EN ISO 9001 2000 2) ISO 9002 - 1) Quality systems - Model for quality assurance in production, installation and servicing
EN ISO 9002 1994 2)



CEIIEC61192-2Exigences relatives à la qualité d'exécutiondes assemblages électroniques brasés –Partie 2:Assemblage par montage en surfaceWorkmanship requirementsfor soldered electronic assemblies –Part 2:Surface-mount assembliesPour prix, voir catalogue en vigueurFor price, see current catalogue©"( )⎯"(*+,-.+,)Aucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photocopie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.--.
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61192-2 © IEC:2003– 3 –CONTENTSFOREWORD.11INTRODUCTION.151Scope.172Normative references.173Terms and definitions.194General requirements.194.1Classification.194.2Conflict.194.3Interpretation of requirements.214.4Antistatic precautions.215Component preparation processes.216Solder paste deposition process qualification.216.1Solder paste characteristics.216.2Assessment of the process.216.3Solder paste deposition – Screen and stencil printing methods –Process control limits.237Non-conductive adhesive deposition process.277.1Pot life.277.2Inter-stage storage and handling.277.3Adhesive tackiness.297.4Assessment of the adhesive attachment process.297.5Adhesive deposition – Syringe dispensing method – Small components –Process control limits.298Temporary masking processes.359Component placement processes.359.1Assessment of the process.359.2Discrete components with gull-wing leads.399.3IC components with flat-ribbon, L- or gull-wing leads on two sides.459.4IC components with flat-ribbon, L- or gull-wing leads on four sides, forexample, quad flat packs.519.5Components with round or flattened (coined) leads.579.6IC component packages with J-leads on two and four sides, for example,SOJ, PLCC.599.7Leadless rectangular components with metallized terminations.659.8Components with cylindrical endcap terminations.719.9Bottom-only terminations on leadless components.759.10Leadless chip carriers with castellated terminations.799.11Components with butt leads.839.12Components with inward L-shaped ribbon leads.899.13Flat-lug leads on power dissipating components.91



61192-2 © IEC:2003– 5 –10Post-placement rework.9310.1Rework of components placed on solder paste.9510.2Rework of components placed on non-conductive adhesive.9511Adhesive curing.9512Soldering processes.9713Cleaning processes.9914Hand placement and hand soldering, including hand rework/repair.9915Electrical test.99Annex A (normative).101A.1Introduction.101A.2Example solder fillets and alignment:flat-ribbon, L- and gull-wing leads.101A.3Example solder fillets and alignment:round or flattened (coined) leads.105A.4Example solder fillets and alignment:J-leads.107A.5Example solder fillets and alignment:rectangular or square end leadless components.109A.6Example solder fillets and alignment:cylindrical end cap terminations, for example, MELFs.111A.7Example solder fillets and alignment:bottom-only terminations on leadless components.115A.8Example solder fillets and alignment:leadless chip carriers with castellated terminations.119A.9Example solder fillets and alignment:butt joints.123A.10Example solder fillets and alignment:inward L-shaped flat ribbon leads.125A.11Example solder fillets and alignment:flat-lug leads on power dissipating components.127Figure 1 – Solder paste contour and cross-section – Target.23Figure 2 – Solder paste contour and cross-section – Acceptable.25Figure 3 – Solder paste contour and cross-section – Nonconforming.25Figure 4 – Insufficient paste quantity – Nonconforming.27Figure 5 – Smudged paste – Nonconforming.27Figure 6 – Adhesive contour and quantity – Target.31Figure 7 – Adhesive placement – Acceptable.33Figure 8 – Adhesive placement – Nonconforming.35Figure 9 – Discrete component placement – Target.39Figure 10 – Discrete component placement – Acceptable.41Figure 11 – Discrete component placement – Nonconforming.43Figure 12 – IC gull-wing component, 2 sides – Target.45Figure 13 – IC gull-wing component, 2 sides – Acceptable.47Figure 14 – IC gull-wing component, 2 sides – Nonconforming.49Figure 15 – IC gull-wing component, 4 sides – Target.51Figure 16 – IC gull-wing component, 4 sides – Acceptable.53



61192-2 © IEC:2003– 7 –Figure 17 – IC gull-wing component, 4 sides – Nonconforming.55Figure 18 – Flattened lead target centered on land.57Figure 19 – Flattened lead offset on land – Acceptable.57Figure 20 – Flattened lead excessively offset on land – Nonconforming.57Figure 21 – IC component, J-leads on two or four sides – Target.59Figure 22 – IC component, J-leads on two or four sides – Acceptable.61Figure 23 – IC component, J-leads on two or four sides – Nonconforming.63Figure 24 – Rectangular component with metallized terminations – Target.65Figure 25 – Rectangular component with metallized terminations – Acceptable.67Figure 26 – Rectangular component with metallized terminations – Nonconforming.69Figure 27 – Cylindrical endcap component – Target.71Figure 28 – Cylindrical endcap component – Acceptable.73Figure 29 – Cylindrical endcap component – Nonconforming.75Figure 30 – Bottom-only leadless component – Target.75Figure 31 – Bottom-only leadless component – Acceptable.77Figure 32 – Bottom-only leadless component – Nonconforming.77Figure 33 – Leadless chip carrier – Target.79Figure 34 – Leadless chip carrier – Acceptable.81Figure 35 – Leadless chip carrier – Nonconforming.81Figure 36 – Butt lead component mounting – Target.83Figure 37 – Butt-lead component mounting – Acceptable.85Figure 38 – Butt-lead component mounting – Nonconforming.87Figure 39 – Inward L-shaped ribbon leaded component – Target.89Figure 40 – Inward L-shaped ribbon leaded component – Acceptable.89Figure 41 – Inward L-shaped ribbon leaded component – Nonconforming.91Figure 42 – Flat-lug component – Target.91Figure 43 – Flat-lug component – Acceptable.93Figure 44 – Flat-lug component – Nonconforming.93Figure A.1 – Target solder fillet,
levels A, B, C.101Figure A.2 – Target alignment,
levels A, B, C.101Figure A.3 – Solder fillet, level B.103Figure A.4 – Alignment, level B.103Figure A.5 – Target solder fillet,
levels A, B, C.105Figure A.6 – Target alignment,
levels A, B, C.105Figure A.7 – Solder fillet, level B.105Figure A.8 – Alignment, level B.105Figure A.9 – Target solder fillet,
levels A, B, C.107Figure A.10 – Target alignment,
levels A, B, C.107Figure A.11 – Solder fillet, level B.107Figure A.12 – Alignment, level B.107Figure A.13 – Target solder fillet,
levels A, B, C.109Figure A.14 – Target alignment,
levels A, B, C.109



61192-2 © IEC:2003– 9 –Figure A.15 – Solder fillet, level B.109Figure A.16 – Alignment, level B.109Figure A.17 – Target solder fillet,
levels A, B, C.111Figure A.18 – Target alignment,
levels A, B, C.111Figure A.19 – Solder fillet, level B.113Figure A.20 – Alignment, level B.113Figure A.21 – Target solder fillet,
levels A, B, C.115Figure A.22 – Target alignment,
levels A, B, C.115Figure A.23 – Solder fillet, level B.117Figure A.24 – Alignment, level B.117Figure A.25 – Target solder fillet,
levels A, B, C.119Figure A.26 – Target alignment,
levels A, B, C.119Figure A.27 – Solder fillet, level B.121Figure A.28 – Alignment, level B.121Figure A.29 – Target solder fillet,
levels A, B, C.123Figure A.30 – Target alignment,
levels A, B, C.123Figure A.31 – Solder fillet, level B.123Figure A.32 – Alignment, level B.123Figure A.33 – Target solder fillet,
levels A, B, C.125Figure A.34 – Target alignment,
levels A, B, C.125Figure A.35 – Solder fillet, level B.125Figure A.36 – Alignment, level B.125Figure A.37 – Target solder fillet,
levels A, B, C.127Figure A.38 – Target alignment,
levels A, B, C.127Figure A.39 – Solder fillet, level B.127Figure A.40 – Alignment, level B.127



61192-2 © IEC:2003– 11 –INTERNATIONAL ELECTROTECHNICAL COMMISSION____________WORKMANSHIP REQUIREMENTSFOR SOLDERED ELECTRONIC ASSEMBLIES –Part 2: Surface-mount assembliesFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the International Organizationfor Standardization (ISO) in accordance with conditions determined by agreement between the twoorganizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)
In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)
The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)
Attention is drawn to the possibility that some of the elements of this International Standard may be the subjectof patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 61192-2 has been prepared by IEC technical committee 91:Electronics assembly technology.The text of this standard is based on the following documents:FDISReport on voting91/357/FDIS91/371/RVDFull information on the voting for the approval of this standard can be found in the report onvoting indicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.This standard should be used in conjunction with the following parts of IEC 61192, under thegeneral title Workmanship requirements for soldered electronic assemblies:Part 1:GeneralPart 3:Through-hole mount assembliesPart 4:Terminal assemblies



61192-2 © IEC:2003– 13 –The committee has decided that the contents of this publication will remain unchanged until 2008.At this date, the publication will be•reconfirmed;•withdrawn;•replaced by a revised edition, or•amended.



61192-2 © IEC:2003– 15 –INTRODUCTIONThis part of IEC 61192, combined with IEC 61192-1, is used to meet the end-productrequirements defined in IEC 61191-1 and IEC 61191-2.This standard may be used to enable the suppliers and users of surface-mount electronicassemblies to specify good manufacturing practices as part of a contract.The respective requirements for through-hole assemblies, terminal attachment and themounting of bare semiconductor die and carrier-mounted die, are included in separate butrelated standards.



61192-2 © IEC:2003– 17 –WORKMANSHIP REQUIREMENTSFOR SOLDERED ELECTRONIC ASSEMBLIES –Part 2: Surface-mount assemblies1 ScopeThis part of IEC 61192 specifies requirements for workmanship in soldered surface-mountedelectronic assemblies and multichip modules on organic substrates, on printed boards, and onsimilar laminates attached to the surface(s) of inorganic substrates.It applies to assemblies that are totally surface-mounted and to the surface-mount portions ofassemblies that include other related assembly technologies, for example, through-holemounting. It does not include metal or ceramic-based hybrid circuits in which the conductormetallization is deposited directly on a ceramic substrate or onto a ceramic-coated metalsubstrate.2 Normative referencesThe following referenced documents are indispensable for the application of this document. Fordated references, only the edition cited applies. For undated references, the latest edition ofthe referenced document (including any amendments) applies.IEC 60194, Printed board design, manufacture and assembly – Terms and definitionsIEC 61191-1, Printed board assemblies – Part 1:Generic specification – Requirements forsoldered electrical and electronic assemblies using surface mount and related assemblytechnologiesIEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements forsurface mount soldered assembliesIEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements forthrough-hole mount soldered assembliesIEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements forterminal soldered assembliesIEC 61192-1, Workmanship requirements for soldered electronic assemblies – Part 1: GeneralIEC 61192-3, Workmanship requirements for soldered electronic assemblies – Part 3: Through-hole mount assembliesIEC 61192-4, Workmanship requirements for soldered electronic assemblies – Part 4: TerminalassembliesIEC 61193-1: Quality assessment systems – Part 1: Registration and analysis of defects onprinted board assembliesISO 9001, Quality management systems – RequirementsISO 9002, Quality systems – Model for quality assurance in production, installation andservicing



61192-2 © IEC:2003– 19 –3 Terms and definitionsFor the purposes of this part of IEC 61192, the definitions of IEC 60194 apply.4 General requirementsThe requirements of IEC 61192-1 are mandatory for this standard.4.1 ClassificationThe classification of assemblies is divided into three levels, that is levels A, B, and C.Definitions of the classification categories and the status of product for each level are given inIEC 61192-1. In general, status is divided into three workmanship conditions as follows:a)target;b)acceptable;c)nonconforming.4.2 ConflictUnless the user specifies compliance with all of the requirements (or with specific items) in thisstandard, for example, as part of a supply contract, the mandatory clauses and subclausesherein may be interpr
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