ISO/IEC 10373-3:2010

INTERNATIONAL ISO/IEC
STANDARD 10373-3
Second edition
2010-10-01
Identification cards — Test methods —
Part 3:
Integrated circuit cards with contacts and
related interface devices
Cartes d'identification — Méthodes d'essai —
Partie 3: Cartes à circuit(s) intégré(s) à contacts et dispositifs d'interface
assimilés
Reference number
©
ISO/IEC 2010
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ii © ISO/IEC 2010 – All rights reserved

Contents Page
Foreword .v
1 Scope.1
2 Normative references.1
3 Terms and definitions .2
4 General items applicable to the test methods.2
4.1 Test environment.2
4.2 Pre-conditioning .2
4.3 Selection of test methods.3
4.4 Default tolerance .3
4.5 Total measurement uncertainty .3
4.6 Conventions for electrical measurements.3
4.7 Apparatus.3
4.7.1 Apparatus for testing the integrated circuit cards with contacts (card-test-apparatus) .3
4.7.2 Apparatus for testing the interface device (IFD-test-apparatus).8
4.7.3 Test Scenario .13
4.8 Relationship of test methods versus base standard requirements.13
5 Test methods for electrical characteristics of cards with contacts.16
5.1 VCC contact .16
5.1.1 Apparatus.16
5.1.2 Procedure.16
5.1.3 Test report.17
5.2 I/O contact .17
5.2.1 Apparatus.17
5.2.2 Procedure.17
5.2.3 Test report.19
5.3 CLK contact .19
5.3.1 Apparatus.19
5.3.2 Procedure.19
5.3.3 Test report.20
5.4 RST contact.20
5.4.1 Apparatus.20
5.4.2 Procedure.20
5.4.3 Test report.21
5.5 SPU (C6) contact .21
6 Test methods for logical operations of cards with contacts .21
6.1 Answer to Reset (ATR).21
6.1.1 Cold Reset and Answer-to-Reset (ATR).21
6.1.2 Warm Reset.22
6.2 T=0 Protocol.22
6.2.1 I/O transmission timing for T=0 protocol.22
6.2.2 I/O character repetition for T=0 protocol .23
6.2.3 I/O reception timing and error signaling for T=0 protocol .24
6.3 T=1 Protocol.25
6.3.1 I/O transmission timing for T=1 protocol.25
6.3.2 I/O reception timing for T=1 protocol .25
6.3.3 Character Waiting Time (CWT) behavior.26
6.3.4 card-reaction to IFD exceeding character waiting time (CWT).27
6.3.5 Block Guard time (BGT).27
6.3.6 Block sequencing by the card .28
© ISO/IEC 2010 – All rights reserved iii

6.3.7 Reaction of the card to protocol errors.31
6.3.8 Recovery of a transmission error by the card .31
6.3.9 Resynchronization.32
6.3.10 IFSD negotiation .33
6.3.11 Abortion by the IFD.34
7 Test methods for physical and electrical characteristics of the IFD.35
7.1 Activation of contacts .35
7.1.1 Apparatus .35
7.1.2 Procedure .35
7.1.3 Test report .35
7.2 VCC contact.36
7.2.1 Apparatus .36
7.2.2 Procedure .36
7.2.3 Test report .37
7.3 I/O contact .37
7.3.1 Apparatus .37
7.3.2 Procedure .37
7.3.3 Test report .39
7.4 CLK contact.39
7.4.1 Apparatus .39
7.4.2 Procedure .39
7.4.3 Test report .41
7.5 RST contact.41
7.5.1 Apparatus .41
7.5.2 Procedure .41
7.5.3 Test report .42
7.6 SPU (C6) contact.42
7.7 Deactivation of the contacts.42
7.7.1 Apparatus .42
7.7.2 Procedure .42
7.7.3 Test report .43
8 Test methods for logical operations of the IFD .43
8.1 Answer to Reset (ATR).43
8.1.1 Card Reset (cold reset) .43
8.1.2 card Reset (warm reset) .43
8.2 T=0 Protocol .44
8.2.1 I/O transmission timing for T=0 protocol .44
8.2.2 I/O character repetition for T=0 protocol.44
8.2.3 I/O reception timing and error signaling for T=0 protocol.45
8.3 T=1 Protocol .46
8.3.1 I/O transmission timing for T=1 protocol .46
8.3.2 I/O reception timing for T=1 protocol .47
8.3.3 IFD Character Waiting Time (CWT) behavior .48
8.3.4 IFD-reaction to card exceeding CWT.49
8.3.5 Block Guard time (BGT) .49
8.3.6 Block sequencing by the IFD.50
8.3.7 Recovery of a transmission error by the IFD.52
8.3.8 IFSC negotiation .53
8.3.9 Abortion by the card.53
8.4 IFD — Reaction of the IFD to invalid PCBs .54
8.4.1 Apparatus .54
8.4.2 Procedure .54
8.4.3 Test report .55

iv © ISO/IEC 2010 – All rights reserved

Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are members of
ISO or IEC participate in the development of International Standards through technical committees
established by the respective organization to deal with particular fields of technical activity. ISO and IEC
technical committees collaborate in fields of mutual interest. Other international organizations, governmental
and non-governmental, in liaison with ISO and IEC, also take part in the work. In the field of information
technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of the joint technical committee is to prepare International Standards. Draft International
Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as
an International Standard requires approval by at least 75 % of the national bodies casting a vote.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights.
ISO/IEC 10373-3 was prepared by Joint Technical Committee ISO/IEC JTC 1, Information technology,
Subcommittee SC 17, Cards and personal identification.
This second edition cancels and replaces the first edition (ISO/IEC 10373-3:2001), which has been technically
revised.
ISO/IEC 10373 consists of the following parts, under the general title Identification cards — Test methods:
⎯ Part 1: General characteristics
⎯ Part 2: Cards with magnetic stripes
⎯ Part 3: Integrated circuit cards with contacts and related interface devices
⎯ Part 5: Optical memory cards
⎯ Part 6: Proximity cards
⎯ Part 7: Vicinity cards
⎯ Part 8: USB-ICC
The following part is under preparation:
⎯ Part 9: Optical memory cards: Holographic recording method

© ISO/IEC 2010 – All rights reserved v

INTERNATIONAL STANDARD ISO/IEC 10373-3:2010(E)

Identification cards — Test methods —
Part 3:
Integrated circuit cards with contacts and related interface
devices
1 Scope
This part of ISO/IEC 10373 defines test methods for characteristics of integrated circuit cards with contacts
and related interface devices according to the definition given in ISO/IEC 7816. Each test method is
cross-referenced to one or more base standards, which can be ISO/IEC 7810 or one or more of the
supplementary International Standards that define the information storage technologies employed in
identification card applications.
NOTE Criteria for acceptability do not form part of this part of ISO/IEC 10373 but will be found in the International
Standards mentioned above.
This part of ISO/IEC 10373 defines test methods which are specific to integrated circuit technology with
contacts. ISO/IEC 10373-1 defines test methods which are common to one or more card technologies and
other parts define other technology-specific tests.
Test methods defined in this part of ISO/IEC 10373 are intended to be performed separately and
independently. A given card is not required to pass through all the tests sequentially. The test methods
defined in this part of ISO/IEC 10373 are based on ISO/IEC 7816-3.
Conformance of cards and IFDs determined using the test methods defined in this part of ISO/IEC 10373
does not preclude failures in the field. Reliability testing is outside the scope of this part of ISO/IEC 10373.
This part of ISO/IEC 10373 does not define any test to establish the complete functioning of integrated circuit
cards. The test methods require only that the minimum functionality be verified. Minimum functionality is
defined as follows.
⎯ Any integrated circuit present in the card continues to show an Answer to Reset response which
conforms to the base standard.
⎯ Any contacts associated with any integrated circuit present in the card continue to show electrical
resistance which conforms to the base standard.
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
ISO/IEC 7810:2003, Identification cards — Physical characteristics
ISO/IEC 7816-3:2006, Identification cards — Integrated circuit cards — Part 3: Cards with contacts —
Electrical interface and transmission protocols
© ISO/IEC 2010 – All rights reserved 1

ISO/IEC 7816-4:2005, Identification cards — Integrated circuit cards — Part 4: Organization, security and
commands for interchange
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
card
integrated circuit card with contacts as defined in ISO/IEC 7816
3.2
DUT
device under test
card or IFD that is subject to testing
3.3
etu-factor
parameters negotiable by protocol and parameters selection (PPS), described in ISO/IEC 7816-3:2006, 6.3.1
3.4
IFD
interface device related to integrated circuit cards with contacts as defined in ISO/IEC 7816-3
3.5
normal use
use as an identification card, as defined in ISO/IEC 7810:2003, 4.1, involving equipment processes
appropriate to the card technology and storage as a personal document between equipment processes
3.6
test method
method for testing characteristics of identification cards and related interface devices for the purpose of
confirming their compliance with International Standards
3.7
test scenario
defined typical protocol and application specific communication to be used with the test methods defined in
this part of ISO/IEC 10373
3.8
typical protocol and application specific communication
communication between a DUT and the corresponding test-apparatus based on protocol and application
implemented in the DUT and representing its normal use
4 General items applicable to the test methods
4.1 Test environment
Unless otherwise specified, testing of physical, electrical and logical characteristics shall take place in an
environment of temperature 23 °C ± 3 °C, of relative humidity 40 % to 60 %.
4.2 Pre-conditioning
Where pre-conditioning is required by the test method, the identification cards to be tested shall be
conditioned to the test environment for a period of 24 h before testing unless otherwise specified.
2 © ISO/IEC 2010 – All rights reserved

4.3 Selection of test methods
Tests shall be applied as required to test the attributes of the card defined by the relevant base standard
(see 4.8).
4.4 Default tolerance
Unless otherwise specified, a default tolerance of ± 5 % shall be applied to the quantity values given to specify
the characteristics of the test equipment (e.g. linear dimensions) and the test method procedures (e.g. test
equipment adjustments).
4.5 Total measurement uncertainty
The total measurement uncertainty for each quantity determined by these test methods shall be stated in the
test report.
4.6 Conventions for electrical measurements
Potential differences are defined with respect to the GND contact of the card and currents flowing to the card
are considered positive.
4.7 Apparatus
4.7.1 Apparatus for testing the integrated circuit cards with contacts (card-test-apparatus)
4.7.1.1 Generating the VCC voltage (U ) and timing
CC
Table 1 — voltage and timing for VCC
Parameter Operating Condition Range Accuracy
U Class A, B, C -1 V to 6 V
± 20 mV
CC
t , t
Class A, B, C 0 µs to 500 µs ± 100 µs
R F
4.7.1.2 Measuring ICC
Table 2 — I parameters
CC
Characteristic Mode Range Accuracy Resolution
Spike Measurement 0 mA to 200 mA ± 2 mA 20 ns
I
Active mode 0 mA to 100 mA ± 1 mA Averaged over 1 ms
CC
Clock stop 0 µA to 200 µA ± 10 µA Averaged over 1 ms

4.7.1.3 Generating SPU (C6) voltage
See 5.5 and ISO/IEC 7816-3.
© ISO/IEC 2010 – All rights reserved 3

4.7.1.4 Generating the RST voltage and timing
Table 3 — RST voltage and timing
Parameter Operating Condition Range Accuracy
U U Class A, B -1 V to 6 V
± 20 mV
IH, IL
U Class C -1 V to 2 V ± 20 mV
IH
U Class C -1 V to 1 V ± 20 mV
IL
t , t
0 µs to 2 µs ± 20 ns
R F
NOTE t and t are generated between 10% and 90% of V min and V max values.
R F H L
4.7.1.5 Measuring the RST current
Table 4 — RST current
Characteristic Mode Range Accuracy Resolution
I Active -30 µA to 200 µA 100 ns
± 10 µA
IH
I Active -200 µA to 30 µA ± 10 µA 100 ns
IL
4.7.1.6 Generating the I/O voltage and timing in reception mode
Table 5 — I/O voltage and timing
Parameter Mode Operating Condition Range Accuracy
Card: Reception,
U U Apparatus: Class A, B -1 V to 6 V
± 20 mV
IH, IL
Transmission
Card: Reception,
U Apparatus: Class C -1 V to 2 V ± 20 mV
IH
Transmission
Card: Reception,
U Apparatus: Class C -1 V to 1 V
± 20 mV
IL
Transmission
Card: Reception,
t , t Apparatus: 0 µs to 2 µs ± 100 ns
R F
Transmission
NOTE ─ t and t are generated between 10% and 90% of V min and V max values.
R F H L
4 © ISO/IEC 2010 – All rights reserved

4.7.1.7 Measuring the I/O current in reception mode
Table 6 — I/O current (reception mode)
Parameter Mode Range Accuracy Resolution
Card: Reception,
I Apparatus: -300 µA to 30 µA ± 10 µA 100 ns
IH
Transmission
Card: Reception,
Apparatus: -1,5 mA to -0,2 mA 100 ns
± 50 µA
Transmission
I
IL
Card: Reception,
Apparatus: -200 µA to 30 µA ± 10 µA 100 ns
Transmission
4.7.1.8 Generating the I/O current
Table 7 — I/O current
Stabilization time
Parameter Mode Range Accuracy after level is
reached
20 kΩ pull-up to
Card: Transmission
I
VCC or equivalent ± 200 Ω
OH
Apparatus: Reception
circuit
Card: Transmission
I 0 mA to 1,5 mA ± 50 µA < 100 ns
OL
Apparatus: Reception
4.7.1.9 Measuring the I/O voltage and timing
Table 8 — I/O voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U U Class A, B, C -1 V to 6 V ± 20 mV 20 ns
IH, IL
t , t 0 µs to 2 µs ± 20 ns
R F
NOTE ─ t and t are measured between 10% and 90% of V min and V max values.
R F H L
© ISO/IEC 2010 – All rights reserved 5

4.7.1.10 Generating the CLK voltage
Table 9 — CLK voltage
Parameter Operating Condition Range Accuracy Resolution
U U Class A, B -1 V to 6 V 20 ns
± 20 mV
IH, IL
U Class C -1 V to 2 V 20 ns
± 20 mV
IH
U Class C -1 V to 2 V ± 20 mV 20 ns
IL
4.7.1.11 Generating the CLK waveforms (single cycle measurement)
Table 10 — CLK waveforms
Parameter Range Accuracy
Duty cycle 35 % to 65 % of period
± 5 ns
Frequency 0,5 MHz to 5,5 MHz ± 5 kHz
Frequency 5 MHz to 20,5 MHz ± 50 kHz
t , t 1 % to 10 % of period
± 5 ns
R F
NOTE ─ t and t are generated between 10% and 90% of V (100%) min and V (0%) max.
R F H L
4.7.1.12 Measuring the CLK current
Table 11 — CLK current
Characteristic Mode Range Accuracy Resolution
I active -30 µA to 150 µA ± 10 µA 20 ns
IH
I active -150 µA to 30 µA 20 ns
± 10 µA
IL
4.7.1.13 Measuring the contact capacitance of RST, CLK and I/O
Table 12 — Contact capacitance
Characteristic Range Accuracy
C 0 pF to 50 pF ± 5 pF
The contact capacitance of a contact shall be measured between the
contact and the GND contact.
6 © ISO/IEC 2010 – All rights reserved

4.7.1.14 Generating the sequence of the activation and deactivation of the contacts
Table 13 — Activation and deactivation
Range of switching the
Accuracy
signals
0 s to 1 s
± 200 ns (or 1 CLK period, whichever is smaller)

4.7.1.15 Emulating the I/O protocol
The card-test-apparatus shall be able to emulate the protocol T=0 and T=1 and IFD applications which are
required to run the typical application specific communications corresponding to the card applications.
NOTE ─ If a specific functionality is not implemented in the card, the card-test-apparatus is not required to have the
corresponding test-capability (e.g. T=1 protocol not implemented in the card).
4.7.1.16 Generating the I/O character timing in reception mode
The card-test-apparatus shall be able to generate the I/O bit stream according to ISO/IEC 7816-3.
All timing parameters like start bit length, guard time, error signaling etc. shall be configurable.
Table 14 — I/O character timing (reception mode)
Symbol Parameter Accuracy
ε all timing parameters ± 4 CLK cycles
t
4.7.1.17 Measuring and monitoring the I/O protocol
The card-test-apparatus shall be able to measure and monitor the timing of the logical low and high states of
the I/O-line relative to the CLK-frequency.
Table 15 — Timing characteristics
Characteristic Accuracy
all timing characteristics
± 2 CLK cycles
4.7.1.18 Protocol Analysis
The card-test-apparatus shall be able to analyze the I/O-bit stream in accordance to T=0 and T=1 protocol
according to ISO/IEC 7816-3 and extract the logical data flow for further protocol and application verifications.
NOTE If a specific functionality is not implemented in the card, the card-test-apparatus is not required to have the
corresponding test-capability (e.g. T=1 protocol not implemented in the card). Conversely, an apparatus may need
extended capabilities, e.g. being able to generate any case 2 command (see ISO/IEC 7816-4:2005) if a card does not
support the standard READ BINARY.
© ISO/IEC 2010 – All rights reserved 7

4.7.2 Apparatus for testing the interface device (IFD-test-apparatus)
4.7.2.1 Generating the VCC current (I )
CC
Table 16 — VCC current
Stabilization time
Parameter Mode Range Accuracy after level is
reached
b
Spike Generation 0 mA to 120 mA ± 2 mA < 100 ns
Active mode 0 mA to 70 mA ± 1 mA < 100 ns
I
CC
Idle mode (CLK-Stop) 0 mA to 1,2 mA < 100 ns
± 10 µA
a
-1,2 mA to 0 mA < 100 ns
Inactive ± 10 µA
t , t 100 ns ± 50 ns
R F
pulse length 100 ns to 500 ns ± 50 ns
pause length
100 ns to 1000 ns
± 50 ns
frequently
pause length
10 µs to 2000 µs ± 1 µs
randomly
a
The maximum output voltage shall be limited to 5 V.
b
Dynamic conditions for spike generation.

4.7.2.2 Measuring the VCC voltage (U ) and timing
CC
Table 17 — VCC voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U Class A, B, C - 1 V to 6 V ± 20 mV 10 ns
CC
4.7.2.3 Measuring the SPU (C6) voltage (U ) and timing
CC
Table 18 — SPU voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U Class A, B, C - 1 V to 6 V 10 ns
± 20 mV
CC
8 © ISO/IEC 2010 – All rights reserved

4.7.2.4 Generating the RST current
Table 19 — RST current
Stabilization time
Parameter Mode Range Accuracy after level is
reached
I active - 30 µA to 200 µA < 100 ns
± 10 µA
IH
I active - 250 µA to 30 µA < 100 ns
± 10 µA
IL
a
I  inactive - 1,2 mA to 0 mA ± 10 µA < 100 ns
a
The output voltage shall be limited from -0,5 V to 5,5 V.

4.7.2.5 Measuring RST voltage and timing
Table 20 — RST voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U U Class A, B, C -1 V to 6 V 20 ns
± 20 mV
IH, IL
t , t 0 µs to 2 µs ± 20 ns
R F
NOTE ─ t and t are measured between 10% and 90% of V min and V max values.
R F H L
4.7.2.6 Generating the I/O currents
Table 21 — I/O currents
Stabilization time
Parameter Mode Range Accuracy after level is
reached
Apparatus: Reception
and Transmission
I , I -400 µA to 50 µA ± 5 µA < 100 ns
IH OH
IFD: Transmission and
Reception
Apparatus: Reception
I IFD: Transmission and 0 mA to 1,5 mA ± 10 µA < 100 ns
IL
Reception
I IFD: Reception 0 µA to 1200 µA ± 10 µA < 100 ns
OL
a
I Inactive - 1,2 mA to 0 mA ± 10 µA < 100 ns
a
The output voltage shall be limited to -0,5 V to 5,5 V.

© ISO/IEC 2010 – All rights reserved 9

4.7.2.7 Measuring the I/O voltage and timing
Table 22 — I/O voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U U Class A, B, C -1 V to 6 V 20 ns
± 20 mV
IH, IL
t , t 0 µs to 2 µs ± 20 ns
R F
NOTE ─ t and t are measured between 10% and 90% of V min and V max values.
R F H L
4.7.2.8 Generating the I/O voltage and timing in transmission mode
Table 23 — I/O voltage and timing (transmission mode)
Parameter Mode Operating Condition Range Accuracy
IFD: Reception,
U U Apparatus: Class A, B -1 V to 6 V
± 20 mV
IH, IL
Transmission
IFD: Reception,
U Apparatus: Class C -1 V to 2 V ± 20 mV
IH
Transmission
IFD: Reception,
U Apparatus: Class C -1 V to 1 V
± 20 mV
IL
Transmission
IFD: Reception,
t , t Apparatus: 0 µs to 2 µs ± 100 ns
R F
Transmission
NOTE ─ t and t are generated between 10% and 90% of V min and V max values.
R F H L
4.7.2.9 Measuring the I/O current in transmission mode
Table 24 — I/O current (transmission mode)
Parameter Mode Range Accuracy Resolution
I Transmission 0 µA to 1200 µA 20 ns
± 10 µA
OL
a
I Inactive 0 mA to 1,2 mA ± 10 µA 20 ns
a
The output voltage shall be limited to - 0,5 V to 5,5 V.

10 © ISO/IEC 2010 – All rights reserved

4.7.2.10 Generating the CLK current
Table 25 — CLK current
Stabilization time
Parameter Mode Range Accuracy after level is
reached
I active -30 µA to 150 µA < 20 ns
± 10 µA
IH
I active -150 µA to 30 µA < 20 ns
± 10 µA
IL
a
I inactive -1,2 mA to 0 mA ± 10 µA < 100 ns
a
The output voltage shall be limited to -0,5 V to 5,5 V.

4.7.2.11 Measuring the CLK voltage and timing
Table 26 — CLK voltage and timing
Characteristic Operating Condition Range Accuracy Resolution
U U Class A, B, C -1 V to 6 V 20 ns
± 20 mV
IH, IL
4.7.2.12 Measuring the CLK waveforms (single cycle measurement)
Table 27 — CLK waveforms
Characteristic Range Accuracy
a
Duty cycle 35 % to 65 % of period ± 2,5 % of period
b
Frequency 0,5 MHz to 20,5 MHz
± 2,5 % of period
c
t , t 1 % to 10 % of period
± 2,5 % of period
R F
The IFD-test-apparatus shall be able to check every cycle during the measurement.
a
Duty cycle shall be measured from 50% to 50% of V min (100%) and V max (0%) rising edge to rising edge.
H L
b
Frequency shall be measured from 50% to 50% of the leading edges of two adjacent clock-cycles of V min (100%) and V
H L
max (0%) rising edge to rising edge.
c
t and t shall be measured between 10% and 90% of V (100%) min and V (0%) max.
R F H L
4.7.2.13 Measuring the contact capacitance between GND and I/O
Table 28 — Contact capacitance
Characteristic Range Accuracy
C 0 pF to 50 pF ± 5 pF
© ISO/IEC 2010 – All rights reserved 11

4.7.2.14 Emulating the I/O protocol
The IFD-test-apparatus shall be able to emulate the protocol T=0 and T=1 and card applications which are
required to run the Test Scenario.
NOTE If a specific functionality is not implemented in the card, the card-test-apparatus is not required to have the
corresponding test-capability (e.g. T=1 protocol not implemented in the card).
4.7.2.15 Generating the I/O character timing in transmission mode
The Test IFD-test-apparatus shall be able to generate the I/O bit stream according to ISO/IEC 7816-3 relative
to the CLK-frequency.
All timing parameters like start bit length, guard time and error signaling etc. shall be configurable.
Table 29 — Timing parameters
Symbol Parameter Accuracy
all timing parameters
ε ± 4 CLK cycles
t
4.7.2.16 Measuring and monitoring the I/O protocol
The IFD-test-apparatus shall be able to measure and monitor the timing of the logical low and high states of
the I/O-line relative to the CLK-frequency.
Table 30 — Timing characteristics
Characteristic Accuracy
all timing characteristics ± 2 CLK cycles

4.7.2.17 Protocol Analysis
The Test IFD-test-apparatus shall be able to analyze the I/O-bit stream in accordance to T=0 and T=1 protocol
according to ISO/IEC 7816-3 and extract the logical data flow for further protocol and application verifications.
NOTE ─ If a specific functionality is not implemented in the card, the IFD-test-apparatus is not required to have the
corresponding test-capability (e.g. T=1 protocol not implemented in the card).
4.7.2.18 Overall Impedance (current and voltage sources inactive)
Table 31 — Impedeance
Contact Resistance Accuracy Capacity Accuracy
VCC 30 pF ± 6 pF
10 kΩ ± 1 kΩ
I/O 30 pF ± 6 pF
50 kΩ ± 5 kΩ
RST 50 kΩ ± 5 kΩ 30 pF ± 6 pF
CLK 50 kΩ ± 5 kΩ 30 pF ± 6 pF
12 © ISO/IEC 2010 – All rights reserved

4.7.3 Test Scenario
Testing of the DUT as defined in Clauses 6, 7, 8 and 9 requires a Test Scenario to be executed. This Test
Scenario is a ’typical protocol and application specific communication’, dependent from the protocol and
application specific functionality foreseen for the normal use of and implemented in the DUT.
The Test Scenario shall be defined by the entity carrying out these tests and shall be documented with the
test-results. The Test Scenario shall encompass a representative subset or preferably, if practical, the full
functionality of the DUT expected to be utilized during normal use. The Test Scenario shall have a duration of
at least 1 s.
NOTE ─ The testing entity may require information about the implemented protocol and functionality as well as the
intended use of the DUT to enable the testing entity to define a Test Scenario.
4.8 Relationship of test methods versus base standard requirements
All relative voltage definitions (e.g. 0,7 × U , 0,15 × U or U + 0,3 V) shall be determined relative to GND
CC CC CC
and checked against the simultaneously measured value of U .
CC
Table 32 — Test methods for electrical characteristics of cards with contacts
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
5.1 VCC contact ISO/IEC 7816-3:2006 5.2.1
5.2 I/O contact ISO/IEC 7816-3:2006 5.2.5
5.3 CLK contact ISO/IEC 7816-3:2006 5.2.3
5.4 RST contact ISO/IEC 7816-3:2006 5.2.2
5.5 SPU (C6) contact ISO/IEC 7816-3:2006 5.2.4

Table 33 — Test methods for logical operations of cards with contacts — Answer to reset
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
6.1.1 Cold Reset and Answer-to-Reset (ATR) ISO/IEC 7816-3:2006 6.2.1, 6.2.2, 7, 8
6.1.2 Warm Reset ISO/IEC 7816-3:2006 6.2.3

© ISO/IEC 2010 – All rights reserved 13

Table 34 — Test methods for logical operations of cards with contacts — T=0 Protocol
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
6.2.1 I/O transmission timing for T=0 protocol ISO/IEC 7816-3:2006 7.1, 7.2, 10.2
6.2.2 I/O character repetition for T=0 protocol ISO/IEC 7816-3:2006 7.3, 10.2
I/O reception timing and error signaling for T=0 7.1, 7.2, 7.3,
6.2.3 ISO/IEC 7816-3:2006
protocol 10.2
Table 35 — Test methods for logical operations of cards with contacts — T=1 Protocol
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
7.1, 7.2, 8.3,
6.3.1 I/O transmission timing for T=1 protocol ISO/IEC 7816-3:2006 11.2, 11.3,
11.4.2, 11.4.3
7.1, 7.2, 8.3,
11.2, 11.3,
6.3.2 I/O reception timing for T=1 protocol ISO/IEC 7816-3:2006
11.4.2, 11.4.3
6.3.3 Character Waiting Time (CWT) behavior ISO/IEC 7816-3:2006 11.4.3
card-reaction to IFD exceeding character waiting
6.3.4 ISO/IEC 7816-3:2006 11.4.3
time (CWT)
6.3.5 Block Guard time (BGT) ISO/IEC 7816-3:2006 11.4.3
6.3.6 Block sequencing by the card ISO/IEC 7816-3:2006 11.6.3
6.3.7 Reaction of the card to protocol errors ISO/IEC 7816-3:2006 11.6.3
6.3.8 Recovery of a transmission error by the card ISO/IEC 7816-3:2006 11.6.3
6.3.9 Resynchronization ISO/IEC 7816-3:2006 11.6.3
6.3.10 IFSD negotiation ISO/IEC 7816-3:2006 11.4.2
6.3.11 Abortion by the IFD ISO/IEC 7816-3:2006 11.6.3

14 © ISO/IEC 2010 – All rights reserved

Table 36 — Test methods for physical and electrical characteristics of the IFD
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
7.1 Activation of contacts ISO/IEC 7816-3:2006 6.1, 6.2.1, 6.2.2
7.2 VCC contact ISO/IEC 7816-3:2006 5.2.1
7.3 I/O contact ISO/IEC 7816-3:2006 5.2.5
7.4 CLK contact ISO/IEC 7816-3:2006 5.2.3
7.5 RST contact ISO/IEC 7816-3:2006 5.2.2
7.6 SPU (C6) contact ISO/IEC 7816-3:2006 5.2.4
7.7 Deactivation of the contacts ISO/IEC 7816-3:2006 6.4

Table 37 — Test methods for logical operations of the IFD — Answer to reset
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
8.1.1 Card Reset (cold reset) ISO/IEC 7816-3:2006 6.2.2
8.1.2 card Reset (warm reset) ISO/IEC 7816-3:2006 6.2.3

Table 38 — Test methods for logical operations of the IFD — T=0 Protocol
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
8.2.1 I/O transmission timing for T=0 protocol ISO/IEC 7816-3:2006 7.1, 7.2, 10.2
8.2.2 I/O character repetition for T=0 protocol ISO/IEC 7816-3:2006 7.3, 10.2
I/O reception timing and error signaling for T=0 7.1, 7.2, 7.3,
8.2.3 ISO/IEC 7816-3:2006
protocol 10.2
© ISO/IEC 2010 – All rights reserved 15

Table 39 — Test methods for logical operations of the IFD — T=1 Protocol
Test method from ISO/IEC 10373-3 Corresponding Requirement
Clause Name Base Standard Clause(s)
7.1, 7.2, 8.3,
8.3.1 I/O transmission timing for T=1 protocol ISO/IEC 7816-3:2006 11.2, 11.3,
11.4.2, 11.4.3
7.1, 7.2, 8.3,
8.3.2 I/O reception timing for T=1 protocol ISO/IEC 7816-3:2006 11.2, 11.3,
11.4.2, 11.4.3
8.3.3 IFD Character Waiting Time (CWT) behavior ISO/IEC 7816-3:2006 11.4.3
8.3.4 IFD-reaction to card exceeding CWT ISO/IEC 7816-3:2006 11.4.3
Block Guard time (BGT)
8.3.5 ISO/IEC 7816-3:2006 11.4.3
8.3.6 Block sequencing by the IFD ISO/IEC 7816-3:2006 11.6.3
8.3.7 Recovery of a transmission error by the IFD ISO/IEC 7816-3:2006 11.6.3
8.3.8 IFSC negotiation ISO/IEC 7816-3:2006 11.4.2
8.3.9 Abortion by the card ISO/IEC 7816-3:2006 11.6.3

5 Test methods for el
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