IEC PAS 62240:2001

IEC/PAS 62240
Edition 1.0
2001-04
PRE-STANDARD
Use of semiconductor devices
outside manufacturers' specified
temperature ranges
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62240
C O MMI S S I O N
Contents
INTRODUCTION .5

1. SCOPE.5

2. REFERENCES .6

2.1 NORMATIVE REFERENCES .6

2.2 INFORMATIVE REFERENCES.6

3. TERMS AND DEFINITIONS.6

4. OBJECTIVES.8
5. USING DEVICES OUTSIDE THE MANUFACTURER'S SPECIFIED TEMPERATURE
RANGES .8
5.1 DEVICE SELECTION, USAGE AND ALTERNATIVES .8
5.2 DEVICE CAPABILITY ASSESSMENT.9
5.3 DEVICE QUALITY ASSURANCE IN WIDER TEMPERATURE RANGES.12
5.4 DOCUMENTATION.13
5.5 DEVICE IDENTIFICATION .14
ANNEX A. DEVICE PARAMETER RE-CHARACTERIZATION .17
A.1 GLOSSARY OF SYMBOLS.17
A.2 RATIONALE FOR PARAMETER RE-CHARACTERIZATION .18
A.3 CAPABILITY ASSURANCE .19
A.4 QUALITY ASSURANCE .26
A.5 FACTORS TO BE CONSIDERED IN PARAMETER RE-CHARACTERIZATION.26
A.6 REFERENCES .28
ANNEX B - STRESS BALANCING.31
B.1 INTRODUCTION.31
B.2 GLOSSARY OF SYMBOLS.31
B.3 STRESS BALANCING .31
B.4 APPLICATION EXAMPLE .35
B.5 OTHER NOTES .39
ANNEX C: PARAMETER CONFORMANCE ASSESSMENT.42
C.1 INTRODUCTION.42
C.2 TEST PLAN .42
ANNEX D - HIGHER ASSEMBLY LEVEL TESTING .49
D.1 INTRODUCTION.49
D.2 PROCESS.49

Figures
Figure 1: Flow Chart for Semiconductor Devices in Wider Temperature Ranges .15
Figure 2: Report Form for Documenting Device Usage In Wider Temperature Ranges.16
Figure 3: Parameter re-characterization.19
Figure 4: Flow diagram of parameter re-characterization capability assurance process .21
Figure 5: Margin in electrical parameter measurement based on the results of sample test.24
Figure 6: Schematic diagram of parameter limit modifications .25
Figure 7: Parameter Re-Characterization Part Quality Assurance.26
– 2 –
Figure 8: Schematic of outlier products that may invalidate sample testing .27

Figure 9: Example of intermediate peak of electrical parameter.28

Figure 10: Report Form for Documenting Device Parameter Re-Characterization.30

Figure 11: Iso-TJ curve: the relationship between ambient temperature and disspated power .33

Figure 12: Graph of electrical parameters vs. dissipated power.35

Figure 13: Iso-TJ curve for the Fairchild MM74HC244 .38

Figure 14: Power vs. frequency curve for the Fairchild MM74HC244.39

Figure 15: Flow Chart for Stress Balancing .40

Figure 16: Report Form for Documenting Stress Balancing .41
Figure 17: Relationship of Temperature Ratings, Requirements and Margins.43
Figure 18: Typical Fallout Distribution versus T .35
req-max
Figure 19: Parameter Conformance Testing Flow.47
Figure 20: Report Form for Documenting Parameter Conformance Testing .48
Figure 21: Flow Chart of Higher Level Assembly Testing .50
Figure 22: Report Form for Documenting Higher Level Assembly Test at Temperature Extremes.51

– 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
USE OF SEMICONDUCTOR DEVICES OUTSIDE MANUFACTURERS'

SPECIFIED TEMPERATURE RANGE
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to
promote international co-operation on all questions concerning standardization in the electrical and
electronic fields. To this end and in addition to other activities, the IEC publishes International Standards.
Their preparation is entrusted to technical committees; any IEC National Committee interested in the
subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates
closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has
representation from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the
form of standards, technical specifications, technical reports or guides and they are accepted by the
National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC
International Standards transparently to the maximum extent possible in their national and regional
standards. Any divergence between the IEC Standard and the corresponding national or regional standard
shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for
any equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the
subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
This PAS Pre-Standard has been published using a rapid procedure as a result of
technical consensus at the level of experts working on the subject within the IEC. The
normal IEC procedure for the preparation of an International Standard is pursued in
parallel and this Pre-Standard will be withdrawn upon publication of the corresponding
International Standard.
IEC-PAS 62240 has been processed by IEC technical committee 107: Process
management for avionics.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
107/3/PAS 107/8/RVD
Full information on the voting for the approval of this PAS Pre-Standard can be found in
the report on voting indicated in the above table.
– 4 –
Introduction
Traditionally, industries that produce electronic equipment for rugged applications have relied on

the military specification system for semiconductor device standards; and upon manufacturers of

military-specified devices as device sources. This assured the availability of semiconductor

devices specified to operate over the temperature ranges required for electronic equipment in

rugged applications. Many device manufacturers have exited the military market in recent years,

resulting in decreased availability of devices specified to operate over wide temperature ranges.

Following are some typical temperature ranges at which devices are marketed:

Military: -55°C to +125°C
Automotive:
-40°C to +125°C
Industrial:
-40°C to +85°C
Commercial:
0°C to +70°C
If there are no reasonable or practical alternatives, then a potential response is for equipment
manufacturers to use devices in temperature ranges that are wider than those specified by the device
manufacturer. If properly documented and controlled, this practice may be used by electronic
equipment manufacturers to meet the design goals of their equipment.
This document prescribes practices and procedures to select semiconductor devices; to assess their
capability to operate; and to assure their intended quality in the wider temperature ranges. It also
prescribes the documentation of such usage.
1. Scope
This document prescribes processes for using semiconductor devices in wider temperature ranges
than those specified by the device manufacturer. It applies to any designer or manufacturer of
equipment intended to operate under conditions that require semiconductor devices to function in
temperature ranges beyond those for which the devices are marketed.
This document is intended for applications in which only the performance of the device is an issue.
Even though the device is used at wider temperatures, the wider temperatures will be limited to
those that do not compromise the system performance or application-specific reliability of the
device in the application. Specifically, this document is not intended for applications that require

the device to function at an operating or environmental stress level that significantly increases the
risk of catastrophic device failure, loss of equipment function, or unstable operation of the device.
The use of devices outside the parameters specified by the device manufacturer is discouraged;
however, such usage may occur if other options prove to be impossible, unreasonable, or
impractical.
Note: Alternate means of thermal uprating may have been performed prior to the implementation of this document
by the equipment manufacturer. Rationale for decisions made may have been valid considering the application,
semiconductor market conditions, experience with the particular component manufacturer, etc. at the times these
decisions were made. Field performance using these methods also may validate their use, however, their continued
use must take into account the risk of changes to the subject devices such as feature size reductions, material
changes, etc.
– 5 –
2. References
2.1 Normative References
Not applicable.
2.2 Informative References
IEC PAS, Electronic Component Management Plans.

I EC 60134, Rating Systems for Electronic Tubes and Valves and Analogous Semiconductor

Devices (1st Edition, 1961).
3. Terms and Definitions
Note: The terms uprating and thermal uprating are being used increasingly in avionics industry discussions and
meetings, and clear definitions are included in this clause. They were coined as shorthand references to a special
case of methods commonly used in selecting components for circuit design. This document describes the methods
and processes for implementing this special case. All of the elements of these processes employ existing,
commonly used engineering practices. No new or unique engineering knowledge is required to follow these
processes: only a rigorous application of the overall approach.
The following terms and definitions are used herein and/or should be used when using devices
outside the manufacturers' specified temperature ranges:
Absolute maximum ratings are limiting values of operating and environmental conditions applicable
to any semiconductor device of a specific type as defined by its published data, which should not be
exceeded under the worst possible conditions. These values are chosen by the device manufacturer
to provide acceptable serviceability of the device, taking no responsibility for equipment variations,
and the effects of changes in operating conditions due to variations in the characteristics of the
device under consideration and all other electronic devices in the equipment. (From IEC 134, 1st
Edition 1961).
Ambient temperature is the temperature of the environment in which a semiconductor device is
operating.
Case temperature is the temperature of the surface of a semiconductor device package during
operation.
Circuit Element Functional Mode Analysis: A documented analysis that determines minimums,
ranges and maximums of all functional characteristics of the assembly with respect to the related
functional parameters of devices being uprated.
Device capability assessment is the process of demonstrating that the device design is capable of

providing the specified functionality, over the wider temperature range, for the required length of
time. It assumes that the device has been qualified to operate within its specified temperature range,
and includes additional testing or analysis to evaluate expected performance at the wider
temperature range. Device capability assessment includes both performance and application-
specific reliability.
Device quality assurance over the wider temperature range is the additional testing or analysis
required to assure that each individual device is capable of operating successfully in the required
wider temperature range.
ECMP are the initials for Electronic Component Management Plan.
Semiconductor devices are electronic devices that are not subject to disassembly without destruction
or impairment of design use. They are sometimes called electronic parts or piece parts. Examples
are diodes, integrated circuits, and transistors.
– 6 –
Electronic equipment is any item, e.g., end item, sub-assembly, line-replaceable unit, shop-

replaceable unit, or system produced by an electronic equipment manufacturer.

Junction temperature is the temperature of the active region of the device in which the major part of

the heat is generated. (adapted from SEMATECH)

Manufacturer-specified parameter limits are the electrical parameter limits that are guaranteed by

the device manu facturer when a device is used within the recommended operating conditions (see

Rating).
Manufacturer-specified temperature range is the operating temperature range over which the device

manufacturer guarantees the electrical parameters of the device. (see Rating).

Note: Manufacturer-specified temperature range is a subset of the recommended operating conditions.
May indicates a course of action which is permissible within the limits of this document.
determined for specific values of environment and operation, and may be stated in any suitable
terms. (from IEC 60134).
Note: Limiting conditions may be either maxima or minima.
Parameter conformance assessment is a process for thermal uprating in which devices are tested to
assess their conformance to the manufacturer-specified parameter limits over the target temperature
range.
Parameter characterization is the process of determining the typical and limiting values of
electrical parameters by testing representative samples at room and extreme temperatures over the
manufacturer’s specified temperature range.
Parameter re-characterization is a process for thermal uprating in which the device parameters are
characterised over the target temperature range, leading to a possible re-specification of the
manufacturer-specified parameter limits.
Rating is a value that establishes either a limiting capability or a limiting condition for a
semiconductor device.
Recommended operating conditions are the ratings on a device within which its electrical
specifications are guaranteed. (see Rating).
Shall indicates a mandatory requirement to be followed in order to conform to this document.
Should indicates that, among several possibilities, one is recommended as particularly suitable,
without mentioning or excluding others; or that a certain course of action is preferred but not
necessarily required; or that (in the negative form) a certain course of action is deprecated but not
prohibited.
Stress balancing is a process for thermal uprating in which at least one of the device’s electrical
parameters is kept below its maximum allowable limit to reduce heat generation, thereby allowing
operation at a higher ambient temperature than that specified by the device manufacturer.
Target temperature range is the operating temperature range of the device in its required
application.
Thermal uprating is a process to assess the capability of a part to meet the performance
requirements of the application in which the device is used outside the manufacturer’s specified
temperature range. (see Uprating).
Uprating is a process to assess the capability of a device to meet the performance requirements of
the application in which the device is used outside the manufacturer’s specification range.
– 7 –
Wider temperature range is a target temperature range outside the manufacturer-specified

temperature range. It may include temperatures that are higher or lower than the manufacturer-

specified temperature range, or both.

Will expresses a declaration of intent.

4. Objectives
The objectives of this document are:

•  To ensure that device usage outside the manufacturers’ specified temperature ranges is done

only with appropriate justification; and

• To ensure that, if it is necessary to use devices outside the manufacturers’ specified temperature
ranges, it is done with documented and controlled processes that assure the integrity of the
equipment.
5. Using Devices Outside the Manufacturer's Specified Temperature
Ranges
Devices used outside the manufacturers specified temperature range shall be selected (5.1), their
capability is assessed (5.2), their quality is assured (5.3), and documented (5.4), as illustrated by the
flow chart of Figure 1.
Note: The headings of this clause are keyed to the actions and decisions of Figure 1.
5.1 Device Selection, Usage and Alternatives
The equipment manufacturer shall design so that, initially and throughout life, no absolute-
maximum value for the intended service is exceeded for any device under the worst probable
operating conditions with respect to supply voltage variation, equipment device variation,
equipment control adjustment, load variations, signal variation, environmental conditions, variation
in characteristics of the device under consideration and of all other electronic devices in the
equipment.
5.1.1 Device Technology
The technology of a device and its package shall be identified and understood in sufficient detail to
assess the likelihood and consequences of potential failure mechanisms. It is recommended that the
device manufacturer be consulted when a device is proposed for use outside manufacturers'
specified temperature range.
5.1.2 Compliance with the Electronic Component Management Plan
All devices considered for use in wider temperature ranges shall be compliant with the equipment
manufacturer’s ECMP. It is necessary for ECMP requirements to be met only for the temperature
range over which the device is specified, since requirements for wider temperatures are provided in
this Guide.
Note: IEC PAS Pre-Standard 62239 is recommended as a resource for an ECMP
The use of devices outside the temperature ranges specified by the device manufacturer is
discouraged; however, such usage may occur if other options prove to be impossible, unreasonable,
or impractical. Justification for such usage may be based on availability, functionality, or other
relevant criteria. In no case will such usage result in a design that:
– 8 –
Requires the device to operate at an operating or environmental stress level that significantly

increases the risk of catastrophic device failure, loss of equipment function, or unstable operation of

the device; or
Requires the device to operate beyond the device’s maximum junction temperature or any other

limiting temperature, as specified by the device manufacturer, or calculated directly from

parameters specified by the device manufacturer.

5.1.3 Alternatives
A review of alternatives shall be carried out prior to using a device outside the manufacturer’s

specified temperature range. If an alternative can be shown to be reasonable and practical then it

shall be selected. The results of the evaluation shall be documented.
Note: Examples of potential alternatives include:
• Using a device specified over the required temperature range, with the identical function, but
from a different manufacturer;
• Using a device specified over the required temperature range, with the identical function, but a
wider specified temperature range;
• Using a device specified over the required temperature range, with the identical function, but a
different package;
• Using a device specified over the required temperature range, that has slightly different
specified parameter limits, but which still meets the equipment design goals;
• Using a device with the identical function, but a specified temperature range that still meets the
application requirement;
• Using a device specified over the required temperature range, but a different function, and
compensating by making changes elsewhere in the equipment design;
• Modifying the device’s local operating environment, e.g., adding cooling, etc.;
• Modifying the equipment specified ambient temperature requirement, in co-operation with the
customer;
• Modifying the equipment operating or maintenance procedures, in co-operation with the
customer; and
• Negotiating with the device manufacturer to provide assurance over the wider temperature
range.
For most applications, the preferred device for use in a wider temperature range should be the one
for which the extension beyond the specified range is least.
Note: As an example of this requirement, consider the case in which the required ambient temperature is 92 °C, and
no device specified to operate above 85 °C is available. If the two available devices have specified maximum
temperatures of 70 °C and 85 °C, then the 85 °C device should, in the absence of other factors, be given preference
regarding temperature.
5.2 Device Capability Assessment
5.2.1 Device Package and Internal Construction Capability Assessment
Device qualification test data and other applicable data shall be analyzed to assure that they support
the operation of the device over the end use temperature range and that the package and internal
construction type used in device qualification is the same as that to be used in the end application.
– 9 –
Device qualification test data and other applicable data shall be analyzed to assure that the package

and internal construction can withstand the stresses resulting from wider temperature cycling

ranges, and that the package materials do not undergo deleterious phase changes or changes in

material properties in the wider temperatures.

5.2.2 Risk Assessment (Assembly Level)

A preliminary risk assessment is prudent at this point to help guide decisions regarding the

method(s) of capability assessment to be used, as well as how and when they should be applied.

Understanding the risks on an application-specific basis enables “risk informed” decision-making

and thereby a prediction of the impact of critical decisions.

The process for assessing risks should consider applicable factors associated with the use of devices
beyond the manufacturers specified temperature range. Risk factors in this assessment may include:
• Application criticality into which the device will be used.
• Consequences of failure at device, circuit and system level.
• Type or technology of device under consideration.
• Manufacturer data available for the device.
• Quality/reliability monitors employed by the manufacturer.
• Comprehensiveness of production assembly-level screens performed at extended temperature.
• Identification of both managed and unmanaged risks and cost models for each.
Details about the likelihood of occurrence, consequences of occurrence, and acceptable mitigation
approaches for each identified risk should be generated. Each risk normally falls into one of the
following categories:
• Functionality Risks – Risks for which the consequences of occurrence are loss of equipment,
loss of mission, or unacceptable performance. Functionality risks impair the product’s
capability to operate to the customer’s specification.
• Producibility Risks – Risks for which the consequences of occurrence are financial impacts
(reduction in profitability). Producibility risks determine the probability of successfully
manufacturing/fabricating the product (where “successfully” refers to some combination of
schedule, manufacturing yield, quantity and other factors).
Several approaches are possible, and each approach constitutes a unique mixture of risk mitigation
factors. The results of a preliminary risk assessment should provide insight and assistance to the

selection of a viable approach or approaches for establishing the capability of devices being used
outside the manufacturer’s specified temperature range.
5.2.2.1 Device Parameter Re-Characterization
Device parameter re-characterization consists of characterising the device parameters over a
temperature range beyond that specified by the device manufacturer and, as a result, re-specifying
some of the data sheet parameter values or tolerances in the wider temperature range. The device
then may be used in applications in which the newly specified parameters provide the required
functionality.
If device parameter re-characterization is chosen for capability assessment, then the process
described in Annex A shall be followed.
– 10 –
If device parameter re-characterization is chosen for capability assessment, it shall be used in

conjunction with a quality assurance process that includes device testing, as described in subclause

5.3.1.
5.2.2.2 Device Stress Balancing

Device stress balancing consists of operating the device at a temperature above that specified by the

device manufacturer; and compensating by reducing at least one of the other operating parameters,

e.g., power, speed, to the extent that the junction temperature remains below its maximum rating,

with acceptable specified margin.

If device stress balancing is chosen for capability assessment, then the process described in Annex

B shall be followed.
5.2.2.3 Device Parameter Conformance Assessment
If device parameter conformance is chosen for capability assessment, then the devices shall be
tested over the entire wider temperature range, according to the process described in Annex C.
Sampling procedures and failure criteria for device testing should be according to Annex C. Where
less than 100% are sampled then device testing also shall include testing at a higher level of
assembly over the entire wider temperature range.
5.2.2.4 Higher Assembly Level Testing at Temperature Extremes
Higher assembly level testing at temperature extremes consists of testing the device over the entire
wider temperature range, while the device is incorporated into a higher level of assembly.
If higher assembly level testing is chosen for capability assessment, then the process described in
Annex D shall be followed.
Note 1: A higher level of assembly may include a module, a printed circuit card, another sub-assembly, or the end
item.
Note 2: The intent of subclauses 5.2.2.3 and 5.2.2.4 is to ensure that, if testing is used to assess device capability,
then each device is tested at least once over its entire wider operating temperature range. Higher-assembly-level
testing results are applicable only to the design revision of the assembly. For other assembly revisions, additional
testing or analysis should be performed.
The following steps shall be followed:
1. Perform a Circuit Element Functional Mode Analysis to determine the device functions /
parameters to be tested in order to assure assembly functionality across the target temperature
range.
2. Review the assembly level test plan to determine its capability to test the parameters required
for successful operation in the assembly. If the test plan is not capable, and cannot be modified
to be capable, than this method of uprating is rejected for the application.
3. Conduct the test, analyze the results, and document the conclusions.
4. Insert instructions in the maintenance procedures to require full acceptance test over the target
temperature range after every maintenance action that involves replacement of an electronic
device, unless the maintenance manual provides adequate alternate procedures. This test should
be conducted at an assembly level at which the original capability assessment was done, or
higher.
– 11 –
5.2.3 Device Reliability Assurance

Device manufacturers generally qualify devices (including reliability assessment) using the same

processes, regardless of the temperature ranges for which they are specified. Generally, they do not

represent their products to have a guarantee of lifetime in any application, because they do not

know what the use conditions will be. Caution should be exercised when using past experience of

the device within the manufacturers specified temperature range to infer reliability outside of the

manufacturers specified temperature range.

New and/or accelerated failure mechanisms, which might be evident at the wider temperature range,

should be clearly identified and their effects on reliability established.

The following steps shall be followed:

1. Qualify the devices according the requirements of the user’s Electronic Component
Management Plan, as specified in 5.1.2 of this document; qualify electrical performance of the
devices over the intended range of operating and environmental conditions after a reliability
stress conditioning exposure that reflects the life cycle of the application; and determine a
margin, supported by analysis using adequate data from the intended application, between the
maximum operating junction temperature and the absolute maximum rated junction
temperature.
2. The absolute maximum rating of the junction temperature of the device as defined in clause 3 of
this document, with a default margin of 20°C should not be exceeded. Other margins may be
used if the device user has data to justify them.
Note: Device reliability can decrease as junction temperature, Tj, approaches maximum. This is a function of time
in application at that temperature. If the average Tj of the device is expected to approach maximum in the
application, the reliability impact should be addressed. Note also that many avionics applications specify a high
temperature environment in which the device is required to operate. The reliability impact on the device is not
driven by a thermal condition that is very seldom experienced.
5.3 Device Quality Assurance in Wider Temperature Ranges
Regardless of the process used to assure device capability, the quality assurance processes
documented in the equipment manufacturer’s ECMP shall be applied to the device.
5.3.1 Device Parameter Re-Characterization Testing
If Device Parameter Re-Characterization (5.2.2.1) is used for capability assessment, then the device
quality shall be assured by testing incoming devices according to a defined sampling plan and
effective supplier change notice monitoring.
Note: The intent of this guide-line is to monitor the devices to assure that, subsequent to the capability assurance

activity, no changes are made in the design or manufacturing processes of the device that will adversely affect its
capability in the wider temperature range.
5.3.2 Device Parameter Conformance Testing
If Device Parameter Conformance Assessment (5.2.2.3) or Higher Assembly Level Testing at
Temperature Extremes (5.2.2.4) is used for capability assessment, then the device quality shall be
assured through Device Parameter Conformance Testing (this section), Higher Level Assembly
Testing (5.3.3) or both, depending on the results of the risk assessment in 5.2.2. See Figure 1 for a
flow chart of this process. If this method is used for quality assurance, the device assessment
process shall be done initially by testing all individual devices before use in production equipment
or by temperature testing all production equipment at the temperature extremes.
– 12 –
Based on data derived from such testing, testing may be reduced or eliminated by satisfactory test

history and by effective supplier change notice monitoring. The sampling rate, confidence limits,

and decision criteria shall be as stated in Annex C.

5.3.3 Higher Level Assembly Testing

If Higher Assembly Level Testing at Temperature Extremes (5.2.2.4) or Device Parameter

Conformance Assessment (5.2.2.3) is used for capability assessment, then the device quality shall

be assured through Device Parameter Conformance Testing (5.3.2), Higher Level Assembly Testing

(this section), or both, depending on the results of the risk assessment in 5.2.2. See Figure 1 for flow

c hart showing this process. If this section is chosen for quality assurance, a process similar to that

outlined in Annex D shall be used to determine the capability of the assembly test to validate the
uprated device at the target temperature. Assembly level tests are designed to test basic functional
performance of an assembly or device. Typically, all functions or “key characteristics” of the end
product are typically verified at the sub-assembly or end-item level. The difference between the
typical case and the process described here is that the device’s role in these functions, or “key
characteristics”, of the assembly are traced, and its capability verified by assembly test over the
target temperature range.
5.3.4 Change Monitoring
Device data (such as product change notices or manufacturer data) shall be monitored to give
warning of device changes that may affect the capability of the device to operate over the wider
temperature range as established in 5.2.
5.3.5 Failure Data Collection and Analysis
Failure data should be collected for all uprated devices. When clear trends are evident, the data
should be analyzed and corrective action taken.
Failures of devices used in wider temperature range should be analyzed to establish the root cause
of the failure.
When failure analysis is conducted, the results shall be documented.
5.4 Documentation
For each instance of device usage outside the manufacturers specified temperature range, relevant
information shall be documented and stored in a controlled, retrievable format:
The documented information should include:

• Equipment in which the device is used
• Device identification;
• Required operating temperature range;
• Manufacturer-specified operating temperature of the device;
• Alternatives considered and rejected;
• Process for assuring device capability in the wider temperature range (including test and
analysis results);
• Process for assuring device quality in the wider temperature range (including test and analysis
results);
• Required signatures;
– 13 –
• Risk assessment results.
Note 1: Required signatures include those of the responsible authorities within the equipment designer’s

organisation and, if required, those of the customers.

Note 2: The form of Figure 2 is recommended for use in documenting semiconductor device usage in wider

temperature ranges.
5.5 Device Identification
All device identification processes shall be consistent with other industry processes.

For each instance in which a device has been determined as having met the application's wider

temperature range requirements, through parameter re-characterization or (5.2.2.2) or device testing

(5.2.2.4), the device’s status shall be identified as having met the requirements specified in the
design activity's uprating specification. The identification requirements shall be as specified in the
design activity's uprating specification and include the design activity's unique identifier such as the
CAGE code, logo, or acronym and the part number assigned by the design activity. For each
occurrence of uprating the parts shall be separately identified as meeting the requirements of the
application. The method of identification shall enable all relevant activities such as spares and
maintenance to establish that the device has met the requirements of parameter re-characterization
or (5.2.2.2) or device testing (5.2.2.4).
If the device is marked then marking shall be in addition to the existing/original manufacturer's
marking and be readable when the device is mounted in its application. All markings applied shall
be permanent and legible.
– 14 –
5.4 Documentation
5.1 Component Selection,
5.1.1
Use Component
Usage and Alternatives
Understand
Select YES
component and
component
package
technology
Obtain Customer
5.1.2
YES
NO YES Approval (if
Compliant to
required)
ECMP
5.1.3
YES
Use Used within
NO
Reasonable Document
alternative temperature range?
alternative
NO
5.2 Capability Assessment
5.2.1 5.2.2
Assess package Assess Assembly
capability Risk
5.2.2.3
5.2.2.1 5.2.2.4
Parameter 5.2.2.2
Parameter Higher Level Assy.
Conformance Stress Balancing
Recharacterization Test @Temp Range
Assessment
Component Component Component
capable? Capable? Capable?
Equipment ESS,
NO NO NO ATP, etc.
YES YES YES
NO NO NO
5.2.3 5.2.3 5.2.3
Component Component Component
Reliability Reliability Reliability
Assured Assured Assured
YES
YES
5.3 Quality Assurance
5.3.1
Production
Periodic
Functional Test
NO YES
Recharacterization of
@Temp
Parameters
Capable of
Validation YES
NO
5.3.3
5.3.2
100% Component 100% LRU
Test Functional Test
5.3
ECMP QA
Process
5.3.4 Monitor Component Change Data Quality YES
5.3.5 Collect and Analyze Failure Data Assured
Figure 1: Flow Chart for Semiconductor Devices in Wider Temperature Ranges
– 15 –
WIDER TEMPERATURE RANGE DEVICE USAGE REPORT

Equipment Name (if Date _____________

applicable)_______________ Program Manager ______________

Equipment ID no. (if Component Engineer ___________

applicable)______________ ID no. after uprate_________________

Name ______________
ID no. before uprate______________

Equipment Required Temperature Range: Max. __________ Min. __________

Mfr’s. Specified Device Temperature Max. __________ Min. __________

Range:
Is the compliant to the equipment manufacturer’s electronic component
management plan?
Yes _____  No _____
What alternate solutions were evaluated, and why were they rejected?
Capability Assessment Process: Device Parameter Re-Characterization _____
Is the package capable? _____ Device Stress Balancing _____
Assembly Testing _____
Device Testing _____
Is the device capable of operating in the required temperature range without
significantly increased risk of catastrophic failure, unstable operation, loss of
equipment function, or adversely affecting the application-specific reliability of the
device?
(Reference or attach Capability Assessment Report)
Quality Assurance Process: Sample Plan and Monitoring _____
100% LRU Test _____
100% Device Test ______
Is the device’s quality assured? (reference or attach QA Plan)
Approvals _______________________________________________
Figure 2: Report Form for Docum
...