IEC 62258-2:2005
(Main)Semiconductor die products - Part 2: Exchange data formats
Semiconductor die products - Part 2: Exchange data formats
IEC 62258-2:2005 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the IEC 62258 series as well as definitions of all parameters used according to the principles and methods of IEC 61360-1, IEC 61360-2 and IEC 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.
Produits de puces de semiconducteurs - Partie 2: Formats d'échange de données
L'IEC 62258-2:2005 a été élaborée afin de faciliter la production, la fourniture et l'utilisation de produits de puces de semiconducteurs, y compris, mais sans s'y limiter: les tranches, les puces nues isolées, les puces et les tranches munies de leurs structures de connexion, les puces et les tranches à encapsulation réduite ou partielle. La présente norme spécifie les formats de données qui peuvent être utilisés pour l'échange de données qui est couvert par d'autres parties de la présente série CEI 62258 ainsi que les définitions de tous les paramètres utilisés selon les principes et méthodes de la CEI 61360-1, de la CEI 61360-2 et de la CEI 61360-4. Elle présente un format d'échange de données de dispositif, DDX (Device Data Exchange), dans le but premier de faciliter le transfert des données géométriques adéquates entre le fabricant de la puce et l'utilisateur de CAO/IAO et des modèles d'informations formels qui permettent l'échange de données dans d'autres formats tels que le format de fichier physique STEP, conformément à l'ISO 10303-21 et XML. Le format de données a été tenu intentionnellement flexible pour permettre un usage au-delà de ce domaine initial d'application. La présente norme reflète le format de données DDX: version 1.2.1.
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INTERNATIONAL IEC
STANDARD 62258-2
First edition
2005-06
Semiconductor die products –
Part 2:
Exchange data formats
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INTERNATIONAL IEC
STANDARD 62258-2
First edition
2005-06
Semiconductor die products –
Part 2:
Exchange data formats
IEC 2005 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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– 2 – 62258-2 IEC:2005(E)
CONTENTS
FOREWORD.5
INTRODUCTION.7
1 Scope.8
2 Normative references.8
3 Terms and definitions .9
4 Requirements .9
5 Device Data eXchange format (DDX) file goals and usage.9
6 DDX file format and file format rules .10
7 DDX file content.10
7.1 DDX file content rules .10
7.2 DDX DEVICE block syntax.12
7.3 DDX data syntax.13
8 Definitions of DEVICE block parameters .14
8.1 BLOCK_CREATION_DATE Parameter.15
8.2 BLOCK_VERSION Parameter .15
8.3 VERSION Parameter .15
8.4 DEVICE_FORM Parameter .15
8.5 DEVICE_NAME Parameter .15
8.6 DIE_MASK_REVISION Parameter .16
8.7 MANUFACTURER Parameter .16
8.8 DIE_NAME Parameter .16
8.9 DIE_PACKAGED_PART_NAME Parameter.16
8.10 FUNCTION Parameter.16
8.11 DATA_SOURCE Parameter .17
8.12 DATA_VERSION Parameter .17
8.13 GEOMETRIC_UNITS Parameter.17
8.14 GEOMETRIC_VIEW Parameter .17
8.15 SIZE Parameter.18
8.16 THICKNESS Parameter .18
8.17 GEOMETRIC_ORIGIN Parameter .18
8.18 SIZE_TOLERANCE Parameter .20
8.19 THICKNESS_TOLERANCE Parameter.20
8.20 TERMINAL_COUNT Parameter .20
8.21 TERMINAL_TYPE_COUNT Parameter.21
8.22 CONNECTION_COUNT Parameter.21
8.23 TERMINAL_TYPE Parameter.21
8.24 TERMINAL Parameter .23
8.25 IC_TECHNOLOGY Parameter .26
8.26 DIE_SEMICONDUCTOR_MATERIAL Parameter .26
8.27 DIE_SUBSTRATE_MATERIAL Parameter.26
8.28 DIE_SUBSTRATE_CONNECTION Parameter .26
8.29 DIE_PASSIVATION_MATERIAL Parameter .27
8.30 DIE_TERMINAL_MATERIAL Parameter .27
8.31 DIE_BACK_DETAIL Parameter .28
62258-2 IEC:2005(E) – 3 –
8.32 WAFER_SIZE Parameter.28
8.33 MAX_TEMP Parameter.28
8.34 POWER_RANGE Parameter.28
8.35 TEMPERATURE_RANGE Parameter .28
8.36 Simulator MODEL FILE Parameter.29
8.37 Simulator MODEL FILE DATE Parameter.29
8.38 Simulator NAME Parameter .29
8.39 Simulator VERSION Parameter.29
8.40 Simulator COMPLIANCE Parameter.30
8.41 DIE_DELIVERY_FORM Parameter .30
8.42 PACKING_CODE Parameter.30
8.43 BUMP_MATERIAL Parameter .30
8.44 BUMP_HEIGHT Parameter .30
8.45 BUMP_HEIGHT_TOLERANCE Parameter.31
8.46 MPD_PACKAGE_MATERIAL Parameter .31
8.47 MPD_PACKAGE_STYLE Parameter .31
8.48 MPD_DELIVERY_FORM Parameter.31
8.49 MPD_CONNECTION_TYPE Parameter.32
8.50 MPD_CONNECTION_MATERIAL Parameter.32
8.51 FIDUCIAL_TYPE Parameter .32
8.52 FIDUCIAL Parameter.33
8.53 WAFER_DIE_STEP_SIZE Parameter .35
8.54 WAFER_GROSS_DIE_COUNT Parameter.35
8.55 WAFER_INDEX Parameter.35
8.56 WAFER_RETICULE_STEP_SIZE Parameter .35
8.57 WAFER_RETICULE_GROSS_DIE_COUNT Parameter .36
9 DDX EXPRESS model schema .36
9.1 Type definitions .36
9.2 File structure .40
9.3 Device names.40
9.4 Device block.40
9.5 Die size .41
9.6 Bare or bumped die type.42
9.7 Bare die type .42
9.8 Bumped bare die type.42
9.9 Lead-frame die type.43
9.10 Minimally packaged device .43
9.11 Die delivery forms.43
9.12 Terminal types.44
9.13 Rectangular terminal.44
9.14 Circular terminal .44
9.15 Elliptic terminal .44
9.16 Polygonal terminal .45
9.17 Terminals .45
9.18 Simulation data.46
9.19 Fiducial type .46
9.20 Fiducial .46
9.21 Die and feature size.47
9.22 Position .47
– 4 – 62258-2 IEC:2005(E)
9.23 Orientation .47
9.24 Date .48
9.25 Substrate connection .48
9.26 Wafer index.48
Annex A (informative) Example of a DDX DEVICE block.49
Annex B (informative) Example of DDX data in STEP Physical FILE (SPF) format.51
Annex C (informative) Typical CAD view from the DDX file block example given in
Annex A .53
Annex D (informative) Properties for simulation .
...
IEC 62258-2 ®
Edition 1.0 2005-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor die products –
Part 2: Exchange data formats
Produits de puces de semiconducteurs –
Partie 2: Formats d'échange de données
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IEC 62258-2 ®
Edition 1.0 2005-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor die products –
Part 2: Exchange data formats
Produits de puces de semiconducteurs –
Partie 2: Formats d'échange de données
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-83220-878-6
– 2 – IEC 62258-2:2005 IEC:2005
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Requirements . 9
5 Device Data eXchange format (DDX) file goals and usage . 9
6 DDX file format and file format rules . 10
7 DDX file content . 10
7.1 DDX file content rules . 10
7.2 DDX DEVICE block syntax . 12
7.3 DDX data syntax . 13
8 Definitions of DEVICE block parameters . 14
8.1 BLOCK_CREATION_DATE Parameter . 15
8.2 BLOCK_VERSION Parameter . 15
8.3 VERSION Parameter . 15
8.4 DEVICE_FORM Parameter . 15
8.5 DEVICE_NAME Parameter . 15
8.6 DIE_MASK_REVISION Parameter . 16
8.7 MANUFACTURER Parameter . 16
8.8 DIE_NAME Parameter . 16
8.9 DIE_PACKAGED_PART_NAME Parameter . 16
8.10 FUNCTION Parameter . 16
8.11 DATA_SOURCE Parameter . 17
8.12 DATA_VERSION Parameter . 17
8.13 GEOMETRIC_UNITS Parameter . 17
8.14 GEOMETRIC_VIEW Parameter . 17
8.15 SIZE Parameter . 18
8.16 THICKNESS Parameter . 18
8.17 GEOMETRIC_ORIGIN Parameter . 18
8.18 SIZE_TOLERANCE Parameter . 20
8.19 THICKNESS_TOLERANCE Parameter . 20
8.20 TERMINAL_COUNT Parameter . 20
8.21 TERMINAL_TYPE_COUNT Parameter . 21
8.22 CONNECTION_COUNT Parameter . 21
8.23 TERMINAL_TYPE Parameter . 21
8.24 TERMINAL Parameter . 23
8.25 IC_TECHNOLOGY Parameter . 26
8.26 DIE_SEMICONDUCTOR_MATERIAL Parameter . 26
8.27 DIE_SUBSTRATE_MATERIAL Parameter . 26
8.28 DIE_SUBSTRATE_CONNECTION Parameter . 26
8.29 DIE_PASSIVATION_MATERIAL Parameter . 27
8.30 DIE_TERMINAL_MATERIAL Parameter . 27
8.31 DIE_BACK_DETAIL Parameter . 28
8.32 WAFER_SIZE Parameter . 28
8.33 MAX_TEMP Parameter . 28
8.34 POWER_RANGE Parameter . 28
8.35 TEMPERATURE_RANGE Parameter . 28
8.36 Simulator MODEL FILE Parameter . 29
8.37 Simulator MODEL FILE DATE Parameter . 29
8.38 Simulator NAME Parameter . 29
8.39 Simulator VERSION Parameter . 29
8.40 Simulator COMPLIANCE Parameter. 30
8.41 DIE_DELIVERY_FORM Parameter . 30
8.42 PACKING_CODE Parameter . 30
8.43 BUMP_MATERIAL Parameter . 30
8.44 BUMP_HEIGHT Parameter . 30
8.45 BUMP_HEIGHT_TOLERANCE Parameter . 31
8.46 MPD_PACKAGE_MATERIAL Parameter . 31
8.47 MPD_PACKAGE_STYLE Parameter . 31
8.48 MPD_DELIVERY_FORM Parameter . 31
8.49 MPD_CONNECTION_TYPE Parameter . 32
8.50 MPD_CONNECTION_MATERIAL Parameter . 32
8.51 FIDUCIAL_TYPE Parameter . 32
8.52 FIDUCIAL Parameter . 33
8.53 WAFER_DIE_STEP_SIZE Parameter . 35
8.54 WAFER_GROSS_DIE_COUNT Parameter . 35
8.55 WAFER_INDEX Parameter . 35
8.56 WAFER_RETICULE_STEP_SIZE Parameter . 35
8.57 WAFER_RETICULE_GROSS_DIE_COUNT Parameter . 36
9 DDX EXPRESS model schema . 36
9.1 Type definitions . 36
9.2 File structure . 40
9.3 Device names . 40
9.4 Device block . 40
9.5 Die size . 41
9.6 Bare or bumped die type . 42
9.7 Bare die type . 42
9.8 Bumped bare die type . 42
9.9 Lead-frame die type . 43
9.10 Minimally packaged device . 43
9.11 Die delivery forms .
...
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