IEC 60747-16-2:2001+AMD1:2007 CSV
(Main)Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency prescalers. This consolidated version consists of the first edition (2001) and its amendment 1 (2007). Therefore, no need to order amendment in addition to this publication.
General Information
Standards Content (Sample)
IEC 60747-16-2
Edition 1.1 2008-01
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 16-2: Microwave integrated circuits – Frequency prescalers
IEC 60747-16-2:2001+A1:2007(E)
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IEC 60747-16-2
Edition 1.1 2008-01
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 16-2: Microwave integrated circuits – Frequency prescalers
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
CK
ICS 31.080.01 ISBN 2-8318-9451-4
– 2 – 60747-16-2 © IEC:2001+A1:2007(E)
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references.5
3 Terms and definitions .5
4 Essential ratings and characteristics.7
4.1 General.7
4.2 Application-related description .7
4.3 Specification of the function .8
4.4 Limiting values (absolute maximum rating system) .10
4.5 Operating conditions (within the specified operating temperature range) .11
4.6 Electrical characteristics.12
4.7 Mechanical and environmental ratings, characteristics and data.13
4.8 Additional information.13
5 Measuring methods.14
5.1 General.14
5.2 Output power (P ) .14
o
5.3 Output voltage (V ) .15
o
) .17
5.4 Minimum operating input power (P
i, min
5.5 Maximum operating input power (P ).18
i, max
5.6 Minimum operating input voltage (V ) .20
i, min
5.7 Maximum operating input voltage (V ) .22
i, max
5.8 Maximum input frequency (f ).24
i, max
5.9 Minimum input frequency (f ) .25
i, min
).26
5.10 High-level modulus control input voltage (V
CH
5.11 Low-level modulus control input voltage (V ) .28
CL
5.12 High-level modulus control input current (I ) .29
CH
5.13 Low-level modulus control input current (I ).30
CL
60747-16-2 © IEC:2001+A1:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-2: Microwave integrated circuits –
Frequency prescalers
FOREWORD
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International Standard IEC 60747-16-2 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This consolidated version of IEC 60747-16-2 consists of the first edition (2001) [documents
47E/160/FDIS and 47E/172/RVD] and its amendment 1 (2007) [documents 47E/338/FDIS and
47E/343/RVD].
The technical content is therefore identical to the base edition and its amendment and has
been prepared for user convenience.
It bears the edition number 1.1.
A vertical line in the margin shows where the base publication has been modified by
amendment 1.
– 4 – 60747-16-2 © IEC:2001+A1:2007(E)
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60747-16-2 © IEC:2001+A1:2007(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-2: Microwave integrated circuits –
Frequency prescalers
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
prescalers.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617:2001, Graphical symbols for diagrams
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices. Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena - General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
3.1
power supply voltage V
xxi
(terminal voltage)
d.c. voltage required to be applied to an 'i'-th terminal noted by 'xx'
3.2
power supply current I
xxi
d.c. current flowing through an 'i'-th terminal noted by 'xx'
– 6 – 60747-16-2 © IEC:2001+A1:2007(E)
3.3
output power P
o
a.c. power measured at the output terminal
3.4
output voltage V
o
amplitude of voltage swing measured at the output terminal
3.5
input power P
i
a.c. power delivered to the input terminal
3.6
input voltage V
i
amplitude of input voltage swing
3.7
high-level modulus control input voltage V
CH
control voltage value to transfer the division ratio from low-level modulus to high-level
modulus
3.8
low-level modulus control input voltage V
CL
control voltage value to transfer the division ratio from high-level modulus to low-level
modulus
3.9
high-level modulus control input current I
CH
control current value to transfer the division ratio from low-level modulus to high-level
modulus
3.10
low-level modulus control input current I
CL
control current value to transfer the division ratio from high-level modulus to low-level
modulus
3.11
input frequency f
i
input frequency for which the device functions
3.12
division ratio N
ratio of the output frequency and input frequency
3.13
set-up time t
set
(under consideration)
60747-16-2 © IEC:2001+A1:2007(E) – 7 –
4 Essential ratings and characteristics
4.1 General
This clause gives ratings and characteristics required for specifying integrated circuit
microwave frequency prescalers used at the microwave or millimetre-wave frequency band.
The integrated circuits contain fixed and two modulus prescalers.
4.1.1 Circuit identification and types
4.1.1.1 Designation and types
Indication of type (device name), category of circuit and technology applied should be given.
Microwave frequency prescalers are divided into two categories:
• type A: fixed modulus type;
• type B: two modulus type.
4.1.1.2 General function description
A general description should be made of the function performed by the integrated circuit
microwave frequency prescalers, and the features for the application.
4.1.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, should be stated. This statement should include details of
the semiconductor technologies such as MESFET, MISFET, MOSFET, Si bipolar transistor,
HBT, etc.
4.1.1.4 Package identification
The following should be stated:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing or of the drawing of a non-
standard package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic;
d) for chip form, outlines, dimensions, pad sizes, contact material, and recommended contact
technologies.
4.1.
...
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