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IEC TS 62647-22:2013

(Main)

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems.

General Information

Status
Published
Publication Date
24-Sep-2013
ICS
03.100.50 - Production. Production management
31.020 - Electronic components in general
49.060 - Aerospace electric equipment and systems
Technical Committee
TC 107 - Process management for avionics
Drafting Committee
WG 1 - TC 107/WG 1
Current Stage
PPUB - Publication issued
Start Date
31-Dec-2013
Completion Date
25-Sep-2013
Ref Project

Relations

Replaces
IEC PAS 62647-22:2011 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
Effective Date
05-Sep-2023

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IEC TS 62647-22:2013 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelinesIEC TS 62647-22:2013 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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Technical specification
IEC TS 62647-22:2013 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
English language
70 pages
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IEC/TS 62647-22 ®
Edition 1.0 2013-09
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 22: Technical guidelines
IEC/TS 62647-22:2013(E)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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IEC/TS 62647-22 ®
Edition 1.0 2013-09
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 22: Technical guidelines
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XB
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-1112-0

– 2 – TS 62647-22  IEC:2013(E)
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviations . 10
3.1 Terms and definitions . 10
3.2 Abbreviations . 15
4 Approach . 16
4.1 General . 16
4.2 Assumption . 16
5 General Pb-free solder alloy behavior . 17
5.1 General . 17
5.2 Elevated temperature . 17
5.3 Low temperatures . 18
5.4 Temperature cycling . 20
5.4.1 General . 20
5.4.2 Solder thermal cycling failure mode . 21
5.4.3 Stress relaxation considerations . 21
5.4.4 Ramp rate . 21
5.4.5 Dwell time at elevated temperature . 21
5.4.6 Dwell time at low temperature . 22
5.5 Rapid mechanical loading (vibration/shock) . 22
6 System level service environment . 22
6.1 General . 22
6.2 Service environment . 23
6.3 Electronics/electrical equipment thermal environments . 23
6.3.1 General . 23
6.3.2 Electronics/electrical equipment steady temperatures . 23
6.3.3 Electronics/electrical equipment temperature cycling . 23
6.4 Vibration and shock . 23
6.5 Humidity . 24
6.6 Other environments: salt spray, fungus, cooling air quality, and fluid
compatibility . 24
6.7 Other special requirements . 24
7 High performance electronics testing . 24
8 Solder joint reliability considerations . 25
8.1 General . 25
8.1.1 Overview . 25
8.1.2 Final solder joint composition . 25
8.1.3 Solder wetting and final joint shape . 25
8.1.4 Strength of the PCB/PWB and component interfaces . 26
8.2 Mixing of solder alloys and finishes . 26
8.3 Pb-free terminations in tin-lead joints . 26
8.3.1 General . 26
8.3.2 Ball grid array Pb-free terminations in tin-lead joints . 27

TS 62647-22  IEC:2013(E) – 3 –
8.3.3 Flat pack and chip device Pb-free terminations in tin-lead
joints . 29
8.4 Tin-lead terminations in Pb-free joints . 30
8.4.1 General . 30
8.4.2 Ball grid array tin-lead terminations in lead-free joints . 30
8.4.3 Flat pack and chip device tin-lead terminations in lead-free
joints . 30
8.5 Bismuth effects . 30
8.6 JCAA/JG-PP testing of mixed alloy combinations . 31
8.6.1 General . 31
8.6.2 Vibration . 31
8.6.3 Thermal shock testing . 32
8.6.4 Combined environments . 32
8.7 Pb-free solder and mixed metallurgy modeling . 32
9 Piece parts . 36
9.1 Materials . 36
9.2 Temperature rating . 36
9.3 Special considerations . 36
9.4 Plastic encapsulated microcircuit (PEM) moisture sensitivity level (MSL) . 36
9.5 Terminal finish . 36
9.6 Assembly stresses . 38
9.7 Hot solder dipping . 38
10 Printed circuit boards . 38
10.1 General . 38
10.2 Plated through holes . 38
10.3 Copper dissolution . 39
10.4 PCB/PWB laminate materials . 40
10.4.1 General . 40
10.4.2 Coefficient of thermal expansion . 40
10.5 Surface finish . 41
10.6 Pb-free PCB/PWB qualification . 42
10.7 PCB/PWB artwork and design considerations for Pb-free solder
applications . 42
11 Printed circuit board (PCB)/printed wiring board (PWB) assembly . 43
11.1 General . 43
11.2 PCB/PWB process indicator coupons . 43
11.3 Solder inspection criterion . 43
11.4 Fluxes, residues, cleaning and SIR issues . 43
12 Module assembly considerations . 49
12.1 Connectors and sockets . 49
12.2 Heatsinks/modules . 49
12.3 Conformal coating . 49
13 Manufacturing resources . 50
14 Aerospace wiring/cabling considerations . 50
14.1 Insulation temperature rating . 50
14.2 Cable connectors . 50
14.3 Wire terminals . 51
14.4 Splices . 51
14.5 Sleeving . 51

– 4 – TS 62647-22  IEC:2013(E)
15 Rework/repair . 51
15.1 General . 51
15.2 Piece part rework . 53
15.2.1 Area array rework . 53
15.2.2 Surface mount capacitor/resistor rework . 53
15.2.3 Through hole piece part rework . 53
15.3 Depot level repair. 54
15.4 Mixed solder rework temperature profiles . 54
15.5 Solder fluxes .
...

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