IEC TS 62668-2:2014

IEC TS 62668-2
®

Edition 1.0 2014-07
TECHNICAL
SPECIFICATION

colour
inside


Process management for avionics – Counterfeit prevention –
Part 2: Managing electronic components from non-franchised sources

IEC TS 62668-2:2014-07(en)

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IEC TS 62668-2

®


Edition 1.0 2014-07




TECHNICAL



SPECIFICATION








colour

inside










Process management for avionics – Counterfeit prevention –

Part 2: Managing electronic components from non-franchised sources



























INTERNATIONAL

ELECTROTECHNICAL

COMMISSION

PRICE CODE
W




ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-1680-4



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC TS 62668-2:2014 © IEC 2014
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and abbreviations . 6
3.1 Terms and definitions . 6
3.2 Abbreviations . 11
4 Technical requirement . 11
4.1 General . 11
4.2 Overview. 12
4.3 Risks associated with purchasing from non-franchised distributors . 13
4.3.1 General . 13
4.3.2 Risk origin . 13
4.3.3 Quality risks. 13
4.3.4 Industrial risks . 14
4.3.5 Reliability risks . 14
4.3.6 Financial risks . 14
4.3.7 Legal risk . 15
4.4 Reasons to initialize the derogation process . 15
4.4.1 General . 15
4.4.2 Obsolescence notice failure . 15
4.4.3 Allocation . 15
4.4.4 Insufficient end-of-life inventory . 15
4.4.5 Late orders . 15
4.4.6 Minimum order quantity . 15
4.4.7 Technical requirements . 16
4.5 Derogation process . 16
4.5.1 Notification to the OEM . 16
4.5.2 Analysis of alternative solutions . 18
4.5.3 List of approved non-franchised distributors. 19
4.5.4 Non-franchised distributor consultation . 19
4.5.5 Risk analysis . 20
4.5.6 Non-franchised distributor order authorization . 23
4.5.7 Order processing . 23
4.5.8 Incoming processing . 23
4.5.9 Records . 27
4.5.10 Processing during storage and manufacturing . 27
Annex A (informative) Flowchart of IEC TS 62668-1 requirements . 28
Annex B (informative) Example of detailed tests list, linked with procurement risks
levels . 30
Annex C (informative) iNEMI counterfeit calculator tools . 35
Bibliography . 36

Figure 1 – Suspect components perimeter . 12
Figure 2 – Derogation process when supplying from non-franchised distribution . 17
Figure 3 – Potential avionics supply chain scenarios . 18

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IEC TS 62668-2:2014 © IEC 2014 – 3 –

Table 1 – Typical procurement risk scenarios and guidance for procurement risk
assessment . 20
Table 2 – Typical testing . 25
Table B.1 − Example of detailed revalidation testing of suspect stock . 30

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– 4 – IEC TS 62668-2:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –

Part 2: Managing electronic components
from non-franchised sources

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.

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IEC TS 62668-2:2014 © IEC 2014 – 5 –
IEC/TS 62668-2, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.
IEC/TS 62668-2 adapts and modifies the GIFAS 5052/2008 document that has served as a
basis for the elaboration of this technical specification.
This technical specification is to be used in conjunction with IEC/TS 62239-1 and
IEC/TS 62688-1.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/228/DTS 107/236/RVC

Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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– 6 – IEC TS 62668-2:2014 © IEC 2014
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –

Part 2: Managing electronic components
from non-franchised sources



1 Scope
The avionics industry has a responsibility to ensure that all flight equipment produced has a
predicted product life which correlates to the predicted repair and service life to ensure the
public is not endangered. Typically an OEM calculates a mean time between failure (MTBF)
and possibly a mean time to failure (MTTF) prediction. These calculations assume all
components are new, or considered as “unused”, at the point of introduction into flight use
and that no useful component life and/or any “unsafe” component conditions have been used.
This part of IEC 62668, which is a technical specification, defines requirements for avoiding
the use of counterfeit, recycled and fraudulent components when these components are
purchased outside of franchised distributor networks for use in the aerospace, defence and
high performance (ADHP) industries. This practice is used, as derogation, only when there are
no reasonable or practical alternatives.
Although developed for the ADHP industry, this document may be used by other high-
performance and high-reliability industries, at their discretion.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC TS 62239-1, Process management for avionics – Management plan – Part 1: Preparation
and maintenance of an electronic components management plan
IEC TS 62668-1:2014, Process management for avionics – Counterfeit prevention – Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic components
AS/EN/JISQ 9100, Quality Management Systems – Requirements for Aviation, Space and
Defense Organizations
AS/EN/JISQ 9120, Quality Management Systems – Requirements for Aviation, Space and
Defense Distributors
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the following terms, definitions and abbreviations apply.

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IEC TS 62668-2:2014 © IEC 2014 – 7 –
3.1.1
aftermarket source
reseller which may or may not be under contract with the original component manufacturer
(OCM) or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated components (wafer
and/or die) whose end of life date has been published by the OCM. These components are then resold at a profit to
fill a need within the market for components that have become obsolete.
[SOURCE: IEC TS 62668-1:2014, 3.1.1]
3.1.2
broker
individual or corporate organization that serves as an intermediary between buyer and seller
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by another. The broker operates within a worldwide
component exchange network.
[SOURCE: IEC TS 62668-1:2014, 3.1.2]
3.1.3
COTS
commercial off-the-shelf products
one or more pieces, mechanical or electrical, developed for multiple commercial consumers,
whose design and/or configuration is controlled by the supplier’s specification or industry
standard
Note 1 to entry: They can include electronic components, subassemblies, or top level assemblies. COTS
subassemblies include circuit card assemblies, power supplies, hard drives, and memory modules. Top-level COTS
assemblies include a fully integrated rack of equipment such as raid arrays, file servers to individual switches,
routers, personal computers, or similar equipment.
[SOURCE: IEC TS 62668-1:2014, 3.1.3]
3.1.4
counterfeit, verb
action of simulating, reproducing or modifying a material, good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to willful trademark infringement.
[SOURCE: IEC TS 62668-1:2014, 3.1.4]
3.1.5
counterfeited component
material good imitating or copying an authentic material, good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty
etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use etc.
[SOURCE: IEC TS 62668-1:2014, 3.1.5]
3.1.6
customer device specification
device specification written by a user and agreed by the supplier

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– 8 – IEC TS 62668-2:2014 © IEC 2014
[SOURCE: IEC/TS 62668-1:2014, 3.1.6]
3.1.7
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant with this technical specification,
and uses them to design, produce, and maintain systems
[SOURCE: IEC TS 62668-1:2014, 3.1.7]
3.1.8
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
[SOURCE: IEC TS 62668-1:2014, 3.1.8]
3.1.9
franchised distributor or agent
individual or corporate organisation that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be dispatched either direct from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
[SOURCE: IEC TS 62668-1:2014, 3.1.9]
3.1.10
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
(1) a stolen component;
(2) a component scrapped by the original component manufacturer (OCM) or by any user;
(3) a recycled component, becomes a fraudulent recycled component ,when it is a disassembled component
resold as a new component (see Figure 1), where typically there is evidence of prior use and rework (e.g.
solder, re-plating or lead re-attachment activity) on the component package terminations;
(4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;
(5) fraudulent designs, models , patents, software or copyright sold as being new and authentic, For example:
a component whose production and distribution are not controlled by the original manufacturer;
(6) unlicensed copies of a design;
(7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other
identifiers etc.),which may be a counterfeit component; see Figure 1;
(8) a component without an internal silicon die or with a substituted silicon die which is not the original
manufacturer’s silicon die.
[SOURCE: IEC TS 62668-1:2014, 3.1.10]

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IEC TS 62668-2:2014 © IEC 2014 – 9 –
3.1.11
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element
density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards / printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components).
[SOURCE: IEC TS 62668-1:2014, 3.1.11]
3.1.12
non-franchised distributor
companies which do not fall under a franchised distributor or OCM
Note 1 to entry: Tthese distributors may purchase components from component manufacturers, franchised
distributors, or through other supply channels (open markets). These distributors cannot always provide the
guarantees and support provided by the franchised distributor network; components sourced through this source
are usually protected by the source’s warranty only. However, some of them are able to purchase traceable
components and/or to provide traceability paperwork and/or are able to return stock for investigation to the OCM.
[SOURCE: IEC TS 62668-1:2014, 3.1.12]
3.1.13
OCM
original component manufacturer
company specifying and manufacturing the electronic component
[SOURCE: IEC TS 62668-1:2014, 3.1.13]
3.1.14
OEM
original equipment manufacturer
manufacturer which defines the electronic subassembly that includes the electronic
components or defines the components used in an assembly and/or test specification
[SOURCE: IEC TS 62668-1:2014, 3.1.14]
3.1.15
piracy
willful copyright infringement
[SOURCE: IEC TS 62668-1:2014, 3.1.15]
3.1.16
purchasing agency
organization which groups the quantities of electronic components required by a series of
companies in order to constitute significant buying power and thereby obtain the best possible
supplier conditions for purchasing (especially as regards pricing and purchasing conditions)
as well as for assistance with management, documentation , financing etc.
3.1.17
reseller
general supplier which offers a selection of electronic components to order from a catalogue
[SOURCE: IEC TS 62668-1:2014, 3.1.16]

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– 10 – IEC TS 62668-2:2014 © IEC 2014
3.1.18
recycled component
electrical component removed from its original product or assembly and available for reuse
Note 1 to entry: The component has authentic logos, trademarks and markings. However, it typically has no
output to measure the useful life remaining for its reuse. A recycled component can fail earlier than a new one
when re-assembled into another product or assembly. A recycled component may also be physically or ESD
damaged during the removal process.
[SOURCE: IEC TS 62668-1:2014, 3.1.17]
3.1.19
semiconductor
electronic component in which the characteristic distinguishing electronic conduction takes
place within a semiconductor
Note 1 to entry: This includes semiconductor diodes which are semiconductor devices having two terminals and
exhibiting a nonlinear voltage-current characteristic and transistors which are active semiconductor devices
capable of providing power amplification and having three or more terminals.
[SOURCE: IEC TS 62668-1:2014, 3.1.18]
3.1.20
subcontractor
manufacturer of electronic subassemblies, supplier manufacturingitems in compliance with
customer design data pack and drawings, and under the authority of the OEM
Note 1 to entry: This supplier may potentially procure all or part of the electronic components required to produce
a sub assembly and is often referred to as the contract electronic manufacturer (CEM) or electronics manufacturing
services (EMS).
[SOURCE: IEC TS 62668-1:2014, 3.1.19]
3.1.21
supplier
company which provides to another an electronic component which is identified by the logo or
name marked on the device
Note 1 to entry: A supplier can be an OCM, a franchised distributor or agent, a non-franchised distributor, broker,
reseller, OEM, CEM, and EMS etc.
[SOURCE: IEC TS 62668-1:2014, 3.1.20]
3.1.22
suspect component
electronic component which has lost supply chain traceability back to the original
manufacturer and which may have been misrepresented by the supplier or manufacturer and
may meet the definition of fraudulent or counterfeit component
Note 1 to entry: Suspect components may include but are not limited to:
(1) counterfeit components;
(2) recycled components coming from uncontrolled recycling operations carried outside of the OEM, franchised
network and OEM business where typically it has been fraudulently sold to the OEM as being in a new
unused condition.
[SOURCE: IEC TS 62668-1:2014, 3.1.21]
3.1.23
traceability
ability to have for an electronic component its full trace back to the original component
manufacturer

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IEC TS 62668-2:2014 © IEC 2014 – 11 –
Note 1 to entry: This traceability means that every supplier in the supply chain is prepared to legally declare in
writing that they know and can identify their source of supply, which goes back to the original manufacturer and
can confirm that the electronic components are brand new and were handled with appropriate handling precautions
including ESD and MSL. This authenticates the electronic components being supplied are unused, brand new
components with no ESD, MSL or other damage. This ensures that the electronic components are protected by
any manufacturer’s warranties, have all of their useful life remaining and function according to the manufacturer’s
published data sheet, exhibiting the expected component life in the application for the OEM’s reliability predictions
...