IEC PAS 62647-1:2011

IEC/PAS 62647-1
®

Edition 1.0 2011-06
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD

Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 1: Lead-free management



IEC/PAS 62647-1:2011(E)

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IEC/PAS 62647-1
®

Edition 1.0 2011-06
PUBLICLY AVAILABLE
SPECIFICATION

PRE-STANDARD

Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 1: Lead-free management


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88912-203-5
® Registered trademark of the International Electrotechnical Commission

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– 2 – PAS 62647-1  IEC:2011(E)
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Symbols and abbreviated terms . 10
5 Objectives . 10
5.1 General . 10
5.2 Reliability . 10
5.3 Configuration control and product identification . 10
5.4 Risks and limitations of use . 10
5.5 Deleterious effects of tin whiskers . 10
5.6 Repair, rework, maintenance, and support. 10
6 Technical requirements . 10
6.1 General . 10
6.2 Reliability . 11
6.2.1 General . 11
6.2.2 Test and analysis methods . 11
6.2.3 Environmental and operating conditions . 11
6.2.4 Data . 12
6.2.5 Conversion of results from available data to applicable conditions . 12
6.3 Configuration control and product identification . 12
6.3.1 General . 12
6.3.2 Termination material and finish alloy compositions of piece parts . 12
6.3.3 Solder alloys used in the assembly process . 13
6.3.4 Aircraft wiring . 13
6.3.5 Changes in solder alloys. 13
6.3.6 Identification . 13
6.3.7 Part number changes . 14
6.4 Risks and limitations of use . 14
6.4.1 Incompatible materials . 14
6.4.2 Limitations on system use . 14
6.4.3 Limitations on environmental conditions . 14
6.4.4 Limitations on maintenance, rework, and repair . 14
6.4.5 Other risks and limitations . 14
6.5 Deleterious effects of tin whiskers . 14
6.6 Repair, rework, maintenance, and support. 14
6.6.1 General . 14
6.6.2 Replacing piece parts . 15
7 Plan administrative requirements . 15
7.1 Plan organization . 15
7.2 Terms and definitions . 15
7.3 Plan focal authority. 16
7.4 References . 16
7.5 Plan applicability . 16
7.6 Plan implementation . 16

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PAS 62647-1  IEC:2011(E) – 3 –
7.7 Plan acceptance . 16
7.8 Plan modifications . 16
Bibliography . 18

Figure 1 – Relationship of IEC/PAS 62647-1, IEC/PAS 62647-2, GEIA-HB-0005-1, and
GEIA-HB-0005-2 with each other, and with information about Pb-free electronics from
sources external to the aerospace and high performance electronics industries . 17
Figure 2 – Schematic diagram of the content of a Performance Plan compliant to
IEC/PAS 62647-1 . 17

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– 4 – PAS 62647-1  IEC:2011(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS
CONTAINING LEAD-FREE SOLDER –

Part 1: Lead-free management


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
A PAS is a technical specification not fulfilling the requirements for a standard, but made
available to the public.
IEC-PAS 62647-1 has been processed by IEC technical committee 107: Process management
for avionics.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document
Draft PAS Report on voting
107/106/PAS 107/115A/RVD

Following publication of this PAS, which is a pre-standard publication, the technical committee
or subcommittee concerned may transform it into an International Standard.

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PAS 62647-1  IEC:2011(E) – 5 –
This PAS is based on GEIA-STD-0005-1 and is published as a double logo PAS. GEIA,
Government Electronics and Information Technology Association, has been transformed into
TechAmerica Association.
This PAS shall remain valid for an initial maximum period of 3 years starting from the
publication date. The validity may be extended for a single period up to a maximum of
3 years, at the end of which it shall be published as another type of normative document, or
shall be withdrawn.
A bilingual version of this publication may be issued at a later date.

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– 6 – PAS 62647-1  IEC:2011(E)
INTRODUCTION
This PAS is intended for use by Aerospace and High Performance (AHP) electronics system
customers, i.e., aerospace and defence vehicle integrators, operators, and regulatory
organizations, and their suppliers, i.e., system original equipment manufacturers (OEMs) and
system maintenance facilities as they incorporate Pb-free solder or Pb-free piece part and
board finishes.
The Aerospace Industries Association (AIA), the Avionics Maintenance Conference (AMC),
and Government Electronics and Information Technology Association (GEIA) formed the
Lead-free Electronics in Aerospace Project Working Group (LEAP WG) to generate a series of
industry standard documents for the use and handling of Pb-free solder, piece parts and
boards in AHP. This PAS – originally published as GEIA-STD-0005-1 – was prepared by the
LEAP WG; and was balloted and approved by GEIA G-12 (Solid State Subcommittee) and the
GEIA Avionics Process Management Committee. According to agreements between GEIA and
IEC, this PAS is extended at international level.
1 2
This PAS is intended to work in concert with GEIA-HB-0005-1 , GEIA-HB-0005-2 , and
IEC/PAS 62647-2 (based originally on GEIA-STD-0005-2). Figure 1 shows a schematic
representation of their relationships with each other, and with information about lead-free (Pb-
free) electronics from sources external to the AHP industries.
This PAS may be referenced in proposals, requests for proposals, work statements, contracts,
and other aerospace and high performance industry documents.
The European Union (EU) has enacted two directives; 2002/95/EC Restriction of Hazardous
Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that
restrict or eliminate the use of various substances in a variety of products that are put on the
market after July 2006. One of the key materials restricted is lead, which is widely used in
electronic solder and electronic piece part terminations. These regulations may appear to
affect only products for sale in the EU; however, due to the reduced market share of the AHP
industries, many of the lower tier suppliers to those industries will change their products to
serve their primary, non-AHP markets. Additionally, several U.S. states have enacted similar
“green” laws and many Asian electronics manufacturers have recently announced completely
green product lines. Since AHP is one of the few major industrial sectors that still repair
Circuit Card Assemblies (CCAs) and the lead-free materials and processes are relatively
immature and poorly understood, an aerospace-wide approach to their application is desired.
AHP industries products may be in one of a number of stages of the incorporation of Pb-free
electronics, including
1) products that have been designed and qualified with traditional tin-lead (SnPb) electronic
piece parts, materials, and assembly processes, and that will need to be maintained in the
SnPb configuration;
2) products that have been designed and qualified with traditional SnPb electronic piece
parts, materials and assembly processes, and have incorporated Pb-free electronic piece
parts;
3) products that have been designed and qualified with SnPb materials, and are
incorporating Pb-free materials;
4) new products designed with Pb-free materials.

___________
1
 A future IEC/PAS 62647-21, based on GEIA-HB-0005-1, is in preparation.
2
 A future IEC/PAS 62647-22, based on GEIA-HB-0005-2, is in preparation.

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PAS 62647-1  IEC:2011(E) – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS
CONTAINING LEAD-FREE SOLDER –

Part 1: Lead-free management



1 Scope
This PAS defines the objectives of, and requirements for, documenting processes that assure
customers and regulatory agencies that Aerospace and High Performance (AHP) electronic
systems containing Pb-free solder, piece parts, and boards will satisfy the applicable
requirements for performance, reliability, airworthiness, safety, and certifiability throughout
the specified life of performance.
Its goal is to communicate requirements for a Lead-free Control Plan (LFCP), hereinafter
referred to as the plan, and to assist suppliers in the development of their own plans. The
plan documents the plan owner’s (supplier’s) processes, that assure their customers, and all
3
other stakeholders that the plan owner’s products will continue to meet their requirements .
This PAS does not contain detailed descriptions of the processes to be documented but lists
high-level requirements for such processes, and areas of concern to the AHP industries that
must be addressed by the processes.
This PAS applies only to entities within the control of the AHP electronics system supply
chain; and is intended to address issues that are unique to those industries.
Some applications may have unique requirements that exceed the scope of this PAS, and
should be covered separately.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC/PAS 62647-2 (originally published as GEIA-STD-0005-2), Process management for
avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2:
Mitigation of the deleterious effects of tin
GEIA-HB-0005-1, Program Management / Systems Engineering Guidelines for Managing the
4
Transition to Lead-free Electronics
GEIA-HB-0005-2, Technical Guidelines for Aerospace and High Performance Electronics
5
Containing Lead-free Solder
___________
3
 This PAS was developed primarily for aerospace products; however, it also may be applicable, at the discretion
of the user, to other products with similar characteristics, e.g., low-volume, rugged environments, high
reliability, long lifetime, and repairability. Other industries may use this PAS by substituting the name of their
industry for the word “aerospace” in this PAS.
4
 A future IEC/PAS 62647-21, based on GEIA-HB-0005-1, is in preparation.
5
 A future IEC/PAS 62647-22, based on GEIA-HB-0005-2, is in preparation.

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– 8 – PAS 62647-1  IEC:2011(E)
IPC-1066, Marking, Symbols and Labels for Identification of Lead-free and Other Reportable
Materials in Lead-free Assemblies
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply:
3.1
assemblies
electronic items that require electrical attachments, including soldering of wires or component
terminations; examples include circuit cards and wire harnesses
3.2
critical item or function
item or function which, if defective, will result in the system’s inability to retain operational
capability, meet primary objective, or affect safety
3.3
customer
entity or organization that (a) integrates a piece part, soldered assembly, unit, or system into
a higher level system, (b) operates the higher level system, or (c) certifies the system for use.
For example, this may include end item users, integrators, regulatory agencies, operators,
original equipment manufacturers (OEMs), and subcontractors
3.4
high performance system or product
System or Product which requires continued performance or performance on demand, or
equipment down time cannot be tolerated, or end-use environment may be uncommonly
harsh, and the equipment must function when required, such as life support or other critical
systems
3.5
lead-free
defined as less than 0,1 % by weight of lead in accordance with Waste Electrical and
Electronic Equipment (WEEE) guidelines
3.6
lead-free control plan
aerospace or defence system supplier’s document that defines the processes that assure the
plan owners, their customers, and all other stakeholders that aerospace and high
performance high-reliability electronics systems containing Pb-free solder and Pb-free piece
part and board finishes will continue to be reliable, safe, producible, affordable, and
supportable
3.7
Pb-free tin
tin or any tin alloy with <3 % lead (Pb) content by weight. This means that some Pb-free
finishes other than Pb-free tin, such as tin-bismuth and tin-copper, are considered to be “tin”
for the purposes of this PAS. Many of these alloys have not been assessed for whiskering
behavior
3.8
Pb-free tin finish
Pb-free tin final finishes or underplates either external or internal to a device, board or other
hardware. This includes all leads and surfaces, even those coated, encapsulated, or
otherwise not exposed. It may include finishes on electrical piece parts, mechanical piece
parts, and boards. It does not include Pb-free bulk solders, assembly materials, solder balls,
or those devices where the Pb-free tin finish has been completely replaced

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PAS 62647-1  IEC:2011(E) – 9 –
3.9
piece part
electronic piece part that is not normally disassembled without destruction and is normally
attached to a printed wiring board to perform an electrical function
3.10
repair
act of restoring the functional capability of a defective article in a manner that precludes
compliance of the article with applicable drawings or specifications
3.11
rework
act of reprocessing non-complying articles, through the use of original or equivalent
processing in a manner that assures full compliance of the article with applicable drawings or
specifications
3.12
solder ball technology
identifies a family of components that employ solder balls or bumps to make mechanical and
electrical connections between components and printed circuit boards. Examples are ball grid
arrays (BGA), flip chip, and chip scale interconnections
3.13
soldered assembly
assembly of two or more basic parts interconnected by a solder alloy. A lead-based soldered
assembly is one in which the solder alloys are solely lead-based. A lead-free soldered
assembly is one in which the solder alloys are solely lead-free
3.14
sub-contractor
organization, within the given high-reliability industry, that supplies, maintains, repairs, or
supports electronic systems, and is not the direct supplier to the customer or user of those
systems
3.15
supplier
entity or organization that designs, manufactures, repairs, reworks, or maintains a piece part,
unit, or system. For example, this includes original equipment manufacturers (OEMs), repair
and rework facilities, subcontractors, and piece part manufacturers
3.16
system
one or more units that perform electrical function(s)
3.17
system design authority
entity responsible for producing and/or maintaining the design of the system
3.18
tin whisker
spontaneous crystal growth that emanates from a tin surface. They may be cylindrical, kinked,
or twisted. Typically they have an aspect ratio (length/width) greater than two, with shorter
growths referred to as nodules or odd-shaped eruptions (OSEs)
3.19
unit
one or more assemblies within a chassis to perform electrical function(s)

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– 10 – PAS 62647-1  IEC:2011(E)
4 Symbols and abbreviated terms
AHP Aerospace and High Performance
AIA Aerospace Industries Association
AMC Avionics Maintenance Conference
BGA Ball Grid Array
GEIA Government Engineering and Information Technology Association
GIDEP Government Industry Data Exchange Program
LEAP WG Lead-free Electronics in Aerospace Project Working Group
LFCP Lead Free Control Plan
OEM Original Equipment Manufacturer
Pb Lead
SAC Tin Silver Copper
Sn Tin
JCAA/JG-PP Joint Council on Aging Aircraft Joint Group on Pollution Prevention
5 Objectives
5.1 General
This PAS describes a Lead Free Control Plan that documents the processes used to assure
that aerospace and high performance electronic systems that are produced, supplied,
reworked, repaired, or maintained by the plan owner, and that contain Pb-free solder, piece
parts, or boards will satisfy the applicable requirements for performance, reliability, safety,
and certifiability throughout the specified life of performance of the system. Specific objectives
to be accomplished are as follows:
5.2 Reliability
The processes and materials using Pb-free solder and finishes are demonstrated as capable
of producing reliable products.
5.3 Configuration control and product identification
The configurations of all systems, equipment, assemblies, sub-assemblies, and piece parts
are identified and controlled.
5.4 Risks and limitations of use
Risks and limitation of use of the plan owner’s products, due to the use of Pb-free solders and
finishes, are identified, and information is provided to control them.
5.5 Deleterious effects of tin whiskers
The deleterious effects of tin whiskers are mitigated.
5.6 Repair, rework, maintenance, and support
Repair, rework, maintenance, and support activities are controlled in a manner that controls
effects of Pb-free solder materials and processes.
6 Technical requirements
6.1 General
The AHP system supplier shall have a plan that documents the processes the plan owner
uses to accomplish the objectives of Clause 5.
The plan shall state clearly, concisely, and unambiguously

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PAS 62647-1  IEC:2011(E) – 11 –
• what the plan owner does to accomplish each of the objectives;
• the process by which compliance to the plan is demonstrated;
• the evidence that is available to show that the objectives have been accomplished.
Depending on program or product line requirements, the plan owner may, with appropriate
justification, amend the above list of objectives by adding or deleting them. If this is done,
then the plan will be assessed according to the amended list of requirements, as stated in the
plan.
6.2 Reliability
6.2.1 General
The plan shall document processes that are capable of assuring the reliability of the
equipment using the substrate solder finish materials, termination solder materials and
finishes, assembly solder alloys, fluxes, cleaning agents, board materials, piece parts, and
soldering processes in the given application.
NOTE This document is limited to issues that are unique to aerospace and high performance industries; for
example it is assumed that assembly processes and materials that assure high quality assembly in other industries
will be acceptable in the given aerospace or high performance industry. On the other hand, users of this PAS
should address unique reliability issues such as long life, rugged operating environments, high consequences of
failure, etc. An example would be to assure that bakeout processes prior to assembly will limit susceptibility to
“popcorning” when subjected to higher soldering process temperatures.
This requirement applies to combinations of substrate solder finish materials, termination
solder materials and finishes, and assembly solder alloys used in the given application.
This requirement applies to original production and repair and rework of systems.
This requirement applies to purchased sub-assemblies, such as disk drives, that include
solder alloys.
6.2.2 Test and analysis methods
The plan shall document methods to test assemblies made with the alloys, and combinations
thereof, to provide data
...