Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2

IEC 62453-302:2023 is available as IEC 62453-302:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62453-302:2023 provides information for integrating the CIP™ technology into the FDT interface specification (IEC 62453‑2). Communication Profile Family 2 (commonly known as CIP™[1]) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet™[2]), CP 2/2 (EtherNet/IP™[3]), and CP 2/3 (DeviceNet™1) are defined in IEC 61784‑1 and IEC 61784‑2. An additional communication profile (CompoNet™1), also based on CIP™, is defined in IEC 62026-7. This part of IEC 62453 specifies communication and other services. This specification neither contains the FDT specification nor modifies it.
[1] CIP™ (Common Industrial Protocol), DeviceNet™ and CompoNet™ are trade names of Open DeviceNet Vendor Association, Inc (ODVA). This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trade name holder or any of its products. Compliance to this standard does not require use of the trade names CIP™, DeviceNet™ or CompoNet™. Use of the trade names CIP™, DeviceNet™ or CompoNet™ requires permission of Open DeviceNet Vendor Association, Inc.
[2] ControlNet™ is a trade name of ControlNet International, Ltd. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance to this profile does not require use of the trade name ControlNet™. Use of the trade name ControlNet™ requires permission of ControlNet International, Ltd.
[3] EtherNet/IP™ is a trade name of ControlNet International, Ltd. and Open DeviceNet Vendor Association, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance to this profile does not require use of the trade name EtherNet/IP™. Use of the trade name EtherNet/IP™ requires permission of either ControlNet International, Ltd. or Open DeviceNet Vendor Association, Inc.

Spécification des interfaces des outils des dispositifs de terrain (FDT) - Partie 302: Intégration des profils de communication - CPF 2 de l'IEC 61784

IEC 62453-302:2023 est disponible sous forme de IEC 62453-302:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 62453-302:2023 fournit des informations sur l’intégration de la technologie CIP™ dans la spécification des interfaces des outils des dispositifs de terrain (FDT) (IEC 62453‑2). La Famille de profils de communication 2 (communément appelée CIP™[1]) définit des profils de communication basés sur les normes IEC 61158‑2 Type 2, IEC 61158‑3‑2, IEC 61158‑4‑2, IEC 61158‑5‑2, IEC 61158‑6‑2 et IEC 62026‑3. Les profils de base CP 2/1 (ControlNet™[2]), CP 2/2 (EtherNet/IP™[3]) et CP 2/3 (DeviceNet™1) sont définis dans l’IEC 61784‑1 et l’IEC 61784‑2. Un Profil de communication supplémentaire (CompoNet™1), également basé sur CIP™, est défini dans l’IEC 62026-7. La présente partie de l’IEC 62453 spécifie les services de communication et autres services. La présente spécification ne contient pas la spécification des outils FDT et ne la modifie pas.
[1] CIP™ (Common Industrial Protocol), DeviceNet™ et CompoNet™ sont les appellations commerciales de Open DeviceNet Vendor Association, Inc (ODVA). Cette information est donnée à l’intention des utilisateurs du présent document et ne signifie nullement que l’IEC approuve ou recommande le détenteur de la marque ou de l’un quelconque de ses produits. La conformité à la présente norme n’exige pas l’emploi des appellations commerciales CIP™, DeviceNet™ ou CompoNet™. L’utilisation des appellations commerciales CIP™, DeviceNet™ ou CompoNet™ nécessite l’autorisation de Open DeviceNet Vendor Association, Inc.
[2] ControlNet™ est l’appellation commerciale de ControlNet International, Ltd. Cette information est donnée à l’intention des utilisateurs du présent document et ne signifie nullement que l’IEC approuve ou recommande le détenteur de la marque ou de l’un quelconque de ses produits. La conformité à ce profil n’exige pas l’emploi de l’appellation commerciale ControlNet™. L’utilisation de l’appellation commerciale ControlNet™ nécessite l’autorisation de ControlNet International, Ltd.
[3] EtherNet/IP™ est l’appellation commerciale de ControlNet International, Ltd et de Open DeviceNet Vendor Association, Inc. Cette information est donnée à l’intention des utilisateurs du présent document et ne signifie nullement que l’IEC approuve ou recommande le détenteur de la marque ou de l’un quelconque de ses produits. La conformité à ce profil n’exige pas l’emploi de l’appellation commerciale EtherNet/IP™. L’utilisation de l’appellation commerciale EtherNet/IP™ nécessite l’autorisation de ControlNet International, Ltd. ou de Open DeviceNet Vendor Association, Inc.

General Information

Status
Published
Publication Date
07-Nov-2023
Current Stage
PPUB - Publication issued
Start Date
08-Dec-2023
Completion Date
08-Nov-2023
Ref Project

Relations

Buy Standard

Standard
IEC 62453-302:2023 RLV - Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2 Released:11/8/2023 Isbn:9782832278307
English language
109 pages
sale 15% off
Preview
sale 15% off
Preview
Standard
IEC 62453-302:2023 - Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2 Released:8. 11. 2023
English and French language
73 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


IEC 62453-302 ®
Edition 3.0 2023-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc

If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 62453-302 ®
Edition 3.0 2023-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40, 35.100.05, 35.110 ISBN 978-2-8322-7830-7

– 2 – IEC 62453-302:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION . 2
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, symbols, abbreviated terms and conventions . 8
3.1 Terms and definitions . 8
3.2 Symbols and abbreviated terms . 8
3.3 Conventions . 9
3.3.1 Data type names and references to data types . 9
3.3.2 Vocabulary for requirements . 9
4 Bus category . 9
5 Access to instance and device data . 11
6 Protocol specific behavior . 11
7 Protocol specific usage of general data types . 11
8 Protocol specific common data types . 12
9 Network management data types . 16
9.1 General . 16
9.2 Node address . 16
9.3 Scanner/master – Bus parameter set (CIP) . 16
10 Communication data types. 24
11 Channel parameter data types . 27
12 Device identification . 29
12.1 Device type identification data types . 29
12.2 Topology scan data types . 30
12.3 Scan identification data types . 30
12.4 Device type identification data types . 31
Annex A (informative) Implementation hints . 34
A.1 Addressing in CompoNet DTMs . 34
A.2 Displaying addresses of CompoNet DTMs . 35
A.3 Handling of Config1 and Config2 elements in EtherNet/IP . 35
Bibliography . 36

Figure 1 – Part 302 of the IEC 62453 series . 6
Figure A.1 – Examples of DTM naming for CompoNet . 35

Table 1 – Protocol identifiers . 9
Table 2 – Physical layer identifiers for DeviceNet . 9
Table 3 – Physical layer identifiers for ControlNet . 9
Table 4 – Physical layer identifiers for Ethernet/IP . 10
Table 5 – Physical layer identifiers for CompoNet . 10
Table 6 – Data link layer identifiers . 10
Table 7 – Protocol specific usage of general data types . 11
Table 8 – Simple protocol specific common data types . 12

Table 9 – Structured protocol specific common data types . 14
Table 10 – Simple fieldbus configuration data types . 16
Table 11 – Structured fieldbus configuration data types . 18
Table 12 – Simple communication data types . 25
Table 13 – Structured communication data types . 25
Table 14 – Simple channel parameter data types . 27
Table 15 – Structured channel parameter data types . 28
Table 16 – Identification data types with protocol specific mapping . 30
Table 17 – Simple identification data types with protocol independent semantics . 30
Table 18 – Structured identification data types with protocol independent semantics . 30
Table 19 – Simple scan identification data types . 31
Table 20 – Structured scan identification data types . 31
Table 21 – Structured device type identification data types . 32
Table A.1 – CompoNet relationship between Device Category, Node Address, MAC ID . 34

– 4 – IEC 62453-302:2023 RLV © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE TOOL (FDT) INTERFACE SPECIFICATION –

Part 302: Communication profile integration –
IEC 61784 CPF 2
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62453-302:2016. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
IEC 62453-302 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2016. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) improved support for Ethernet IP (see 9.3, Clause 10, and 12.4).
Each part of the IEC 62453-3xy series is intended to be read in conjunction with IEC 62453-2.
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/1031/FDIS 65E/1032/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplemen
...


IEC 62453-302 ®
Edition 3.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device tool (FDT) interface specification –
Part 302: Communication profile integration – IEC 61784 CPF 2

Spécification des interfaces des outils des dispositifs de terrain (FDT) –
Partie 302: Intégration des profils de communication – CPF 2 de l'IEC 61784
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et
les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc

If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Recherche de publications IEC -  IEC Products & Services Portal - products.iec.ch
webstore.iec.ch/advsearchform Découvrez notre puissant moteur de recherche et consultez
La recherche avancée permet de trouver des publications IEC gratuitement tous les aperçus des publications. Avec un
en utilisant différents critères (numéro de référence, texte, abonnement, vous aurez toujours accès à un contenu à jour
comité d’études, …). Elle donne aussi des informations sur les adapté à vos besoins.
projets et les publications remplacées ou retirées.

Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
Le premier dictionnaire d'électrotechnologie en ligne au monde,
Restez informé sur les nouvelles publications IEC. Just
avec plus de 22 300 articles terminologiques en anglais et en
Published détaille les nouvelles publications parues.
français, ainsi que les termes équivalents dans 19 langues
Disponible en ligne et une fois par mois par email.
additionnelles. Egalement appelé Vocabulaire

Electrotechnique International (IEV) en ligne.
Service Clients - webstore.iec.ch/csc

Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
IEC 62453-302 ®
Edition 3.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device tool (FDT) interface specification –

Part 302: Communication profile integration – IEC 61784 CPF 2

Spécification des interfaces des outils des dispositifs de terrain (FDT) –

Partie 302: Intégration des profils de communication – CPF 2 de l'IEC 61784

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40, 35.100.05, 35.110 ISBN 978-2-8322-7780-5

– 2 – IEC 62453-302:2023 © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, symbols, abbreviated terms and conventions . 8
3.1 Terms and definitions . 8
3.2 Symbols and abbreviated terms . 8
3.3 Conventions . 9
3.3.1 Data type names and references to data types . 9
3.3.2 Vocabulary for requirements . 9
4 Bus category . 9
5 Access to instance and device data . 11
6 Protocol specific behavior . 11
7 Protocol specific usage of general data types . 11
8 Protocol specific common data types . 12
9 Network management data types . 16
9.1 General . 16
9.2 Node address . 16
9.3 Scanner/master – Bus parameter set (CIP) . 16
10 Communication data types. 24
11 Channel parameter data types . 27
12 Device identification . 29
12.1 Device type identification data types . 29
12.2 Topology scan data types . 30
12.3 Scan identification data types . 30
12.4 Device type identification data types . 31
Annex A (informative) Implementation hints . 33
A.1 Addressing in CompoNet DTMs . 33
A.2 Displaying addresses of CompoNet DTMs . 34
A.3 Handling of Config1 and Config2 elements in EtherNet/IP . 34
Bibliography . 35

Figure 1 – Part 302 of the IEC 62453 series . 6
Figure A.1 – Examples of DTM naming for CompoNet . 34

Table 1 – Protocol identifiers . 9
Table 2 – Physical layer identifiers for DeviceNet . 9
Table 3 – Physical layer identifiers for ControlNet . 9
Table 4 – Physical layer identifiers for Ethernet/IP . 10
Table 5 – Physical layer identifiers for CompoNet . 10
Table 6 – Data link layer identifiers . 10
Table 7 – Protocol specific usage of general data types . 11
Table 8 – Simple protocol specific common data types . 12

Table 9 – Structured protocol specific common data types . 14
Table 10 – Simple fieldbus configuration data types . 16
Table 11 – Structured fieldbus configuration data types . 18
Table 12 – Simple communication data types . 25
Table 13 – Structured communication data types . 25
Table 14 – Simple channel parameter data types . 27
Table 15 – Structured channel parameter data types . 28
Table 16 – Identification data types with protocol specific mapping . 30
Table 17 – Simple identification data types with protocol independent semantics . 30
Table 18 – Structured identification data types with protocol independent semantics . 30
Table 19 – Simple scan identification data types . 31
Table 20 – Structured scan identification data types . 31
Table 21 – Structured device type identification data types . 32
Table A.1 – CompoNet relationship between Device Category, Node Address, MAC ID . 33

– 4 – IEC 62453-302:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE TOOL (FDT) INTERFACE SPECIFICATION –

Part 302: Communication profile integration –
IEC 61784 CPF 2
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.