IEC 62148-21:2021

IEC 62148-21 ®
Edition 2.0 2021-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Package and interface standards –

Part 21: Design guidelines of electrical interface of PIC packages using silicon

fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array

(S-FLGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-9742-1

– 2 – IEC 62148-21:2021 RLV © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 9
Bibliography . 14

Figure 1 – S-FBGA and S-FLGA outline . 8
Figure 2 – Mechanical gauge drawing . 9
Figure 3 – Array of terminal-existence areas . 9

Table 1 – Dimensions and tolerances . 10
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 12
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 13
D E
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62148-21:2019. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
– 4 – IEC 62148-21:2021 RLV © IEC 2021
IEC 62148-21 has been prepared by subcommittee 86C: Fibre optic systems and active devices,
of IEC technical committee 86: Fibre optics. It is an International Standard.
This second edition cancels and replaces the first edition published in 2019. This edition
constitutes a technical revision.
This edition includes the following significant technical change with respect to the previous
edition: specification of an electric guard band area around the optical terminal area, so as to
allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).
The text of this International Standard is based on the following documents:
CDV Report on voting
86C/1684/CDV 86C/1710/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62148 series, published under the general title Fibre optic active
components and devices – Package and interface standards, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

1 Scope
This part of IEC 62148 covers the design guidelines of the electrical interface for photonic
integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon
fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA
package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-731, International Electrotechnical Vocabulary – Chapter 731: Optical fibre
communication (available at www.electropedia.org)
IEC TR 61931, Fibre optic – Terminology
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-731,
IEC TR 61931 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
silicon fine-pitch ball grid array
S-FBGA
device composed of silicon die, dielectric layer(s) on the die, rerouting wires from the die pads
to outer balls on the dielectric layer(s), and outer balls with heights more than 0,1 mm
Note to entry: This note only applies to the French language.

IEC 62148-21 ®
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)
Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface –
Partie 21: Lignes directrices en matière de conception de l’interface électrique
des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium
(S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en
silicium (S-FLGA)
– 2 – IEC 62148-21:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13

Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing . 8
Figure 3 – Array of terminal-existence areas . 8

Table 1 – Dimensions and tolerances . 9
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 11
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 12
D E
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clea
...

IEC 62148-21 ®
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –
Part 21: Design guidelines of electrical interface of PIC packages using silicon
fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array
(S‑FLGA)
Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface –
Partie 21: Lignes directrices en matière de conception de l’interface électrique
des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium
(S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en
silicium (S-FLGA)
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IEC 62148-21 ®
Edition 2.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –

Part 21: Design guidelines of electrical interface of PIC packages using silicon

fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array

(S‑FLGA)
Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface –

Partie 21: Lignes directrices en matière de conception de l’interface électrique

des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium

(S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en

silicium (S-FLGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 33.180.20 ISBN 978-2-8322-1019-2

– 2 – IEC 62148-21:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13

Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing . 8
Figure 3 – Array of terminal-existence areas . 8

Table 1 – Dimensions and tolerances . 9
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 11
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 12
D E
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62148-21 has been prepared by subcommittee 86C: Fibre optic systems and active devices,
of IEC technical committee 86: Fibre optics. It is an International Standard.
This second edition cancels and replaces the first edition published in 2019. This edition
constitutes a technical revision.
This edition includes the following significant technical change with respect to the previous
edition: specification of an electric guard band area around the optical terminal area, so as to
allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).

– 4 – IEC 62148-21:2021 © IEC 2021
The text of this International Standard is based on the following documents:
CDV Report on voting
86C/1684/CDV 86C/1710/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62148 series, published under the general title Fibre optic active
components and devices – Package and interface standards, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guidelines of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

1 Scope
This part of IEC 62148 covers the design guidelines of the electrical interface for photonic
integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon
fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA
package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-731, International Electrotechnical Vocabulary – Chapter 731: Optical fibre
communication (available at www.electropedia.org)
IEC TR 61931, Fibre optic – Terminology
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-731,
IEC TR 61931 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
silicon fine-pitch ball grid array
S-FBGA
device composed of silicon die, dielectric layer(s) on the die, rerouting wires from the die pads
to outer balls on the dielectric layer(s), and outer balls with heights more than 0,1 mm
3.2
silicon fine-pitch land grid array
S-FLGA
device composed of silicon die, dielectric layer(s) on the die, rerouting wires from the die pads
to outer lands on the dielectric layer(s), and outer lands with heights of 0,1 mm or less

– 6 – IEC 62148-21:2021 © IEC 2021
4 Terminal position numbering
When a package is viewed from the terminal side with the index corner in the bottom left corner
position, terminal rows are lettered from bottom to top starting with A, then B, C…, AA, AB, etc.;
whereas terminal columns are numbered from left to right starting with 1. Terminal positions are
designated by a row-column grid system and shown as alphanumeric identification, for example
A1, B1. The letters I, O, Q, S, X and Z shall not be used for naming the terminal rows.
5 Code of package nominal dimensions
A code of package nominal dimensions is defined as the combination of package length E and
width D, which are shown to the second decimal place in millimetres.
6 Symbols and drawings
Figure 1 shows the dimensions of the package and the outline of the electrical interface for S-
FBGA and S-FLGA. Figure 1 also shows the dimensions of the optical terminal area and its
guard band area. The electrical terminal is freely allocated to the terminal positions defined by
the cross points of the row-column grid numbers, as long as its position is outside of the optical
terminal guard band area. The optical interface shall be designed within the optical terminal
area. Figure 2 and Figure 3 indicate the mechanical gauge drawing and its array of electrical
terminal existence area. Figure 2 shows the electrical terminal existing area referred to data S,
A and B. Figure 3 shows the electrical terminal existing area referred to datum S.

NOTE The letter symbols used in the figure are listed and described in Table 1.
a
Datum S is the seating plane on which a package stays.
b
The hatched zone is an index-marking area indicating A1 corner.
c
True positional tolerances of terminals x1 and x2 are applied to all terminals.
d
The terminal diameter b is the maximum diameter of the ball as measured in a plane parallel to the seating plane.
Figure 1 – S-FBGA and S-FLGA outline

– 8 – IEC 62148-21:2021 © IEC 2021

NOTE The letter symbols used in the figure are listed and described in Table 1.
Figure 2 – Mechanical gauge drawing

NOTE The letter symbols used in the figure are listed and described in Table 1.
Figure 3 – Array of terminal-existence areas
7 Dimensions and tolerances
Table 1 specifies the tolerance of each symbol parameter; Table 2 and Table 3 indicate the
options of D, E, M and M .
D E
Table 1 – Dimensions and tolerances
Recommended
Term Symbol Specification Notes
value
Code of package D × E Code of package nominal dimension is
nominal dimensions defined as the combination of package
width D and package length E, which - -
are shown in the second decimal
place
Package width D Package width is shown in the second V denotes
D
decimal place
tolerance.
Package width D
nom
Minimum 0,50
Maximum 10,00
Tolerance V ±0,05
D
Package length E Package length is shown in the V denotes
E
second decimal place
tolerance
Package length E
nom
Minimum 0,50
Maximum 10,00
Tolerance V ±0,05
E
Profile height A When A is ≤ 0,65, the tolerance of A includes
nominal height is ±0,07. package
warpage and
When 0,8 ≤ A ≤ 1,0, the tolerance of
tilt allowances.
nominal height is ±0,10.
A shall not exceed 1,0.
Stand-off height A1 1) For S-FBGA (informative)
e: 0,3 b : 0,2
nom
min. 0,1
nom. 0,15
max. 0,2
For low stand-off S-FBGA
A1 ≤ 0,20
2) For S-FLGA
e: 0,25
A1 ≤ 0,10
Terminal pitch e 1) For S-FBGA (informative)
0,3
2) For S-FLGA
0,25
Terminal diameter b 1) For S-FBGA (informative)
e: 0,3
min.  0,17
nom. 0,20
max. 0,23
2) For S-FLGA
e: 0,25
min.  0,10
nom. 0,13
max. 0,16
Datum-based x1 x1 = 0,08
positional tolerance
of terminals
– 10 – IEC 62148-21:2021 © IEC 2021
Recommended
Term Symbol Specification Notes
value
Relative positional x2 1) For S-FBGA (informative)
tolerance of
e: 0,3  x2 = 0,03
terminals
2) For S-FLGA
e:0,25  x2 = 0,03
Coplanarity y 1) For S-FBGA (informative)
e: 0,3  y = 0,05
2) For S-FLGA
e: 0,25  y = 0,05
Parallelism of the top y1 y1 = 0,08
surface
Number of terminals n n = M x M Numbers of
D E
matrices in M
E
Maximum matrix size M
E
(M – 1) x M
D E and M are
in length
D
Maximum matrix size M
shown in
D
M x (M – 1)
D E
in width
Table 3.
(M – 1) x (M – 1)
D E
M ≤ (E – b – V – x1 – x2)/e + 1
E max E
M ≤ (D – b – V – x1 – x2)/e + 1
D max D
Overhang dimension Z Z = [D – (M – 1) × e ] / 2 - Reference
D D nom D
in width value
Overhang dimension Z Z = [E – (M – 1) × e ] / 2 - Reference
E E nom E
in length value
Datum-defined b3 b3 = b + x1
max
terminal existence
area
Relative terminal b4 b4 = b + x2
max
existence area
Relative optical D Design value
O
terminal area datum
position along with
width
Width of optical D Design value
OL
terminal area
Relative optical E Design value
O
terminal area datum
position along with
length
Length of optical E
Design value
OL
terminal area
Guard band length G Design value
NOTE Dimensions are in millimetres.

Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA (informative)
D E
BGA b = 0,23
max
D or E M or M M − 1 or M − 1
D E D E
mm
0,69 to 0,98 2 -
0,99 to 1,28 3 2
1,29 to 1,58 4 3
1,59 to 1,88 5 4
1,89 to 2,18 6 5
2,19 to 2,48 7 6
2,49 to 2,78 8 7
2,79 to 3,08 9 8
3,09 to 3,38 10 9
3,39 to 3,68 11 10
3,69 to 3,98 12 11
3,99 to 4,28 13 12
4,29 to 4,58 14 13
4,59 to 4,88 15 14
...