IEC TS 60286-6-1:2023

IEC TS 60286-6-1 ®
Edition 1.0 2023-11
TECHNICAL
SPECIFICATION
colour
inside
Packaging of components for automatic handling –
Part 6-1: Bulk case packaging for miniaturized surface mounting components

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IEC TS 60286-6-1 ®
Edition 1.0 2023-11
TECHNICAL
SPECIFICATION
colour
inside
Packaging of components for automatic handling –

Part 6-1: Bulk case packaging for miniaturized surface mounting components

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020  ISBN 978-2-8322-7707-2

– 2 – IEC TS 60286-6-1:2023 © IEC 2023
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Requirements for the bulk case . 6
4.1 Case outline . 6
4.2 Shutter mechanism . 7
4.3 Dimensions . 7
4.4 Material . 9
4.5 Mechanical characteristics of the bulk case . 10
4.5.1 Mechanical stability . 10
4.5.2 Performance and test methods . 10
5 Marking of the bulk case . 10
5.1 General . 10
5.2 Recycling . 10
Annex A (informative) Packing capacity . 11
A.1 Component types . 11
A.2 Component quantities . 11
Annex B (informative) Label information. 12
B.1 Label material . 12
B.2 Label adhesion . 12
B.3 Label content . 12
Annex C (informative) Examples of requirements and test methods . 13
Bibliography . 14

Figure 1 – Bulk case – General view . 7
Figure 2 – Bulk case – Photographic view . 7
Figure 3 – Dimensions of the bulk case . 8
Figure B.1 – Example of a label with bar code . 12
Figure B.2 – Example of a label with a 2D symbol . 12
Figure B.3 – Example of a label with bar code and a 2D symbol . 12

Table 1 – Size codes for components . 6
Table 2 – Dimension of the bulk case . 9
Table A.1 – Typical quantities of Capacitors in the bulk case . 11
Table A.2 – Typical quantities of Resistors in the bulk case . 11
Table C.1 – Examples of requirements and test methods for the bulk case . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 6-1: Bulk case packaging for miniaturized
surface mounting components
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC TS 60286-6-1 has been prepared by IEC technical committee 40: Capacitors and resistors
for electronic equipment. It is a Technical Specification.
The text of this Technical Specification is based on the following documents:
Draft Report on voting
40/3038/DTS 40/3066/RVDTS
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Specification is English.

– 4 – IEC TS 60286-6-1:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at https://www.iec.ch/members_experts/refdocs. The main document types developed by IEC
are described in greater detail at https://www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 60286 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

INTRODUCTION
This Technical Specification was developed by the Technical Committee 40 Working group 36
on Components Packaging, in which the members such as assembly machine manufacturers,
component manufacturers and packaging material manufacturers had proposed, considered
and discussed the possible standardization on the application of a new type of bulk case to
contain smaller sizes of SMD, aiming to supplement IEC 60286-6 Edition 2.0, issued in 2004.
NOTE For size limitations of components, see Annex A, Table A.1 and Table A.2.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed
that compliance with this document may involve the use of a patent concerning “storage case
for surface mounting electronic components” .
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
free of charge with applicants throughout the world for claims related to the items described in
this document. In this respect, the statement of the holder of this patent right is registered with
IEC. Information may be obtained from the patent database available at patents.iec.ch.
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.

___________
Patent Application No.: PCT/JP2021/023093, published 17.06.2021

– 6 – IEC TS 60286-6-1:2023 © IEC 2023
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 6-1: Bulk case packaging for miniaturized
surface mounting compone
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