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IEC 60115-2:2023

(Main)

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)

IEC 60115-2:2023 is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards.
These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique.
The object of this document is to state preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.
This edition includes the following significant technical changes with respect to the previous edition:
the definitions of product technologies and product classification levels of the generic specification, IEC 60115‑1:2020, have been adopted;
the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA_0922 has been removed;
a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
the 'period-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been adopted as default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4;
the revised solderability test of IEC 60115‑1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20;
the combined solvent resistance test of IEC 60115‑1:2020, 11.3 has been adopted in 5.3.22;
the 'endurance at room temperature test' of IEC 60115‑1:2020, 7.2 (prior IEC 60115 2:2014, Annex C) has been adopted as an optional test in 5.4.1;
the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.2;
climatic tests for 'operation at low temperature' of IEC 60115‑1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional tests in 5.4.4 and 5.4.5, respectively;
new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2;
the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
the revised test clause numbering of IEC 60115‑1:2020 has been applied;
a new Annex C has been added to summarize workmanship requirements for the assembly of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
the informative Annex F (prior Annex B) on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly.

Résistances fixes utilisées dans les équipements électroniques - Partie 2: Spécification intermédiaire: Résistances à broches à couche, à faible dissipation, pour assemblage par trous traversants sur cartes de circuit imprimé (carte THT)

L’IEC 60115-2:2023 s’applique aux résistances fixes à couche, à faible dissipation, équipées de broches de sortie, utilisées dans les équipements électroniques, et qui sont généralement assemblées sur les cartes de circuit imprimé au moyen de la technologie à trous traversants (THT).
Ces résistances sont généralement décrites selon des types (différentes formes géométriques), des modèles (différentes dimensions) et des technologies de produit. L’élément résistif de ces résistances est généralement protégé par un revêtement de vernis enrobant. Ces résistances comportent des fils de sortie et sont principalement destinées à être montées sur une carte de circuits avec la technique des trous traversants.
Le présent document a pour objet d’énoncer les caractéristiques assignées et les caractéristiques préférentielles, de choisir dans l’IEC 60115-1 les procédures d’assurance de la qualité et les méthodes d’essai et de mesure appropriées, et de fixer les exigences de performances générales pour ce type de résistance.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) adoption des définitions des technologies de produit et des niveaux de classification de produit de la spécification générique, IEC 60115-1:2020;
b) examen des dimensions préférentielles du Tableau 1, et suppression de l’ancien modèle RA_0922;
c) amendement en 4.2 d’une base pour la spécification facultative de l’excentricité des broches, pour les résistances à broches axiales;
d) intégration en 5.3.8, en tant que méthode d’essai par défaut, de l’"essai de surcharge haute tension à impulsions périodiques" donné dans l’IEC 60115‑1:2020, 8.3, entraînant le remplacement de l’ancien "essai de surcharge à impulsions périodiques" donné dans l’IEC 60115‑1:2020, 8.4;
e) intégration en 5.3.19 et 5.3.20 de la révision de l’essai de brasabilité de l’IEC 60115‑1:2020, 11.1;
f) intégration en 5.3.22 de l’essai de résistance au solvant combiné de l’IEC 60115‑1:2020, 11.3;
g) intégration en 5.4.1, en tant qu’essai facultatif, de "l’essai d’endurance à la température ambiante" donné dans l’IEC 60115‑1:2020, 7.2 (figurant anciennement dans l’IEC 60115‑2:2014, Annexe C);
h) ajout de la forme d’ondes des impulsions 1,2/50 comme variante facultative en 5.4.2 à "l’essai de surcharge haute tension à une seule impulsion" donné dans l’IEC 60115‑1:2020, 8.2, appliqué avec la forme d’ondes des impulsions 10/700 spécifiée en 5.3.7;
i) intégration en tant qu’essais facultatifs des essais climatiques relatifs au "fonctionnement à basse température" de l’IEC 60115-1:2020, 10.2, et à "chaleur humide, essai continu, accéléré" de l’IEC 60115-1:2020, 10.5, respectivement en 5.4.4 et 5.4.5;
j) ajout de nouvelles recommandations en 6.2 sur la présentation des exigences de stabilité, ainsi que leurs écarts absolus et relatifs admis;
k) ajout de critères d’acceptation pour l’examen visuel en 6.5 et à l’Annexe B;
l) ajout d’un examen visuel pour l’emballage principal et l’emballage de proximité en 6.5.2 et en 7.2;
m) ajout de l’évaluation périodique des revêtements des sorties comme nouveau sujet de l’évaluation de la qualité en 9.8;
n) application de la numérotation corrigée des articles sur les essais de l’IEC 60115-1:2020;
o) ajout d’une nouvelle Annexe C pour synthétiser les exigences relatives à la qualité d’exécution pour l’assemblage de résistance à broches à couche, par exemple celles données dans l’ancienne série de normes IEC 61192;
p) amendement de l’Annexe F informative (anciennement Annexe B) sur les modèles à broches orientées radialement, en y intégrant des informations sur un modèle à courbure en Z, pour montage en surface.

General Information

Status
Published
Publication Date
14-Feb-2023
ICS
31.040.10 - Fixed resistors
Technical Committee
TC 40 - Capacitors and resistors for electronic equipment
Drafting Committee
MT 60115-2 - TC 40/MT 60115-2
Current Stage
PPUB - Publication issued
Start Date
20-Mar-2023
Completion Date
15-Feb-2023
Ref Project

Relations

Revises
IEC 60115-2:2014 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
Effective Date
05-Sep-2023

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IEC 60115-2:2023 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT) Released:2/15/2023IEC 60115-2:2023 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT) Released:2/15/2023
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IEC 60115-2:2023 - Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT) Released:2/15/2023
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IEC 60115-2 ®
Edition 4.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 2: Sectional specification: Low-power film resistors with leads for through-
hole assembly on circuit boards (THT)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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IEC 60115-2 ®
Edition 4.0 2023-02
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –

Part 2: Sectional specification: Low-power film resistors with leads for through-

hole assembly on circuit boards (THT)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6467-6

– 2 – IEC 60115-2:2023 © IEC 2023
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
3.1 Terms . 10
3.2 Product technologies . 11
3.3 Product classification . 11
4 Preferred characteristics . 11
4.1 General . 11
4.2 Style and dimensions . 11
4.2.1 Preferred styles and outline dimensions. 11
4.2.2 Length of excessive coating or welding bead . 13
4.2.3 Lead wire spacing . 13
4.2.4 Lead eccentricity . 14
4.3 Preferred climatic categories . 15
4.4 Resistance . 16
4.5 Tolerances on resistance . 16
4.6 Rated dissipation P . 16
4.7 Limiting element voltage U . 16
max
4.8 Insulation voltage U . 17
ins
4.9 Insulation resistance R . 17
ins
5 Tests and test severities . 17
5.1 General provisions for tests applied by this specification . 17
5.2 Preparation of specimens . 18
5.2.1 Drying . 18
5.2.2 Mounting of components on test boards . 18
5.2.3 Mounting of components on a test rack . 21
5.3 Details of applied tests . 23
5.3.1 Resistance . 23
5.3.2 Temperature coefficient of resistance . 23
5.3.3 Temperature rise . 23
5.3.4 Endurance at the rated temperature 70 °C . 23
5.3.5 Endurance at a maximum temperature: UCT . 24
5.3.6 Short-term overload . 24
5.3.7 Single-pulse high-voltage overload test . 25
5.3.8 Periodic-pulse high-voltage overload test . 26
5.3.9 Electrostatic discharge (ESD) test . 27
5.3.10 Visual examination . 27
5.3.11 Gauging of dimensions . 28
5.3.12 Detail dimensions . 28
5.3.13 Robustness of terminations . 28
5.3.14 Vibration . 29
5.3.15 Rapid change of temperature . 29
5.3.16 Rapid change of temperature, ≥ 100 cycles . 29
5.3.17 Climatic sequence . 29
5.3.18 Damp heat, steady state . 30

5.3.19 Solderability, with lead-free solder . 30
5.3.20 Solderability, with SnPb solder . 31
5.3.21 Resistance to soldering heat . 32
5.3.22 Solvent resistance . 32
5.3.23 Insulation resistance . 32
5.3.24 Voltage proof . 32
5.3.25 Flammability . 33
5.4 Optional and/or additional tests . 33
5.4.1 Endurance at room temperature . 33
5.4.2 Single-pulse high-voltage overload test . 34
5.4.3 Periodic-pulse overload test . 34
5.4.4 Operation at low temperature. 35
5.4.5 Damp heat, steady state, accelerated . 35
6 Performance requirements. 36
6.1 General . 36
6.2 Limits for change of resistance at tests . 36
6.3 Temperature coefficient of resistance . 39
6.4 Temperature rise . 39
6.5 Visual examination . 40
6.5.1 General visual criteria . 40
6.5.2 Visual criteria after tests . 40
6.5.3 Visual criteria for the packaging . 40
6.6 Solderability . 40
6.7 Insulation resistance . 41
6.8 Flammability . 41
7 Marking, packaging and ordering information . 41
7.1 Marking of the component . 41
7.2 Packaging . 41
7.3 Marking of the packaging . 41
7.4 Ordering information . 42
8 Detail specifications . 42
8.1 General . 42
8.2 Information to be specified in a detail specification . 42
8.2.1 Outline drawing or illustration . 42
8.2.2 Style and dimensions . 42
8.2.3 Climatic category . 43
8.2.4 Resistance range . 43
8.2.5 Tolerances on resistance . 43
8.2.6 Rated dissipation P . 43
8.2.7 Limiting element voltage U . 43
max
8.2.8 Insulation voltage U . 43
ins
8.2.9 Insulation resistance R . 43
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 44
8.2.14 Ordering information . 44
8.2.15 Mounting . 44

– 4 – IEC 60115-2:2023 © IEC 2023
8.2.16 Storage. 44
8.2.17 Transportation .
...

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IEC 60115-8-1:2014(Main)
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G

IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition:
- It includes minor revisions related to tables, figures and references.
- Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals.
- Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules.
- Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic.
- Adition of a test for the immunity against electrostatic discharge.
- Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests.
- Addition of information relevant for the component user in his assembly process.
- Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.

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    89 pages
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IEC
IEC 60115-2:2014(Main)
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors

IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition:
- it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a "zero defect" approach;
- it introduces a product classification based on application requirements;
- it includes an extension of the list of styles and dimensions;
- it includes the use of an extended scope of stability class definitions;
- it includes the extension of the lists of preferred values of ratings;
- it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- it includes a new set of severities for a shear test;
- it includes definitions for a test board;
- it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- it includes requirements applicable to 0-ohm resistors (jumpers);
- it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles;
- it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.

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    139 pages
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IEC
IEC 60115-8:2009(Main)
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

IEC 60115-8:2009 is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions). They have metallized terminations and are primarily intended to be mounted directly on to a circuit board. The major technical changes with regard to the first edition are the following:
- introduction of a product classification based on application requirements;
- extension of the list of styles and dimensions;
- use of an extended scope of stability class definitions;
- extension of the lists of preferred values of ratings;
- inclusion of test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD);
- inclusion of a new set of severities for a shear test;
- inclusion of definitions for a test board;
- replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a "zero defect" approach;
- inclusion of an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test;
- inclusion of requirements applicable to 0 ohm resistors (jumpers).

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    41 pages
    English language
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  • Standard
    84 pages
    English and French language
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