Fixed resistors for use in electronic equipment - Part 4-10: Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

IEC 60115-4-10:2023(E) is applicable to the drafting of detail specifications for fixed power resistors with leads, classified to level G, which is defined in IEC 60115‑1:2020, 3.4 for general electronic equipment. It is a supplementary document to the sectional specification and contains requirements for style, layout and minimum contents of detail specifications.

General Information

Status
Published
Publication Date
14-Dec-2023
Current Stage
PPUB - Publication issued
Start Date
11-Jan-2024
Completion Date
15-Dec-2023
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IEC 60115-4-10:2023 - Fixed resistors for use in electronic equipment - Part 4-10: Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G Released:12/15/2023 Isbn:9782832279595
English language
47 pages
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IEC 60115-4-10 ®
Edition 1.0 2023-12
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –
Part 4-10: Blank detail specification: Power resistors with axial leads for
through-hole assembly on circuit boards (THT), for general electronic
equipment, classification level G

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IEC 60115-4-10 ®
Edition 1.0 2023-12
INTERNATIONAL
STANDARD
Fixed resistors for use in electronic equipment –

Part 4-10: Blank detail specification: Power resistors with axial leads for

through-hole assembly on circuit boards (THT), for general electronic

equipment, classification level G

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10  ISBN 978-2-8322-7959-5

– 2 – IEC 60115-4-10:2023 © IEC 2023
CONTENTS
FOREWORD . 5
0 Introduction to the template provided by this blank detail specification. 7
0.1 Scope of this blank detail specification . 7
0.2 Function of this blank detail specification . 7
0.3 Identification of the detail specification and the resistor . 8
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 11
4 Characteristics and ratings . 11
4.1 General . 11
4.2 Dimensions . 11
4.3 Ratings . 13
4.4 Resistance range and tolerance on resistance . 15
5 Tests and test severities . 16
5.1 General . 16
5.2 Resistance . 16
5.3 Temperature coefficient of resistance . 17
5.4 Temperature rise . 17
5.5 Endurance at the rated temperature 70 °C . 17
5.6 Endurance at other than rated temperature . 17
5.6.1 Endurance at room temperature . 17
5.6.2 Endurance at a maximum temperature: UCT with category dissipation . 17
5.7 Short-term overload of power resistors. 17
5.7.1 Power film resistors . 17
5.7.2 Wirewound resistors . 18
5.8 Electrostatic discharge (ESD) test . 18
5.9 Visual examination . 18
5.10 Gauging of dimensions . 19
5.11 Detail dimensions . 19
5.12 Robustness . 19
5.12.1 Robustness of terminations . 19
5.12.2 Robustness of the resistor body . 19
5.13 Shock and vibration . 19
5.13.1 Vibration . 19
5.13.2 Shock or bump . 19
5.14 Rapid change of temperature . 19
5.15 Climatic sequence. 20
5.16 Damp heat, steady state test. 20
5.17 Solderability, with lead-free solder . 21
5.18 Solderability, with SnPb solder . 21
5.19 Resistance to soldering heat . 21
5.20 Solvent resistance test . 21
5.21 Insulation resistance . 22
5.22 Voltage proof . 22
5.23 Flammability test . 22
6 Performance requirements. 22

6.1 General . 22
6.2 Limits for change of resistance at tests . 22
6.3 Temperature coefficient of resistance . 23
6.4 Temperature rise . 24
6.5 Visual examination . 24
6.5.1 General visual criteria . 24
6.5.2 Visual criteria after tests . 25
6.5.3 Visual criteria for packaging . 25
6.6 Solderability . 25
6.7 Insulation resistance . 25
6.8 Flammability . 26
7 Marking, packaging and ordering information . 26
7.1 Marking of the component . 26
7.2 Packaging . 26
7.3 Marking of the packaging . 26
7.4 Ordering information . 26
8 Additional information . 27
8.1 General . 27
8.2 Storage and Transportation . 27
8.3 Substrate for assembly . 27
8.4 Soldering process . 27
8.5 Use of cleaning agents or solvents . 27
8.6 Coating or potting after assembly . 28
9 Quality assessment procedures . 28
9.1 General . 28
9.1.1 100 % test . 28
9.1.2 Certificate of Conformity (CoC) . 28
9.1.3 Certified test records of released lots . 29
9.2 Qualification approval . 29
9.3 Maintenance of a qualification approval . 29
9.3.1 Quality conformance inspection . 29
9.3.2 Non-conforming specimen . 29
Annex A (normative) Symbols and abbreviated terms . 41
A.1 Symbols . 41
A.2 Abbreviated terms . 43
Annex B (normative) Reference for visual examination . 44
Annex X (informative) Cross-reference for references to the prior revision of this
specification. 45
Bibliography . 46

Figure 1 – Outline and dimensions . 12
Figure 2 – Lead eccentricity of the wire terminations . 13
Figure 3 – Length of excessive coating on the wire terminations . 13
Figure 4 – Derating curve for power resistors . 15

Table 1 – Styles and dimensions. 12
Table 2 – Climatic categories . 14

– 4 – IEC 60115-4-10:2023 © IEC 2023
Table 3 – Ratings. 14
Table 4 – Temperature coefficients, tol
...

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