IEC 62025-2:2019

IEC 62025-2 ®
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
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inside
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics

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IEC 62025-2 ®
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Non-electrical characteristics and

measuring methods –
Part 2: Test methods for non-electrical characteristics

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.100.10 ISBN 978-2-8322-7432-3

– 2 – IEC 62025-2:2019 RLV  IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Test conditions . 7
4.1 Standard atmospheric conditions for test . 7
4.2 Referee conditions . 7
5 Mechanical characteristics test . 8
5.1 Body strength test . 8
5.1.1 Body strength test procedures . 8
5.1.2 Information to be given in the detail specification . 9
5.2 Robustness of terminations (electrodes) . 9
5.2.1 Resistance to bending of printed-circuit board . 9
5.2.2 Adherence test (see test of Ue of IEC 60068-2-21) . 13
5.3 Solderability . 15
5.3.1 General . 15
5.3.2 Preconditioning . 15
5.3.3 Initial measurement . 15
5.3.4 Test method . 15
5.3.5 Recovery . 17
5.3.6 Final measurement . 17
5.3.7 Items to be specified in detail specification . 17
5.4 Resistance to soldering heat . 18
5.4.1 General . 18
5.4.2 Preconditioning . 18
5.4.3 Initial measurement . 18
5.4.4 Test method . 18
5.4.5 Recovery . 19
5.4.6 Final measurement . 19
5.4.7 Items to be specified in detail specification . 19
5.5 Resistance to dissolution of metallization . 20
5.5.1 General . 20
5.5.2 Preconditioning . 20
5.5.3 Initial measurement . 20
5.5.4 Test methods . 20
5.5.5 Final measurements . 20
5.5.6 Items to be specified in detail specification . 21
5.6 Vibration . 21
5.6.1 Test equipment . 21
5.6.2 Preparation . 21
5.6.3 Test method . 21
5.6.4 Items to be specified in detail specification . 21
5.7 Resistance to shock . 22
5.7.1 Mechanical shock method . 22
5.7.2 Items to be specified in detail specification . 22

Annex A (normative) Mounting of surface mounting inductor on test printed-circuit
board . 23
A.1 General . 23
A.2 Mounting printed-circuit board and mounting land . 23
A.3 Solder . 23
A.4 Preparation . 24
A.5 Preheating . 24
A.6 Soldering . 24
A.7 Cleaning . 24

Figure 1 – Method for pressurizing the body . 8
Figure 2 – Pressurizing jig . 9
Figure 3 – Example of printed-circuit board . 10
Figure 4 – Layout . 12
Figure 5 – Pressurizing jig . 12
Figure 6 – Pressurizing . 12
Figure 7 – Pressurizing and shape of jig . 14
Figure 8 – Reflow temperature profile . 17

Table 1 – Size of soldering lands according to the code of multi-layer chip inductors . 10
Table 2 – Thickness of solder paste by the size code of inductors . 11
Table 3 – Conditions of immersion into solder . 16
Table 4 – Reflow temperature . 16
Table 5 – Severity . 18
Table 6 – Reflow temperature . 19
Table 7 – Conditions of vibration . 21

– 4 – IEC 62025-2:2019 RLV  IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 2: Test methods for non-electrical characteristics

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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This redline version of the official IEC Standard allows the user to identify the changes
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International Standard IEC 62025-2 has been prepared by IEC technical committee 51:
Magnetic components, ferrite and magnetic powder materials.
This second edition cancels and replaces the first edition published in 2005. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) revision of Table 5;
b) revision of normative references.
The text of this standard is based on the following documents:
CDV Report on voting
51/1273/CDV 51/1301/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62025 series, published under the general title High frequency
inductive components – Non-electrical characteristics and measuring methods, can be found
on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 62025-2:2019 RLV  IEC 2019
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 2: Test methods for non-electrical characteristics

1 Scope
This part of IEC 62025 specifies a test method for the non-electrical characteristics of the
surface mounted device (SMD) inductors to be used for electronic and telecommunication
equipment. The object of this part of this document is to define methods for measuring
mechanical performance only. As the reliability performances and specifications relative to
non-electrical performances are defined in IEC 62211, detailed measuring methods for
mechanical performance of reliability testing are defined in this document.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60068-2-6:19952007, Environmental testing – Part 2: Tests – Test Fc: Vibration
(sinusoidal)
IEC 60068-2-20:1979, Environmental testing – Part 2-20: Tests – Test T: Soldering Test
methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21:19992006, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27:1987, Environmental testing – Part 2-27: Tests – Test Ea and guidance:
Shock
IEC 60068-2-45:1980, Basic environmental testing procedures – Part 2-45: Tests – Test XA
and guidance: Immersion in cleaning solvents
IEC 60068-2-45:1980/AMD1:1993
IEC 60068-2-58:20042015, Environmental testing – Part 2-58: Tests – Test Td: Test methods
for solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-58:2015/AMD1:2017
IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing
of electronic components for surface mount technology and printed boards by the wetting
balance (force measurement) method
IEC 60068-2-77:1999, Environmental testing – Part 2-77: Tests – Test 77: Body strength and
impact shock
IEC 61188-5-2:2003, Printed boards and printed board assemblies – Design and use – Part 5-
2: Attachment (land/joint) considerations – Discrete components

IEC 61190-1-2:20022014, Attachment materials for electronic assembly – Part 1-2:
Requirements for soldering pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3:2002, Attachment materials for electronic assembly – Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic
soldering applications
IEC 62211:20032017, Inductive components – Reliability management
3 Terms and definitions
For the purpose of this part of IEC 62025, the terms and definitions given in the normative
references apply.
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Test conditions
4.1 Standard atmospheric conditions for test
Unless otherwise specified in the detail specification, the tests and measurements shall be
carried out under the standard atmospheric conditions for test as given in 5.3.1 the
requirements for standard reference atmosphere of IEC 60068-1:
– temperature: 15 °C to 35 °C;
– relative humidity: 25 % to 75 %;
– air pressure: 86 kPa to 106 kPa.
In the event of dispute or where required, the measurements shall be repeated using the
referee temperatures (as given in 4.2) and such other conditions as are prescribed specified
in this document.
In addition, when it is difficult to make measurements in standard atmospheric conditions,
unless a doubt arises about the validity of the result, the tests and measurements may be
performed in non-standard atmospheric conditions.
4.2 Referee conditions
For referee purposes, one of the standard atmospheric conditions for referee tests taken from
5.2 the requirements for standard atmospheres for referee measurements and tests of
IEC 60068-1, shall be selected and shall be as follows:
– temperature: 20 °C ± 2 °C;
– relative humidity: 60 % to 70 %;
– air pressure: 86 kPa to 106 kPa.

– 8 – IEC 62025-2:2019 RLV  IEC 2019
5 Mechanical characteristics test
5.1 Body strength test
5.1.1 Body strength test procedures
The body strength test procedure, as referenced specified in IEC 60068-2-77, shall be as
follows:
a) Preconditioning
If required, preconditioning shall be performed on the specimens in accordance with the
detail specification.
b) Initial measurement
The appearance of the specimen shall be checked with a magnification of at least 10×
under adequate light.
If specified in the detail specification, the electrical performances shall be measured.
c) Layout
Unless otherwise specified in the detail specification, the specimen shall be placed on
the supporting base, as shown in Figure 1, so that both ends of the specimen are
symmetrically positioned on the supporting base. The test table shall be placed on a plane,
robust platform so that the test result shall is not be affected when a force is applied.
Dimensions en millimètres
NOTE The angle of the taper in part A shall be between 70° and 90°.
Figure 1 – Method for pressurizing the body
d) Applied force
The force shall be applied to the centre of the specimen by the pressurizing jig as shown
in Figure 2, for a duration of (10 ± 1) s. Unless otherwise specified in the detail
specification, the force shall be selected from either (one of) 10 N, 20 N or 30 N.
If specified in the detail specification, the electrical performances shall be measured
during the application of the force.

Dimensions in millimetres
NOTE 1 Dimension W of the pressurizing jig is wider than the width of the specimen.
NOTE 2 Hardness: HV 500 and more.
NOTE 3 When the length of the specimen is 2 mm or less, the radius of the pressurizing jig should be 0,2 mm.
Figure 2 – Pressurizing jig
e) Recovery
If required, recovery conditioning shall be performed for the specimens in accordance with
the detail specification.
f) Final measurement
After the test, the appearance of the specimen shall be checked with a magnification of at
least 10× under adequate light. There shall be no signs of damage such as cracks or flaws.
If specified in the detail specification, the electrical performances shall be measured.
5.1.2 Information to be given in the detail specification
The following information shall be given in the detail specification:
a) preconditioning (if required) – see 5.1.1.a);
b) initial measurement items, final measurement items (if required) – see 5.1.1.b) and f);
c) measurement during applied force (if required) – see 5.1.1.d);
d) recovery (if required) – see 5.1.1.e).
5.2 Robustness of terminations (electrodes)
5.2.1 Resistance to bending of printed-circuit board
5.2.1.1 General
The test for the resistance of terminations and electrodes mounted on a printed-circuit board
shall be as follows.
5.2.1.2 Specification of soldering lands
The soldering lands of multi-layer chip inductors shall be designed according to Table 1, as
specified in 11.5 of IEC 61188-5-2. With regard to inductors, except for those specified in
IEC 61188-5-2, the size of the solder lands shall be specified in the detail specification.

– 10 – IEC 62025-2:2019 RLV  IEC 2019
Table 1 – Size of soldering lands by according to the code
of multi-layer chip inductors
Dimensions in millimetres
Size code a b c
1005 0,65 0,55 0,50
1608 0,95 0,85 0,50
2012 1,45 1,10 0,50
3216 1,80 1,30 1,20
3225 2,70 1,05 1,80
4532 3,40 1,10 3,00
5650 5,30 1,30 3,70
NOTE Tolerance: 0,05 mm; see Figure 3.

5.2.1.3 Specification of printed-circuit board
The printed-circuit board shall be made of epoxide woven glass (FR4) as specified in
IEC 60068-2-21, and, unless specified in the detail specification, the printed-circuit board
shall be as shown in Figure 3. The dimension of W shall be specified in the detail specification.
Dimensions in millimetres
Key
solderable areas
non-solderable areas (covered with non-solderable lacquer)
Materials of substrate: epoxide woven glass (FR4)
Thickness: 1,6 mm ± 0,2 mm (for size code from 1608)
Thickness: 0,8 mm ± 0,1 mm (for size code up to 1005)
Conductors: copper
Thickness: 0,035 mm ± 0,010 mm
NOTE When the board is designed to mount more than two specimens, allow sufficient space between
specimens so as not to influence the test result. Dimensions not given shall be chosen according to the design and
size of the specimen to be tested.
Figure 3 – Example of printed-circuit board

5.2.1.4 Mounting of specimen
The specimen shall be mounted on the printed-circuit board in accordance with Annex A and
other specifications as mentioned below.
a) The solder paste shall be placed on the soldering lands. The applied solder paste shall
cover the soldering lands completely. The thickness of the solder paste by according to
the size code of inductors is recommended in Table 2. The appropriate height of the filet
should be the smaller value of either 50 % of the thickness of the specimen or 0,5 mm.
Table 2 – Thickness of solder paste by the size code of inductors
Thickness of solder paste
Size code
µm
Up to 1608 100 to 150
From 2012 150 to 200
b) The specimen shall then be placed on the printed-circuit board. The terminations of the
specimen shall be placed on the soldering lands symmetrically in both horizontal and
vertical directions.
c) The printed-circuit board with the specimen shall be reflow soldered. Care shall be taken
when mounting the inductor on the printed-circuit board so that warp or twist does not
occur.
d) If specified in the detail specification, the printed-circuit board shall be cleaned according
to Annex A.
5.2.1.5 Preconditioning
Preconditioning shall be carried out as specified in the detail specification when pre-
conditioning is necessary.
5.2.1.6 Initial measurement
Prior to conducting the mechanical test, the appearance of the specimen and the soldered
parts shall be checked by using a magnifier with a magnification of at least 10× under
adequate light. If an abnormal or rejectable appearance is found, the specimen shall be
excluded from the evaluation on this test. The electrical performances shall be measured if
specified in the detail specification.
5.2.1.7 Bending tool
The bending tool shall be a support jig as shown in Figure 4 and a pressurizing jig as shown
in Figure 5. The radius of the pressurizing jig should be 5 mm. If specified in the detail
specification, the radius of the pressurizing jig may be 340 mm or 230 mm.
5.2.1.8 Layout
The printed-circuit board with the soldered specimen is placed on the support jig as shown in
Figure 4.
– 12 – IEC 62025-2:2019 RLV  IEC 2019
Dimensions in millimetres
(a) Front (b) Side
Figure 4 – Layout
5.2.1.9 Test
The printed-circuit board shall be bent by using the pressurizing jig as shown in Figure 5 at a
rate of (1 ± 0,5) mm/s and to the bending depth of 1 mm, 2 mm, 3 mm or 4 mm (see Figure 6).
The bending depth shall be specified in the detail specification. After reaching the specified
bending depth, it shall be maintained for (20 ± 1) s. Then the bending force shall be relaxed.
Unless specified in the detail specification, the number of bends shall be one.
Dimensions in millimetres
Key
R radius
Figure 5 – Pressurizing jig
NOTE The relative position between the centre of the specimen on the soldering land of the printed-circuit board
and the contact-line of the pressurizing jig on the printed-circuit board should does not exceed 0,5 mm.
Figure 6 – Pressurizing
5.2.1.10 Measurement during pressurizing
If specified in the detail specification, the measurement shall be carried out during
pressurizing in accordance with the provisions of the detail specification.
5.2.1.11 Recovery
If specified in the detail specification, the recovery shall be carried out in accordance with the
provisions of the detail specification.
5.2.1.12 Final measurement
The appearance of the specimen and the soldered parts shall be checked by using a
magnifier with a magnification of at least 10× under adequate light. In this case, abnormalities
such as peel and crack found at the solder joint shall not be treated as defects of the inductor.
If specified in the detail specification, the electrical performances shall then be measured.
5.2.1.13 Items to be specified in detail specification
The following items shall be specified in the detail specification.
a) Dimensions of land, if different from Table 1 (see 5.2.1.2).
b) Dimension of W of the testing printed-circuit board (see 5.2.1.3).
c) Applied solder (see 5.2.1.4).
d) Cleaning (if necessary) (see 5.2.1.4).
e) Preconditioning (if necessary) (see 5.2.1.5).
f) Initial measurement items (see 5.2.1.6).
g) Bending depth and number of bends (see 5.2.1.9).
h) Measurement during pressurizing (if necessary) (see 5.2.1.10).
i) Recovery (if necessary) (see 5.2.1.11).
j) Final measurement items (see 5.2.1.12).
5.2.2 Adherence test (see test of Ue of IEC 60068-2-21)
5.2.2.1 General
The test for the strength of adhesion against the side stress of the specimen mounted to on
the testing printed-circuit board shall be carried out as follows.
5.2.2.2 Mounting of specimen
The specimen shall be mounted to on the testing printed-circuit board specified in the detail
specification in accordance with the provisions of Annex A. Unless otherwise specified in the
detail specification, the printed-circuit board shall be as specified in 8.2 of IEC 60068-2-
21:2006.
5.2.2.3 Preconditioning
Preconditioning shall be carried out as specified in the detail specification on the specimen
when preconditioning is necessary.

– 14 – IEC 62025-2:2019 RLV  IEC 2019
5.2.2.4 Initial measurement
Prior to conducting the mechanical test, the appearance of the specimen and the soldered
parts shall be checked by using a magnifier with a magnification of at least 10× under
adequate light. If an abnormal or rejectable appearance is found, the specimen shall be
excluded from the evaluation on of this test. The electrical performances shall be measured if
specified in the detail specification.
5.2.2.5 Pressurizing
The specimen shall be mounted as shown in Figure 7. The force shall be gradually applied by
means of the pressurizing jig to the centre of the longitudinal side of the specimen in a
direction horizontal to the testing printed-circuit board. Unless otherwise specified in the detail
specification, the pressurizing force shall be 5 N and the duration shall be (10 ± 1) s.
Dimensions in millimetres
NOTE 1 Thickness of jig: thicker than the test surface of the specimen.
NOTE 2 R at the end: when the length of specimen is 2,0 mm or less, the radius of the pressurizing jig should be
is 0,2 mm.
NOTE 3 Width of jig: not specified.
Figure 7 – Pressurizing and shape of jig
5.2.2.6 Recovery
Recovery shall be carried out as specified in the detail specification on the specimens when
recovery is necessary.
5.2.2.7 Final measurement
The appearance of the specimen and the soldered parts shall be checked by using a
magnifier with a magnification of at least 10× under adequate light. In this case, abnormalities
such as peel and crack found at the solder joint shall not be treated as defects of the inductor.
If specified in the detail specification, the electrical performances shall then be measured.
5.2.2.8 Items to be specified in the detail specification
The following items shall be specified in the detail specification.
a) Testing printed-circuit board (see 5.2.2.2).
b) Applied solder (see 5.2.2.2).

c) Preconditioning (if necessary) (see 5.2.2.3).
d) Initial measurement items (see 5.2.2.4).
e) Pressurizing force (if necessary) (see 5.2.2.5).
f) Recovery (if necessary) (see 5.2.2.6).
g) Final measurement items (see 5.2.2.7).
5.3 Solderability
5.3.1 General
The test for solderability shall be in accordance with the provisions of IEC 60068-2-58 and
other specifications as mentioned below.
This part of IEC 62025 specifies a solder bath method and a reflow method for solderability.
If the wetting balance method is applied, this shall be specified in the detail specification in
accordance with the provisions of IEC 60068-2-69.
5.3.2 Preconditioning
Unless otherwise specified in the detail specification, the specimen shall be tested in the “as-
received” condition. Care should be taken that no contamination occurs, by contact with the
fingers or by other means.
When accelerated ageing is applied, one of the methods given in 4.5 the requirements for
accelerated ageing of IEC 60068-2-20 shall be specified in the detail specification.
5.3.3 Initial measurement
The appearance of the specimen shall be checked by using a magnifier with a magnification
of at least 10× under adequate light. If specified in the detail specification, the electrical
performances shall be measured.
5.3.4 Test method
5.3.4.1 Solder bath method
a) Solder bath
The solder bath dimensions shall comply with the requirements of 4.6.1 for solder bath of
IEC 60068-2-20.
b) Flux
The flux shall be the flux specified in 6.1.2 of IEC 60068-2-58.
c) Solder
The solder composition shall be in accordance with item a)1) or b)1) of Clause A.3.
d) Test procedure
The test procedure shall be in accordance with 6.2 the requirements for the test procedure
and conditions of IEC 60068-2-58. Unless otherwise specified in the detail specification,
the specimen shall be preheated to a temperature of 80 °C to 120 °C and maintained for
10 s to 30 s. The immersion and withdrawal speed shall be between 20 mm/s and 25 mm/s.
e) Conditions of immersion into solder
Unless otherwise specified in the detail specification, the conditions of immersion into the
solder shall be in accordance with Table 3.

– 16 – IEC 62025-2:2019 RLV  IEC 2019
Table 3 – Conditions of immersion into solder
Condition
Alloy composition
Temperature Duration
Lead-free solder (Sn-Ag-Cu) 245 °C ± 5 °C 3 s ± 0,3 s
2 s ± 0,2 s
Lead-containing solder 235 °C ± 5 °C
5 s ± 0,5 s
5.3.4.2 Solder reflow method
The reflow equipment should be forced gas convection.
a) Solder paste
The solder paste shall be in accordance with items a) or b) of Clause A.3.
b) Test substrates
The test substrate shall consist of ceramic (alumina 90 % to 98 %) or epoxide woven glass
(FR4). The dimensional details and number of specimen(s) to be tested shall be given in
the detail specification.
c) Preparation
The solder paste shall be coated on the lands and the specimen shall be placed in
accordance with Clause A.4.
d) Preheating
Unless otherwise specified in the detail specification, the specimen and test substrate
shall be preheated in accordance with Clause A.5.
e) Reflow temperature profile
Unless otherwise specified in the detail specification, the reflow temperature profile shall
be in accordance with Table 4 and Figure 8.
Table 4 – Reflow temperature
T T t T t T t
1 2 1 3 2 4 3
Alloy composition
s s s
°C °C °C °C
Lead-free solder
150 ± 5 180 ± 5 60 to 120 225 20 ± 5 235 –
(Sn-Ag-Cu)
Lead-containing
10 ± 1
solder 60 to 120 – –
150 ± 10 150 ± 10 215 ± 3 at T
NOTE See profile in Figure 8.
Figure 8 – Reflow temperature profile
5.3.5 Recovery
The flux residues shall be removed with a suitable solvent (see 3.1.2 the requirements for
solvents of IEC 60068-2-45).
5.3.6 Final measurement
The wetting shall be assessed visually under adequate light with a binocular microscope of
magnification in the range between 10× and 25×, in accordance with 9.3.1 of IEC 60068-2-58.
Then, if specified in the detail specification, the electrical performances shall be measured.
The final measurement shall be in accordance with the requirements of wetting of the final
measurements in IEC 60068-2-58. Then, if specified in the detail specification, the electrical
performances shall be measured.
5.3.7 Items to be specified in detail specification
5.3.7.1 General
The following items shall be specified in the detail specification.
5.3.7.2 Solder bath method
a) Applied solder.
b) Accelerated ageing (if necessary) (see 5.3.2).
c) Initial measurement items (see 5.3.3).
d) Preheating (if necessary) (see 5.3.4.1d)).
e) Conditions of immersion into solder (if necessary) (see 5.3.4.1e)).
f) Final measurement items (see 5.3.6).
5.3.7.3 Solder reflow method
a) Applied solder.
b) Accelerated ageing (if necessary) (see 5.3.2).
c) Initial measurement items (see 5.3.3).
d) Dimensional details of the test substrate and number of specimen(s) (see 5.3.4.2b)).
e) Preheating (if necessary) (see 5.3.4.2d)).
f) Final measurement items (see 5.3.6).

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5.4 Resistance to soldering heat
5.4.1 General
The test for resistance to soldering heat shall be in accordance with the provisions of
IEC 60068-2-58 and other specifications as mentioned below.
5.4.2 Preconditioning
Unless otherwise specified in the detail specification, the specimen shall be tested in the “as-
received“ condition. Care should be taken that no contamination occurs, by contact with the
fingers or by other means.
5.4.3 Initial measurement
The appearance of the specimen shall be checked by using a magnifier with a magnification
of at least 10× under adequate light. If specified in the detail specification, the electrical
performances shall be measured.
5.4.4 Test method
5.4.4.1 Solder bath method
a) Solder bath
The solder bath shall be as specified in item a) of 5.3.4.1.
b) Flux
The flux shall be as specified in item b) of 5.3.4.1.
c) Solder
The solder composition shall be in accordance with items a)1) or b)1) of Clause A.3.
d) Test procedure
The test procedure shall be in accordance with 6.2 the requirements for the test procedure
and conditions of IEC 60068-2-58. Unless specified in the detail specification, the
specimen shall be preheated to a temperature of 80 °C to 120 °C and maintained for 10 s
to 30 s. The immersion and withdrawal speed shall be between 20 mm/s and 25 mm/s.
e) Severity
Unless otherwise specified in the detail specification, the duration and temperature of
immersion shall be as given in Table 5.
Table 5 – Severity
Severity
Alloy composition
Temperature Duration
Lead-free solder (Sn-Ag-Cu) 255 260 °C ± 5 °C 10 s ± 1 s
a
Lead-containing solder 260 °C ± 5 °C 10 s ± 1 s
a
If specified in the detail specification, 5 s ± 1 s may be applied.

5.4.4.2 Solder reflow method
The reflow equipment shall be forced gas convection.
a) Solder paste
The solder paste shall be in accordance with item a) or b) of Clause A.3.
b) Test substrates
The test substrate shall be as specified in item b) of 5.3.4.2.

c) Preparation
The solder paste shall be coated on the lands and the specimen shall be placed in
accordance with Clause A.4.
d) Preheating
Unless otherwise specified in the detail specification, the specimen and test substrate
shall be preheated in accordance with Clause A.5.
e) Reflow temperature profile
Unless otherwise specified in the detail specification, the reflow temperature profile shall
be in accordance with Table 6.
The profile of test 1 is recommended for lead-free solder. The profile for lead-free solder
in Table 6 shall be specified as the acceptable upper limit of severity.
Unless otherwise specified in the detail specification, the number of test cycles shall be a
minimum of one and a maximum of three.
Table 6 – Reflow temperature
T T t T t T t
1 2 1 3 2 4 3
Alloy composition
°C °C s °C s °C s
Lead-free solder Test 1 20 to 40 at T – 5 K
150 ± 5 180 ± 5 120 ± 5 220 60 to 90 250
(Sn-Ag-Cu)
Test 2
150 ± 5 180 ± 5 120 ± 5 220 ≤ 60 255 ≤ 20 at T – 10 K
Lead-containing solder 150 ± 10 150 ± 10 60 to 120 – – 235 ± 5 10 ± 1 at T
NOTE See profile in Figure 8.
5.4.5 Recovery
The flux residues shall be removed with a suitable solvent (see 3.1.2 3.1.3 of IEC 60068-2-
45:1980 and IEC 60068-2-45:1980/AMD1:1993).
5.4.6 Final measurement
After recovery, the appearance of the specimen shall be checked by using a magnifier with a
magnification of at least 10× under adequate light. Then, if specified in the detail specification,
the electrical performances shall be measured.
5.4.7 Items to be specified in detail specification
5.4.7.1 General
The following items shall be specified in the detail specification.
5.4.7.2 Solder bath method
a) Applied solder.
b) Initial measurement items (see 5.4.3).
c) Preheating (if necessary) (see 5.4.4.1.d)).
d) Severity (if necessary) (see 5.4.4.1 e)).
e) Final measurement items (see 5.4.6).
5.4.7.3 Solder reflow method
a) Applied solder.
b) Initial measurement items (see 5.4.3).
c) Dimensional detail of the test substrate and number of specimen(s) (see 5.4.4.2 b)).

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d) Preheating (if necessary) (see 5.4.4.2 d)).
e) Reflow temperature profile (see 5.4.4.2 e)).
f) Number of test cycles (see 5.4.4.2 e)).
g) Final measurement items (see 5.4.6).
5.5 Resistance to dissolution of metallization
5.5.1 General
The test for resistance to the dissolution of metallization shall be in accordance with the
provisions of IEC 60068-2-58 and other specifications as mentioned below.
5.5.2 Preconditioning
Unless otherwise specified in the detail specification, the specimen shall be tested in the “as-
received” condition. Care should be taken that no contamination occurs, by contact with the
fingers or by other means.
5.5.3 Initial measurement
The appearance of the specimen shall be checked by using a magnifier with a magnification
of at least 10× under adequate light. If specified in the det
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