IEC 61000-4-33:2005

INTERNATIONAL IEC
STANDARD 61000-4-33
First edition
2005-09
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 4-33:
Testing and measurement techniques –
Measurement methods for high-power
transient parameters
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INTERNATIONAL IEC
STANDARD 61000-4-33
First edition
2005-09
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 4-33:
Testing and measurement techniques –
Measurement methods for high-power
transient parameters
© IEC 2005 ⎯ Copyright - all rights reserved
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– 2 – 61000-4-33 ” IEC:2005(E)
CONTENTS
FOREWORD.4
INTRODUCTION .6
1 Scope.7
2 Normative references.7
3 Terms and definitions.8
4 Measurement of high-power transient responses .9
4.1 Overall measurement concepts and requirements.9
4.2 Representation of a measured response. 12
4.3 Measurement equipment. 12
4.4 Measurement procedures. 27
5 Measurement of low frequency responses. 27
6 Calibration procedures . 28
6.1 Calibration of the entire measurement channel. 28
6.2 Calibration of individual measurement channel components . 31
6.3 Approximate calibration techniques. 37
Annex A (normative) Methods of characterizing measured responses . 40
Annex B (informative) Characteristics of measurement sensors. 45
Annex C (normative) HPEM measurement procedures . 59
Annex D (informative) Two-port representations of measurement chain components . 62
Bibliography. 69
Figure 1 – Illustration of a typical instrumentation chain for measuring high-power
transient responses . 10
Figure 2 – Illustration of a balanced sensor and cable connecting to an unbalanced
(coaxial) line where I + I = I . 16
out in 1
Figure 3 – Examples of some simple baluns [4b] . 18
Figure 4 – A typical circuit for an in-line attenuator in the measurement chain. 18
Figure 5 – Illustration of the typical attenuation of a nominal 20 dB attenuator for a
50–: system, as a function of frequency. 19
Figure 6 – Typical circuit diagram for an in-line integrator. 20
Figure 7 – Plot of the transfer function of the integrating circuit of Figure 6. 20
Figure 8 – Illustration of the frequency dependent per-unit-length signal transmission
of a standard coaxial cable, and a semi-rigid coaxial line. 21
Figure 9 – Illustration of sensor cable routing in regions not containing EM fields. 24
Figure 10 – Treatment of sensor cables when located in a region containing EM fields. 25
Figure 11 – Conforming cables to local system shielding topology . 26
Figure 12 – Correct and incorrect methods of cable routing. 27
Figure 13 – The double-ended TEM Cell for providing a uniform field illumination for
probe calibration . 29
Figure 14 – Illustration of the single-ended TEM cell and associated equipment. 30
Figure 15 – Dimensions of a small test fixture for probe calibration. 30

61000-4-33 ” IEC:2005(E) – 3 –
Figure 16 – Electrical representation of a measurement chain, (a) with the E-field
sensor represented by a general Thevenin circuit, and (b) the Norton equivalent circuit
for the same sensor. 31
Figure 17 – Example of a simple E-field probe. 34
Figure 18 – Plot of the real and imaginary parts of the input impedance, Z , for the E-
i
field sensor of Figure 17. 34
Figure 19 – Plot of the magnitude of the short-circuit current flowing in the sensor input
for different angles of incidence, as computed by an antenna analysis code . 35
Figure 20 – Plot of the magnitude of the effective height of the sensor for different
angles of incidence. 36
Figure 21 – High frequency equivalent circuit of an attenuator element . 39
Figure A.1 – Illustration of various parameters used to characterize the pulse
component of a transient response waveform R(t). 41
Figure A.2 – Illustration of an oscillatory waveform frequently encountered in high-
power transient EM measurements. 41
Figure A.3 – Example of the calculated spectral magnitude of the waveform of Figure A.2 . 44
Figure B.1 – Illustration of a simple E-field sensor, together with its Norton equivalent
circuit. 46
~
Figure B.2 – Magnitude and phase of the normalized frequency function F(ZW ) for
the field sensor . 47
Figure B.3 – Illustration of a simple B-field sensor, together with its Thevenin
equivalent circuit . 49
Figure B.4 – Illustration of an E-field sensor over a ground plane used for measuring
the vertical electric field, or equivalently, the surface charge density. 50
Figure B.5 – Illustration of the half-loop B-dot sensor used for measuring the
tangential magnetic field, or equivalently, the surface current density . 52
Figure B.6 – Simplified concept for measuring wire currents . 53
Figure B.7 – Construction details of a current sensor . 54
Figure B.8 – Example of the measured sensor impedance magnitude of a nominal 1 :
current sensor. 55
Figure B.9 – Geometry of the in-line I-dot current sensor . 55
Figure B.10 – Design concept for a coaxial cable current sensor . 56
Figure B.11 – Shape and dimensions of a CIP-10 coaxial cable current sensor. 57
Figure B.12 – Configuration of a coaxial cable I-dot current sensor. 57
Figure D.1 – Voltage and current relationships for a general two-port network . 62
Figure D.2 – Voltage and current definitions for the chain parameters. 63
Figure D.3 – Cascaded two-port networks. 64
Figure D.4 – Representation of the of a simple measurement chain using the chain
parameter matrices. 64
Figure D.5 – Simple equivalent circuit for the measurement chain . 65
Figure D.6 – A simple two-port network modelled by chain parameters . 65
Table A.1 – Examples of time waveform p-norms. 42
Table A.2 – Time waveform norms used for high-power transient waveforms. 42
Table D.1 – Chain parameters for simple circuit elements. 66

– 4 – 61000-4-33 ” IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROMAGNETIC COMPATIBILITY (EMC) –
Part 4-33: Testing and measurement techniques –
Measurement methods for high-power transient parameters
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