IEC PAS 62190:2000

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Edition 1.0
2000-11
Moisture/reflow sensitivity classification
for nonhermetic solid state
surface mount devices
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IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62190
C O MMI S S I O N
IPC/JEDEC J-STD-020A
APRIL 1999
JOINT
INDUSTRY
STANDARD
Moisture/Reflow
Sensitivity Classification
for Nonhermetic
Solid State Surface
Mount Devices
NOTICE
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The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
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publication should be addressed to JEDEC Solid State Technology Association, 2500 Wilson
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JE IEC
INTERNATIONAL ELECTROTECHNICAL COMMISSION

MOISTURE/R EFLOW SEN SITIVITY CLASSIFICATION

FOR NONHE RMETIC SOLID STTAE S URFACE MOUNT DEVICES

FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under giv en procedures.
IEC-PAS 62190 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of th is PAS is based on theThis PAS was approv ed for
following doc um ent:publication by t he P-members of the
committee c onc erned as i ndicated in
the following doc um ent:
Draft PASReport on voting
47/ 1475/PAS47/ 1511/ RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
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recorded at the C entral O ffice.
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____________
Copyri 2000,C;DE ght © 1999,
Copyright © 1999, JEDEC; 2000, IEC

MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC

SOLID STATE SURFACE MOUNT
Contents
11 Pupose
12 Scope
23 Background
24 Applicable documents
5.2 Solder 3
5.4 Microscopes3
5.6 Electrical test3
5.7 Weighing apparatus (Optional)4
6 Classification/reclassification4
6.1 Reclassification4
7 Procedure5
7.2 Electrical test6
7.3 Initial inspection6
7.5 Moisture soak6
7.6 Reflow7
7.7 External visual8
7.8 Electrical test8
98 Criteria
8.1 Failure criteria9
8.2 Criteria requiring further evaluation9
8.3 Failure verification11
9 Moisture/ reflow sensitivity classification11
10 Optional weight gain/loss analysis12
10.2 Absorption curve12
10.3 Desorption curve13
10.1 Weight gain
7.9 Acoustic microscopy
7.4 Bake
7.1 Sample requirements
5.5 Cross-sectioning
5.3 Ovens
Rreflow Equipment
5.1 Temperature humidity chambers
5 Apparatus
Page
DEVICES
Joint IPC/JEDEC Standard J-STD-020A

Copyright © 1999, JEDEC; 2000, IEC

MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC

SOLID STATE SURFACE MOUNT DEVICES

Contents (concluded)
11 Additions and exceptions14
Classification flow15
Tables
reflow conditions5
2 Moisture sensitivity levels7
3 Classification reflow profiles8

1 Package
Annex A
Page
Joint IPC/JEDEC Standard J-STD-020A

Copyright © 1999, JEDEC; 2000, IEC

MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC

SOLID STATE SURFACE MOUNT
Carrier Cracking Task Group, B-10a, and the JEDEC JC-14.1 Subcommittee on Reliability Test Methods

1 Purpose
The purpose of this standard is to identify the classification level of nonhermetic solid state Surface
Mount Devices ( SMDs) that are sensitive to moisture-induced stress so that they can be properly
solder reflow attachment and/or repair operation.
This standard may be used to determine what classification level should be used for initial reliability
qualification.
If an initial qualification exists and no major changes have been made, this method may be used for
reclassification to an improved level (longer floor life up to level 2). The reclassification level cannot be
improved by more than one level without additional reliability testing.
or J -020 may be reclassified as non-moisture sensitive (level 1) without additional reliability stress
testing, e.g., JESD22 d JESD47 or the semiconductor manufacturer's in-house procedures.
Passing the reject criteria in this test method is not sufficient by itself to provide assurance of long term
reliability.
2 Scope
The classification procedure applies to all nonhermetic solid state Surface Mount Devices ( SMDs) in
packages which, because of absorbed moisture, could be sensitive to damage during solder reflow. The
term SMD as used in this document means plastic encapsulated packages and other packages made with
moisture-permeable materials. The categories are intended to be used by SMD producers to inform users
(board assembly operations) of the level of moisture sensitivity of product devices, and by board
assembly operations to ensure that proper handling precautions are applied to moisture/ reflow sensitive
devices.
NOTE  The procedures in this document may be used on packaged devices not included in the scope. The failure
criteria for such packages must be agreed upon by the device supplier and the end user.
-A113 an
-STD
-786 -SM No components classified as moisture sensitive by any previous version of JESD22-A112, IPC
packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly
for Packaged Devices.)
(From JEDEC Board Ballot JCB-98-104, formulated under the cognizance of the IPC Plastic Chip
DEVICES
Page
Joint IPC/JEDEC Standard J-STD-020A

Copyright © 1999, JEDEC; 2000, IEC

3 Background
The vapor pressure of moisture inside a plastic package increases rapidly when the package is exposed to

the high temperature of solder reflow. Under certain conditions, this pressure can cause internal

delamination of the plastic from the die and/or leadframe, internal cracks that do not extend to the outside

cratering
beneath the bonds. In the most severe case, the stress can result in external package cracks. This is
commonly referred to as the "popcorn" phenomenon because the internal stress causes the package to
bulge and then crack with an audible "pop". SMDs are more susceptible to this problem than through-
hole parts because they are exposed to higher temperatures during reflow soldering. The reason for this
is that the soldering operation must occur on the same side of the board as the SMD device. For through-
hole devices, the soldering operation occurs under the board that shields the devices from the hot solder.
Also, SMDs have a smaller minimum plastic thickness from the chip or mount pad interface to the
outside package surface that has been identified as a critical factor in determining moisture sensitivity.
4 Applicable documents
Requirements for Handling Electrostatic Discharge Sensitive (ESD) Devices
Test Methods Manual
Procedures for Characterizing and Handling of Moisture/
JEP113 Symbol and Labels for Moisture Sensitive Devices
JESD 47 Stress Test Driven Qualification Specification
Moisture Induced Stress Sensitivity for Plastic Surface Mount Devices
Preconditioning Procedures of Plastic Surface Mount Devices Prior to Reliability
Testing
Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components

5.1 Temperature humidity chambers
Moisture chamber(s), capable of operating at 85 ° ° °
30 ° C/60% RH. Within the chamber working area, temperature tolerance must be ± 2 °
tolerance must be ±
3% RH.
C and the RH
C/60% RH, and C/60% RH, 60 C/85% RH, 85
5 Apparatus
J-STD-035
JESD22-A113
JESD22-A112
Reflow Sensitive ICs IPC-SM-786
IPC-TM-650
EIA 625
of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or
Page
Joint IPC/JEDEC Standard J-STD-020A

Copyright © 1999, JEDEC; 2000, IEC

5 Apparatus ( cont’d)
5.2 Solder reflow equipment
(a) (Preferred) - 100% Convection reflow system capable of maintaining the reflow profiles required

by this standard.
° ° C with appropriate fluids.
The chamber must be capable of heating the packages without collapsing the vapor blanket and
recondensing the vapor to minimize loss of the vapor phase soldering liquid. The vapor phase
soldering fluid must vaporize at the appropriate temperature specified above.
(c) Infrared (IR)/Convection solder reflow equipment capable of maintaining the reflow profiles
required by this standard. It is recommended that this equipment use the IR to heat the air and not
directly impinge upon the components under test.
NOTE The moisture sensitivity classification test results are dependent upon the package body temperature (rather
than board or lead temperature). Convection and VPR are known to be more controllable and repeatable than IR.
When there are correlation problems between VPR, IR/Convection, and Convection, the convection results shall be
considered as the standard.
5.3 Ovens
°
5.4 Microscopes
(a) Optical Microscope (40X for external and 100X for cross-section exam).
(b) Scanning Acoustic Microscope.
Note 1  The Scanning Acoustic Microscope is used to detect cracking and
be established for a particular die/package system.
Note 2  Refer to J-STD-035 for operation of the Scanning Acoustic Microscope.

5.5 Cross sectioning
applicable document.
5.6 Electrical test
Electrical test equipment capable of performing dc and functional tests.
Micro-sectioning Equipment as recommended per IPC-TM-650 Methods 2.1.1, 2.1.1.2 or other
delamination must delamination does not necessarily indicate a pending reliability problem. The reliability impact of
delamination. However, the presence of
C . Bake oven capable of operating at 125 +5/-0
C and/or 235 +5/-0 (b) VPR chamber capable of operating from 215-219
Page
Joint IPC/JEDEC Standard J-STD-020A

Copyright © 1999, JEDEC; 2000, IEC

5 Apparatus ( cont’d)
5.7 Weighing apparatus (Optional)

Weighing apparatus capable of weighing the package to a resolution of 1 microgram. This apparatus
must be maintained in a draft-free environment, such as a cabinet. It is used to obtain absorption and

desorption data on the devices under test (see Section 10).
6 Classification/ Reclassifaction
Refer to 6.1 for guidance on reclassification of previously qualified/classified
Engineering studies have shown that small volume components reach body temperatures greater than
225 ° reflow soldered to boards profiled for larger components. Therefore technical and/or
business issues might require small thin packages (reference Table 1) to be classified at 235 °
However, where it is known that certain small thin packages are used on boards without larger packages,
these small packages, may be classified at 220 ° C. Table 1 defines the transiti
...