IEC 61139-3:2023

IEC 61139-3 ®
Edition 1.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial networks – Single-drop digital communication interface –
Part 3: Wireless extensions
Réseaux industriels – Interface de communication numérique point à point –
Partie 3: Extensions sans fil
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et
les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc

If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Recherche de publications IEC -  IEC Products & Services Portal - products.iec.ch
webstore.iec.ch/advsearchform Découvrez notre puissant moteur de recherche et consultez
La recherche avancée permet de trouver des publications IEC gratuitement tous les aperçus des publications. Avec un
en utilisant différents critères (numéro de référence, texte, abonnement, vous aurez toujours accès à un contenu à jour
comité d’études, …). Elle donne aussi des informations sur les adapté à vos besoins.
projets et les publications remplacées ou retirées.

Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
Le premier dictionnaire d'électrotechnologie en ligne au monde,
Restez informé sur les nouvelles publications IEC. Just
avec plus de 22 300 articles terminologiques en anglais et en
Published détaille les nouvelles publications parues.
français, ainsi que les termes équivalents dans 19 langues
Disponible en ligne et une fois par mois par email.
additionnelles. Egalement appelé Vocabulaire

Electrotechnique International (IEV) en ligne.
Service Clients - webstore.iec.ch/csc

Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
IEC 61139-3 ®
Edition 1.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial networks – Single-drop digital communication interface –

Part 3: Wireless extensions
Réseaux industriels – Interface de communication numérique point à point –

Partie 3: Extensions sans fil
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 35.200  ISBN 978-2-8322-7751-5

– 2 – IEC 61139-3:2023 © IEC 2023
CONTENTS
FOREWORD . 20
INTRODUCTION . 22
1 Scope . 23
2 Normative references . 23
3 Terms and definitions, abbreviated terms and conventions . 24
3.1 Terms and definitions . 24
3.2 Abbreviated terms . 30
3.3 Conventions . 32
3.3.1 General . 32
3.3.2 Service primitives . 32
3.3.3 Service parameters. 33
3.3.4 Service procedures . 33
3.3.5 Service attributes . 34
3.3.6 Figures . 34
3.3.7 Transmission octet order . 35
3.3.8 Behavioral descriptions . 35
3.3.9 Triple table format . 36
4 Overview of wireless digital communication interface . 36
4.1 Purpose and topology . 36
4.2 Positioning in the automation hierarchy . 36
4.2.1 General . 36
4.2.2 Relationship to IEC 61131-9 . 37
4.2.3 Role of a W‑Master . 38
4.2.4 Role of a W‑Device . 39
4.2.5 Role of a W-Bridge . 39
4.2.6 System configuration tool . 39
4.2.7 Mapping to fieldbuses . 39
4.3 Cell concept . 39
4.4 Wireless Mechanisms . 41
4.4.1 General . 41
4.4.2 Scan (W‑Device Discovery) . 41
4.4.3 Pairing . 41
4.4.4 Unpairing . 42
4.4.5 Roaming . 42
4.4.6 Automatic Pairing . 43
4.4.7 Transmission Error Handling . 44
4.4.8 "I am alive" supervision (IMA) . 44
4.4.9 Wireless Quality supervision . 44
4.5 Concept of air interface . 44
4.5.1 General . 44
4.5.2 Frequency division multiple access (FDMA) . 45
4.5.3 Time Division Multiple Access (TDMA). 45
4.5.4 SSlots, DSlots, transmission capacity . 47
4.5.5 Assignment of W‑Devices to W-Tracks and slots . 47
4.5.6 Assignment of W-Ports to W‑Devices . 48
4.5.7 W-Cycle . 48

4.5.8 W-Frame . 49
4.6 Characteristics of the SDCI-W technology . 49
4.7 Layer model . 50
4.8 Conformity assessment . 50
5 Physical Layer (PL) . 51
5.1 General . 51
5.2 Base technology, Physical Layer (PL) . 51
5.2.1 General . 51
5.2.2 Transmission rate . 51
5.2.3 Carrier frequency accuracy . 51
5.2.4 W‑Device Carrier frequency calibration . 51
5.2.5 W‑Master Carrier frequency calibration . 51
5.2.6 Modulation . 51
5.2.7 Transmission power . 52
5.2.8 Antenna . 52
5.2.9 SDCI wireless receiver sensitivity . 52
5.2.10 Transceiver timings . 52
5.3 Downlink and uplink . 55
5.3.1 Transmission octet order for WORD based data types . 55
5.3.2 Downlink and uplink transmission . 56
5.3.3 Preamble . 56
5.3.4 Syncword. 57
5.3.5 Downlink and uplink CRC . 58
5.3.6 CRC Transmission . 58
5.3.7 Data Whitening . 59
5.3.8 Regular downlink packet . 60
5.3.9 Configuration downlink packet . 61
5.3.10 Uplink Single Slot . 61
5.3.11 Uplink Double Slot . 62
5.4 W-Sub-cycle . 62
5.4.1 General . 62
5.4.2 W-Sub-cycle structure . 62
5.4.3 Regular W-Frame . 63
5.4.4 Configuration W-Frame . 64
5.5 Medium Access Control (MAC) . 64
5.5.1 General . 64
5.5.2 Frequency channels . 65
5.5.3 Alternative Hopping algorithms . 66
5.5.4 Configuration Frequencies . 66
5.5.5 Blocklisting . 66
5.5.6 Wireless Quality . 66
5.6 Physical Layer (PL) services . 68
5.6.1 Overview . 68
5.6.2 PL Services for W‑Master . 68
5.6.3 PL Services for W‑Device . 82
5.7 Physical Layer PL protocol . 89
5.7.1 Usage of the Configuration Channel . 89
5.7.2 PL W‑Master state machine . 94
5.7.3 PL W‑Device state machine . 106

– 4 – IEC 61139-3:2023 © IEC 2023
6 Data Link Layer DL-A . 111
6.1 General . 111
6.2 General W‑Master . 112
6.2.1 General . 112
6.2.2 W-Track and W‑Device-Mapper (TDMapper). 112
6.3 General (W‑Device) . 112
6.4 DL-A services . 113
6.4.1 Overview . 113
6.4.2 MCmd (W‑Master and W‑Device) . 113
6.4.3 ISDUMsg (W‑Master and W‑Device) . 114
6.4.4 DownLinkAck (W‑Master) . 116
6.4.5 UpLinkAck (W‑Device) . 118
6.4.6 EventMsg (W‑Master and W‑Device) . 118
6.4.7 PDOutMsg (W‑Master and W‑Device) . 119
6.4.8 PDInMsg (W‑Master and W‑Device) . 121
6.5 Acknowledgments (DownLinkAck and UpLinkAck) . 122
6.6 Message handler . 122
6.6.1 General . 122
6.6.2 State machine of the W‑Master Message handler (DL-A) . 123
6.6.3 Compilation of DLink control octet . 126
6.6.4 State machine of the W‑Device Message handler (DL-A) . 127
6.6.5 Compilation of ULink control octet . 131
7 Data Link Layer DL-B . 132
7.1 DL-B services . 132
7.1.1 Overview of services within W‑Master and W‑Device . 132
7.1.2 DL_PDCycle (W‑Master and W‑Device) . 132
7.1.3 DL_PDInputTransport (W‑Master) . 132
7.1.4 DL_Control (W‑Master and W‑Device) . 133
7.1.5 DL_PDOutputUpdate (W‑Master) . 133
7.1.6 DL_PDOutputTransport (W‑Device) . 134
7.1.7 DL_PDInputUpdate (W‑Device) . 135
7.1.8 DL_Event (W‑Master and W‑Device) . 135
7.1.9 DL_ISDUTransport (W‑Master and W‑Device) . 136
7.1.10 DL_ISDUAbort (W‑Master and W‑Device) . 137
7.1.11 DL_TDConfig (W‑Master) . 137
7.1.12 DL_Read (W‑Master and W‑Device) . 138
7.1.13 DL_Write (W‑Master and W‑Device) . 140
7.1.14 DL_SetMode (W‑Master) . 141
7.1.15 DL_Mode (W‑Master and W‑Device) . 142
7.1.16 DL_MaxRetry (W‑Device) . 142
7.1.17 DL_SetParam (W‑Master and W‑Device) . 142
7.2 DL-mode handler . 143
7.2.1 General . 143
7.2.2 State machine of the W‑Master DL-mode handler . 144
7.2.3 State machine of the W‑Device DL-mode handler . 146
7.3 Process Data handler. 147
7.3.1 General . 147
7.3.2 State machine of the W‑Master Process Data Out handler . 147

7.3.3 State machine of the W‑Master Process Data In handler . 151
7.3.4 State machine of the W‑Device Process Data Out handler . 153
7.3.5 State machine of the W‑Device Process Data In handler . 155
7.4 Indexed Service Data Unit (ISDU) handler . 157
7.4.1 General . 157
7.4.2 State machine of the W‑Master ISDU handler . 157
7.4.3 State machine of the W‑Device ISDU handler . 160
7.4.4 General structure and encoding of ISDUs . 162
7.5 Command handler . 163
7.5.1 General . 163
7.5.2 State machine of the W‑Master command handler . 163
7.5.3 State machine of the W‑Device command handler . 166
7.6 Event handler . 167
7.6.1 General . 167
7.6.2 State machine of the W‑Master Event handler . 167
7.6.3 State machine of the W‑Device Event handler . 170
7.7 Transmission of segmented data and retry handling . 171
7.7.1 General . 171
7.7.2 Transmission of segmented data . 172
7.7.3 Retry-Handling . 173
8 Application Layer (AL) . 174
8.1 General . 174
8.2 Application Layer services . 174
8.2.1 General . 174
8.2.2 AL_Read (W‑Master and W‑Device) . 174
8.2.3 AL_Write (W‑Master and W‑Device) . 176
8.2.4 AL_Abort (W‑Master and W‑Device) . 177
8.2.5 AL_NewInput (W‑Master) . 177
8.2.6 AL_GetInput (W‑Master) . 178
8.2.7 AL_SetInput (W‑Device) . 179
8.2.8 AL_PDCycle (W‑Master and W‑Device) . 179
8.2.9 AL_GetOutput (W‑Device) . 180
8.2.10 AL_NewOutput (W‑Device) . 180
8.2.11 AL_SetOutput (W‑Master) . 181
8.2.12 AL_Event (W‑Master and W‑Device) . 181
8.2.13 AL_Control (W‑Master and W‑Device) . 183
8.3 Application layer protocol . 183
8.3.1 Overview . 183
8.3.2 ISDU processing . 183
8.3.3 Event processing . 189
8.3.4 Process Data transfer . 191
9 System management . 195
9.1 General . 195
9.2 Modes . 195
9.2.1 Service Mode . 195
9.2.2 Cyclic Mode . 196
9.3 System management of the W‑Master . 197
9.3.1 Overview . 197

– 6 – IEC 61139-3:2023 © IEC 2023
9.3.2 System management W‑Master services . 198
9.3.3 SM W‑Master protocol . 211
9.4 System management of the W‑Device . 223
9.4.1 Overview . 223
9.4.2 System management W‑Device services . 224
9.4.3 SM W‑Device protocol . 231
10 W‑Device . 238
10.1 Overview. 238
10.2 Process Data Exchange (PDE) . 239
10.3 IMA handling . 240
10.4 Parameter Manager (PM) . 240
10.4.1 General . 240
10.4.2 Parameter manager state machine . 241
10.4.3 Dynamic parameter . 241
10.4.4 Single parameter . 241
10.4.5 Block parameter . 241
10.4.6 Concurrent parameterization access . 241
10.4.7 Command handling . 241
10.5 Data Storage (DS) . 241
10.6 Event Dispatcher (ED) . 241
10.7 W‑Device features . 242
10.7.1 General . 242
10.7.2 Scan . 242
10.7.3 Pairing by UniqueID . 242
10.7.4 Pairing by Button / Re-Pairing . 242
10.7.5 Roaming . 242
10.7.6 Unpairing . 242
10.7.7 W‑Device backward compatibility . 243
10.7.8 Protocol revision compatibility . 243
10.7.9 Device human machine interface (HMI) . 243
10.7.10 Parameter access locking . 243
10.7.11 Data Storage locking . 243
10.7.12 W‑Device parameter locking . 243
10.7.13 W‑Device user interface locking . 243
10.7.14 Data Storage concept . 244
10.7.15 Block Parameter . 244
10.8 W‑Device reset options . 244
10.9 W‑Device design rules and constraints . 244
10.9.1 General . 244
10.9.2 Process Data . 244
10.9.3 MaxRetry error detection . 244
10.9.4 Communication loss . 245
10.9.5 Direct Parameter Page . 245
10.9.6 ISDU communication channel . 245
10.9.7 DeviceID rules related to W‑Device variants . 245
10.9.8 Protocol constants . 245
10.10 I/O W‑Device description (IODD) . 246
10.10.1 General . 246
10.10.2 Profile Characteristics. 247

10.10.3 CommNetwork Profile Instance for the IODD . 247
10.11 W‑Device diagnosis . 249
10.11.1 Concepts . 249
10.11.2 Events . 249
10.11.3 W‑Device HMI . 250
10.12 W‑Device connectivity . 251
11 W‑Master . 251
11.1 Overview. 251
11.2 Services of the Standardized Master Interface (SMI) . 254
11.2.1 Overview . 254
11.2.2 SMI_WMasterConfiguration . 255
11.2.3 SMI_ReadbackWMasterConfiguration . 256
11.2.4 SMI_WTrackStatus . 258
11.2.5 SMI_WScan . 260
11.2.6 SMI_WPortPairing . 262
11.2.7 SMI_WScanStatus . 264
11.2.8 SMI_WQualityStatus . 266
11.3 Configuration Manager (CM) . 268
11.3.1 General . 268
11.3.2 Coordination of Master applications . 268
11.3.3 State machines of the Configuration Manager . 269
11.4 Data Storage (DS) . 275
11.5 On-request Data Exchange (ODE) . 276
11.6 Diagnosis Unit (DU) . 276
11.7 Process Data Exchange (PDE) . 276
11.7.1 General . 276
11.7.2 Process Data input mapping . 276
11.7.3 Process Data output mapping . 276
11.7.4 Process Data invalid/valid qualifier status . 276
11.8 Port and Device Configuration Tool (PDCT) . 277
11.8.1 General . 277
11.8.2 Basic layout examples . 277
11.9 Gateway application . 279
11.9.1 General . 279
11.9.2 Changing W‑Device configuration including Data Storage . 279
11.9.3 Parameter server and recipe control . 279
11.9.4 Interoperability to 5G Systems . 280
11.10 Human machine Interface (HMI), Faulty W‑Device replacement . 280
12 W-Bridge . 280
12.1 Overview. 280
12.2 Process Data Exchange (PDE) . 281
12.2.1 General . 281
12.2.2 Process Data mapping . 281
12.3 On-request Data Exchange (ODE) . 281
12.3.1 General . 281
12.3.2 Wireless Parameters . 281
12.3.3 Parameters of connected SDCI Device . 281
12.4 Data Storage . 282
12.5 Diagnosis Unit (DU) . 282

– 8 – IEC 61139-3:2023 © IEC 2023
12.5.1 General . 282
12.5.2 Device Events (Wireless) . 282
12.5.3 Device Events . 282
12.5.4 Port Events . 282
12.6 Design Rules . 283
12.6.1 General . 283
12.6.2 Timing constraints . 283
12.6.3 Static behaviour . 283
12.6.4 Dynamic behavior . 285
12.6.5 UniqueID . 292
12.7 I/O W‑Device description (W-IODD) . 292
Annex A (normative) W-Messages Codings . 294
A.1 Overview. 294
A.2 Definition of a W-Message . 294
A.3 Downlink W-Messages: control octets . 294
A.3.1 DLink control octet . 294
A.3.2 DLink control octets contains MasterCommand . 296
A.4 Uplink W-Messages . 297
A.4.1 General . 297
A.4.2 ULink control octet . 297
A.5 Example for combination of several W-Messages within a DLink / PreDLink . 297
A.6 Example for DLink data transmission within cyclic process data and
segmentation . 298
A.7 Examples for uplink data transmissions . 300
A.7.1 General . 300
A.7.2 DSlot W‑Device sends 8 octets not segmented Process Data In to
W‑Master . 300
A.7.3 DSlot W‑Device sends 32 octets segmented Process Data In to
W‑Master . 300
A.7.4 SSlot W‑Device responds with 3 octets segmented ISDU Data to
W‑Master . 300
A.7.5 DSlot W‑Device sends 4 octets Process Data In every 5 ms and
responds with 25 octets segmented ISDU Data to W‑Master . 301
A.8 User data (PD or OD). 302
A.9 PDVALID PDINVALID . 302
A.10 General structure and encoding of ISDUs . 302
A.11 General structure and encoding of Events . 303
A.11.1 EventQualifier . 303
A.11.2 EventCode . 304
Annex B (normative) W-Frame Codings, CRC calculation and errors . 305
B.1 Description of ConnectionParameter . 305
B.2 Downlink packet encodings for Normal Operation . 305
B.3 Downlink packet encodings for Configuration Operation . 306
B.3.1 General . 306
B.3.2 Scan Request downlink packet .
...