IEC TR 62240-1:2018
(Main)Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.
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IEC TR 62240-1 ®
Edition 2.0 2018-03
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 1: Temperature uprating
IEC TR 62240-1:2018-03(en)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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3, rue de Varembé info@iec.ch
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
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variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and
CISPR.
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IEC TR 62240-1 ®
Edition 2.0 2018-03
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 1: Temperature uprating
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5364-9
– 2 – IEC TR 62240-1:2018 © IEC 2018
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 12
4 Selection provisions . 12
4.1 General . 12
4.2 Device selection, usage and alternatives . 14
4.2.1 General . 14
4.2.2 Alternatives . 14
4.2.3 Device technology . 14
4.2.4 Compliance with the electronic component management plan . 15
4.3 Device capability assessment . 15
4.3.1 General . 15
4.3.2 Device package and internal construction capability assessment . 15
4.3.3 Risk assessment (assembly level) . 15
4.3.4 Device uprating methods . 16
4.3.5 Device reliability assurance . 17
4.4 Device quality assurance (QA) over wider temperature ranges. 18
4.4.1 Decision for the optimum QA method . 18
4.4.2 Device level testing . 19
4.4.3 Higher level assembly testing . 19
4.5 QA process . 19
4.5.1 General . 19
4.5.2 Semiconductor device change monitoring . 19
4.5.3 Failure data collection and analysis . 19
4.6 Final electronic equipment assurance . 20
4.7 Documentation and identification . 20
4.7.1 Documentation . 20
4.7.2 Device identification . 20
4.7.3 Customer notification . 20
Annex A (informative) Device parameter re-characterisation . 22
A.1 Glossary of symbols . 22
A.2 Rationale for parameter re-characterisation . 23
A.2.1 General . 23
A.2.2 Assessment for uprateability . 23
A.3 Capability assurance . 24
A.3.1 Description . 24
A.3.2 Parameter re-characterisation process . 24
A.3.3 Application capability assessment . 29
A.4 Quality assurance . 30
A.5 Factors to be considered in parameter re-characterisation . 30
A.6 Report form for documenting device parameter re-characterisation . 32
Annex B (informative) Stress balancing. 34
B.1 General . 34
B.2 Glossary of symbols . 34
B.3 Stress balancing . 34
B.3.1 General . 34
B.3.2 Determine the ambient temperature extremes . 35
B.3.3 Determine parameter relationship to power dissipation . 35
B.3.4 Determine the dissipated power versus ambient temperature
relationship . 35
B.3.5 Assess applicability of the method . 37
B.3.6 Determine the new parameter values . 37
B.3.7 Conduct parametric and functional tests . 38
B.4 Application example . 38
B.4.1 General . 38
B.4.2 Determine the ambient temperature extremes . 39
B.4.3 Select the parameters that can be derated. 39
B.4.4 Construct an Iso-T plot . 40
J
B.4.5 Determine whether or not the device can be uprated . 40
B.4.6 Determine the new parameter values . 40
B.4.7 Conduct parametric and functional tests . 41
B.5 Other notes . 41
B.5.1 Margins . 41
B.5.2 Cautions and limitations. 41
Annex C (informative) Parameter conformance assessment . 44
C.1 General . 44
C.2 Test plan . 44
C.2.1 General . 44
C.2.2 Critical parameters . 44
C.2.3 Minimum allowable test margins . 44
C.2.4 Test options . 45
C.2.5 Quality assurance . 48
Annex D (informative) Higher assembly level testing . 51
D.1 General . 51
D.2 Process . 51
D.2.1 General . 51
D.2.2 Analysis of assembly test definition . 51
D.2.3 Perform assembly test . 51
D.2.4 Document results . 52
D.2.5 Maintenance notification . 52
Bibliography . 54
Figure 1 – Flow chart for semiconductor devices over wider temperature ranges . 13
Figure 2 – Report form for documenting device usage over wider temperature ranges . 21
Figure A.1 – Parameter re-characterisation . 23
Figure A.2 – Flow diagram of parameter re-characterisation capability assurance
process . 25
Figure A.3 – Margin in electrical parameter measurement based on the results of the
sample test . 28
Figure A.4 – Schematic diagram of parameter limit modifications . 29
– 4 – IEC TR 62240-1:2018 © IEC 2018
Figure A.5 – Parameter re-characterisation device quality assurance . 30
Figure A.6 – Schematic of outlier products that can invalidate sample testing . 31
Figure A.7 – Example of intermediate peak
...
IEC TR 62240-1 ®
Edition 2.0 2018-03
REDLINE VERSION
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 1: Temperature uprating
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.
IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and
CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC TR 62240-1 ®
Edition 2.0 2018-03
REDLINE VERSION
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 1: Temperature uprating
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5474-5
– 2 – IEC TR 62240-1:2018 RLV © IEC 2018
CONTENTS
FOREWORD . 5
INTRODUCTION . 2
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 12
4 Selection provisions . 12
4.1 General . 12
4.2 Device selection, usage and alternatives . 15
4.2.1 General . 15
4.2.2 Alternatives . 15
4.2.3 Device technology . 15
4.2.4 Compliance with the electronic component management plan . 16
4.3 Device capability assessment . 16
4.3.1 General . 16
4.3.2 Device package and internal construction capability assessment . 16
4.3.3 Risk assessment (assembly level) . 16
4.3.4 Device uprating methods . 17
4.3.5 Device reliability assurance . 18
4.4 Device quality assurance (QA) in over wider temperature ranges . 19
4.4.1 General Decision for the optimum QA method . 19
Device parameter re-characterisation testing .
Device parameter conformance testing .
4.4.2 Device level testing . 20
4.4.3 Higher level assembly testing . 20
4.5 QA process . 20
4.5.1 General . 20
4.5.2 Semiconductor device change monitoring . 21
4.5.3 Failure data collection and analysis . 21
4.6 Final electronic equipment assurance . 21
4.7 Documentation and identification . 21
4.7.1 Documentation . 21
4.7.2 Device identification . 22
4.7.3 Customer notification . 22
Annex A (informative) Device parameter re-characterisation . 24
A.1 Glossary of symbols . 24
A.2 Rationale for parameter re-characterisation . 25
A.2.1 General . 25
A.2.2 Assessment for uprateability . 26
A.3 Capability assurance . 26
A.3.1 Description . 26
A.3.2 Parameter re-characterisation process . 26
A.3.3 Application capability assessment . 32
A.4 Quality assurance . 32
A.5 Factors to be considered in parameter re-characterisation . 33
A.6 Report form for documenting device parameter re-characterisation . 35
Annex B (informative) Stress balancing. 37
B.1 General . 37
B.2 Glossary of symbols . 37
B.3 Stress balancing . 37
B.3.1 General . 37
B.3.2 Determine the ambient temperature extremes . 38
B.3.3 Determine parameter relationship to power dissipation . 38
B.3.4 Determine the dissipated power versus ambient temperature
relationship . 38
B.3.5 Assess applicability of the method . 40
B.3.6 Determine the new parameter values . 40
B.3.7 Conduct parametric and functional tests . 41
B.4 Application example . 41
B.4.1 General . 41
B.4.2 Determine the ambient temperature extremes . 42
B.4.3 Select the parameters that can be derated. 42
B.4.4 Construct an Iso-T plot . 43
J
B.4.5 Determine whether or not the device can be uprated . 43
B.4.6 Determine the new parameter values . 43
B.4.7 Conduct parametric and functional tests . 44
B.5 Other notes . 44
B.5.1 Margins . 44
B.5.2 Cautions and limitations. 44
Annex C (informative) Parameter conformance assessment . 47
C.1 General . 47
C.2 Test plan . 47
C.2.1 General . 47
C.2.2 Critical parameters . 47
C.2.3 Minimum allowable test margins . 47
C.2.4 Test options . 48
C.2.5 Quality assurance . 51
Annex D (informative) Higher assembly level testing . 54
D.1 General . 54
D.2 Process . 54
D.2.1 General . 54
D.2.2 Analysis of assembly test definition . 54
D.2.3 Perform assembly test . 54
D.2.4 Document results . 55
D.2.5 Maintenance notification . 55
Bibliography . 57
Figure 1 – Flow chart for semiconductor devices over wider temperature ranges . 14
Figure 2 – Report form for documenting device usage in over wider temperature
ranges . 23
Figure A.1 – Parameter re-characterisation . 25
Figure A.2 – Flow diagram of parameter re-characterisation capability assurance
process . 28
– 4 – IEC TR 62240-1:2018 RLV © IEC 2018
Figure A.3 – Margin in electrical parameter measurement based on the results of the
sample test .
...
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