Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 9: Planar cores

IEC 63093-9:2020 specifies the shapes and dimensions of ferrite cores for inductive components (transformers and chokes), whose the coil is typically made of multi-layer boards (or the coil is part of the motherboard), and the effective parameter values used in calculations. This document gives guidelines on allowable limits of surface irregularities applicable to planar-cores as well.
This document is considered as a sectional specification useful in the negotiation between ferrite core suppliers and users about surface irregularities.
This first edition cancels and replaces the first edition of IEC 60424-5 published in 2009 and first edition of IEC 62317-9 published in 2006 and its Amendment 1:2007. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous editions of IEC 60424-5 and IEC 62317-9:
a) IEC 63093-9 integrates IEC 60424-5 and IEC 62317-9;
b) Table 1, Table 2 and Table 3 in IEC 60424-5:2009 have been moved to Annex B;
c) some numbers are corrected in Table 4;
d) Table 6 is amended following IEC 60205.

Noyaux ferrites - Lignes directrices relatives aux dimensions et aux limites des irrégularités de surface - Partie 9: Noyaux planaires

L’IEC 63093-9:2020 spécifie les formes et dimensions des noyaux ferrites pour les composants inductifs (transformateurs et inductances) dont la bobine est généralement composée de la carte multicouche (ou la bobine fait partie de la carte mère) et des valeurs de paramètres effectifs utilisés dans les calculs. Le présent document donne des lignes directrices relatives aux limites admissibles des irrégularités de surface applicables également aux noyaux planaires.
Le présent document est considéré comme une spécification intermédiaire utile dans les négociations entre les fournisseurs de noyaux ferrites et leurs utilisateurs portant sur les irrégularités de surface.
Cette première édition annule et remplace la première édition de l’IEC 60424-5 parue en 2009 et la première édition de l’IEC 62317-9 parue en 2006 et son Amendement 1:2007. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport aux éditions précédentes de l’IEC 60424-5 et l’IEC 62317-9:
a) l’IEC 63093-9 réunit l’IEC 60424-5 et l’IEC 62317-9;
b) le Tableau 1, le Tableau 2 et le Tableau 3 contenus dans l’IEC 60424-5:2009 ont été déplacés vers l’Annexe B;
c) certains chiffres du Tableau 4 sont corrigés;
d) le Tableau 6 est modifié sur la base de l’IEC 60205.

General Information

Status
Published
Publication Date
15-Apr-2020
Current Stage
PPUB - Publication issued
Start Date
28-Apr-2020
Completion Date
16-Apr-2020
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IEC 63093-9 ®
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Ferrite cores – Guidelines on dimensions and the limits of
surface irregularities –
Part 9: Planar-cores
Noyaux ferrites – Lignes directrices relatives aux dimensions
et aux limites des irrégularités de surface –
Partie 9: Noyaux planaires
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IEC 63093-9 ®
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Ferrite cores – Guidelines on dimensions and the limits of

surface irregularities –
Part 9: Planar-cores
Noyaux ferrites – Lignes directrices relatives aux dimensions

et aux limites des irrégularités de surface –

Partie 9: Noyaux planaires
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10 ISBN 978-2-8322-8080-5

– 2 – IEC 63093-9:2020 © IEC 2020
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Primary dimensions . 7
4.1 Planar shapes and dimensions . 7
4.2 Dimensions and effective parameters of planar EL-core and mating PLT-core . 8
4.3 Dimensions and effective parameters of low-profile E-core and mating PLT-
core . 10
4.4 Dimensions and effective parameters of low-profile ER-core and mating
PLT-core . 12
5 Limits of surface irregularities . 15
5.1 General . 15
5.2 Examples of surface irregularities . 16
5.3 Chips and ragged edges . 17
5.3.1 General . 17
5.3.2 Chips and ragged edges on the mating surfaces . 17
5.3.3 Chips and ragged edges on other surfaces . 18
5.4 Cracks . 20
5.5 Flash . 20
5.6 Pull-outs . 20
5.7 Crystallites . 24
5.8 Pores . 24
Annex A (normative) Low-profile core design . 26
A.1 General design . 26
A.2 EL-core design . 26
A.3 ER-core design . 27
Annex B (informative) Reference values of allowable areas of chips . 29
Bibliography . 31

Figure 1 – Planar EL-core and mating PLT-core. 8
Figure 2 – Low-profile E-core and mating PLT-core . 10
Figure 3 – Low-profile ER-core and mating PLT-core . 12
Figure 4 – Examples of surface irregularities for planar EL-core . 16
Figure 5 – Examples of surface irregularities for low-profile E-core . 16
Figure 6 – Examples of surface irregularities for low-profile ER-core. 16
Figure 7 – Chip location for planar EL-core . 17
Figure 8 – Chip location for low-profile E-core . 17
Figure 9 – Chip location for low-profile ER-core . 17
Figure 10 – Cracks and pull-out location for planar EL-core . 20
Figure 11 – Cracks and pull-out location for low-profile E-core . 21
Figure 12 – Cracks and pull-out location for low-profile ER-core . 21
Figure 13 – Reference dimensions for EL-core . 21

Figure 14 – Reference dimensions for E-core . 22
Figure 15 – Reference dimensions for ER-core . 23
Figure 16 – Example of the location of a crystallite on planar EL-core . 24
Figure 17 – Example of the location of a crystallite on low-profile E-core . 24
Figure 18 – Example of the location of a crystallite on low-profile ER-core . 24
Figure 19 – Example of the location of a pore on planar EL-core . 25
Figure 20 – Example of the location of a pore on low-profile E-core . 25
Figure 21 – Example of the location of a pore on low-profile ER-core . 25

Table 1 – Dimensions of planar EL-core EL and mating PLT-core . 9
Table 2 – Effective parameter values and A values . 10
min
Table 3 – Dimensions of low-profile E-core and mating PLT-core . 11
Table 4 – Effective parameter values and A values . 12
min
Table 5 – Dimensions of low-profile ER-core and mating PLT-core . 13
Table 6 – Effective parameter values and A values . 14
min
Table 7 – Area and length reference for visual inspection . 19
Table 8 – Limits of cracks for planar EL-core . 22
Table 9 – Limits of cracks for low-profile E-core . 23
Table 10 – Limits of cracks for low-profile ER-core . 23
Table A.1 – Sizes and design ratios for ER-core . 28
Table B.1 – Allowable areas of chips for planar EL-core . 29
Table B.2 – Allowable areas of chips for low-profile E-core . 29
Table B.3 – Allowable areas of chips for low-profile ER-core. 30

– 4 – IEC 63093-9:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FERRITE CORES – GUIDELINES ON DIMENSIONS AND
THE LIMITS OF SURFACE IRREGULARITIES –

Part 9: Planar-cores
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC Natio
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