IEC 62024-1:2017

IEC 62024-1 ®
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Electrical characteristics and measuring
methods –
Part 1: Nanohenry range chip inductor

Composants inductifs à haute fréquence – Caractéristiques électriques et
méthodes de mesure –
Partie 1: Inductance pastille de l'ordre du nanohenry

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IEC 62024-1 ®
Edition 3.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Electrical characteristics and measuring

methods –
Part 1: Nanohenry range chip inductor

Composants inductifs à haute fréquence – Caractéristiques électriques et

méthodes de mesure –
Partie 1: Inductance pastille de l'ordre du nanohenry

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10 ISBN 978-2-8322-1088-0

– 2 – IEC 62024-1:2017 © IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Inductance, Q-factor and impedance . 6
4.1 Inductance . 6
4.1.1 Measuring method . 6
4.1.2 Measuring circuit . 6
4.1.3 Mounting the inductor for the test . 7
4.1.4 Measuring method and calculation formula . 8
4.1.5 Notes on measurement . 9
4.2 Quality factor . 10
4.2.1 Measuring method . 10
4.2.2 Measuring circuit . 10
4.2.3 Mounting the inductor for test . 10
4.2.4 Measuring methods and calculation formula . 10
4.2.5 Notes on measurement . 11
4.3 Impedance . 11
4.3.1 Measuring method . 11
4.3.2 Measuring circuit . 11
4.3.3 Mounting the inductor for test . 11
4.3.4 Measuring method and calculation . 11
4.3.5 Notes on measurement . 11
5 Resonance frequency . 12
5.1 Self-resonance frequency . 12
5.2 Minimum output method . 12
5.2.1 General . 12
5.2.2 Measuring circuit . 12
5.2.3 Mounting the inductor for test . 12
5.2.4 Measuring method and calculation formula . 13
5.2.5 Note on measurement . 13
5.3 Reflection method . 13
5.3.1 General . 13
5.3.2 Measuring circuit . 14
5.3.3 Mounting the inductor for test . 14
5.3.4 Measuring method . 15
5.3.5 Notes on measurement . 15
5.4 Measurement by analyser . 16
5.4.1 Measurement by impedance analyser . 16
5.4.2 Measurement by network analyser . 16
6 DC resistance . 16
6.1 Voltage-drop method. 16
6.1.1 Measuring circuit . 16
6.1.2 Measuring method and calculation formula . 17
6.2 Bridge method . 17
6.2.1 Measuring circuit . 17

6.2.2 Measuring method and calculation formula . 17
6.3 Notes on measurement . 18
6.4 Measuring temperature . 18
Annex A (normative) Mounting method for a surface mounting coil . 19
A.1 Overview. 19
A.2 Mounting printed-circuit board and mounting land . 19
A.3 Solder . 19
A.4 Preparation . 19
A.5 Pre-heating . 19
A.6 Soldering . 19
A.7 Cleaning . 19

Figure 1 – Example of circuit for vector voltage/current method . 7
Figure 2 – Fixture A . 7
Figure 3 – Fixture B . 8
Figure 4 – Short device shape . 10
Figure 5 – Example of test circuit for the minimum output method . 12
Figure 6 – Self-resonance frequency test board (minimum output method) . 13
Figure 7 – Example of test circuit for the reflection method . 14
Figure 8 – Self-resonance frequency test board (reflection method) . 15
Figure 9 – Suitable test fixture for measuring self-resonance frequency . 16
Figure 10 – Example of test circuit for voltage-drop method . 17
Figure 11 – Example of test circuit for bridge method . 18

Table 1 – Dimensions of l and d . 8
Table 2 – Short device dimensions and inductances . 10

– 4 – IEC 62024-1:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 1: Nanohenry range chip inductor

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62024-1 has been prepared by IEC technical committee 51:
Magnetic components, ferrite and magnetic powder materials.
This third edition cancels and replaces the second edition published in 2008. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) addition of voltage-drop method of DC resistance measuring;
b) unification of technical terms.

The text of this International Standard is based on the following documents:
CDV Report on voting
51/1187/CDV 51/1202/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62024 series, published under the general title High frequency
inductive components – Electrical characteristics and measuring methods, can be found on
the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 62024-1:2017 © IEC 2017
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 1: Nanohenry range chip inductor

1 Scope
This part of IEC 62024 specifies electrical characteristics and measuring methods for the
nanohenry range chip inductor that is normally used in high frequency (over 100 kHz) range.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of
defined flammability (vertical burning test) copper-clad
IEC 62025-1, High frequency inductive components – Non-electrical characteristics and
measuring methods – Part 1: Fixed, surface mounted inductors for use in electronic and
telecommunication equipment
ISO 6353-3, Reagents for chemical analysis – Part 3: Specifications – Second series
ISO 9453, Soft solder alloys – Chemical compositions and forms
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Inductance, Q-factor and impedance
4.1 Inductance
4.1.1 Measuring method
The inductance of an inductor is measured by the vector voltage/current method.
4.1.2 Measuring circuit
An example of the circuit for the vector voltage/current method is shown in Figure 1.

Ev
L
x
R
R
g
L
s
C
d
Ev
R
s
G
IEC
Key
R source resistance (50 Ω)
g
R resistor
L inductance of inductor under test
x
C distributed capacitance of inductor under test
d
L series inductance of inductor under test
s
R series resistance of inductor under test
s
phase reference signal
Ev , Ev vector voltmeter
1 2
G signal generator
Figure 1 – Example of circuit for vector voltage/current method
4.1.3 Mounting the inductor for the test
4.1.3.1 General
The inductor shall be measured in a test fixture as specified in the relevant standard. If no
fixture is specified, one of the following test fixtures A or B shall be used. The fixture used
shall be reported.
4.1.3.2 Fixture A
The shape and dimensions of fixture A shall be as shown in Figure 2 and Table 1.
Structure of connection
to the measurement circuit
Electrical
l length
External electrode
Central electrode
Dielectric material
Inductor under test
IEC
Figure 2 – Fixture A
d
– 8 – IEC 62024-1:2017 © IEC 2017
Table 1 – Dimensions of l and d
a
Size of inductor under test l d
mm mm
1 608 1,6 0,95
1 005 1,0 0,60
0 603 0,6 0,36
0 402 0,4 0,26
a
The outline dimensions of the surface mounted inductor shall be indicated by a four-digit number based on
two significant figures for each dimension L, and W (or H) (refer to IEC 62025-1).

The electrodes of the test fixture shall contact the electrodes of the inductor under test by
mechanical force provided by an appropriate method. This force shall be chosen so as to
provide satisfactory measurement stability without influencing the characteristics of the
inductor. The electrode force shall be specified. The structure between the measurement
circuit and the test fixture shall maintain a characteristic impedance as near as possible to
50 Ω.
4.1.3.3 Fixture B
The test fixture B as shown in Figure 3 shall be used.
External electrode
Inductor under test
Central electrode
d
Dielectric material
Structure of connection with
measurement circuit
IEC
Figure 3 – Fixture B
The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
test by mechanical force provided by an appropriate method. This force shall be chosen so as
to provide satisfactory measurement stability without influencing the characteristics of the
inductor. The electrode force shall be specified.
The structure between the measurement circuit and the test fixture shall maintain a
characteristic impedance as near as possible to 50 Ω.
Dimension d shall be specified between parties concerned.
4.1.4 Measuring method and calculation formula
Inductance L of the inductor L is defined by the vector sum of reactance caused by L and
x x s
C (see Figure 1). The frequency f of the signal generator output signal shall be set to a
d
frequency as separately specified. The inductor under test shall be connected to the
measurement circuit by using the test fixture as described above. Vector voltage E and E
1 2
shall be measured by vector voltage meters Ev and Ev , respectively. The inductance L
1 2 x
shall be calculated by the following formula:
 E 
lm R
 
E
 2
L = (1)
x
ω
where
L is the inductance of the inductor under test;
x
lm is the imaginary part of the complex value;
R is the resistance of the resistor;
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev ;
2 2
ω is the angular frequency: 2πf.
4.1.5 Notes on measurement
4.1.5.1 General
The electrical length of the test fixture shall be compensated by an appropriate method
followed by open-short compensation. If an electrical length that is not commonly accepted is
used, it shall be specified. Open-short compensation shall be calculated by the following
formulae:
Z − B
m c
Z = A (2)
x c
1− Z C
m c
A = 1 + j0 (3)
c
Z −(1− Y Z )Z − Z Y Z
sm om sm ss sm os ss
B = (4)
c
1− Y Z Y Z
om sm os ss
Y −(1− Y Z )Y − Y Y Z
om om sm os om os ss
C = (5)
c
1− Y Z Y Z
om sm os ss
where
Z is the impedance measurement value after compensation;
x
is the impedance measurement value before compensation;
Z
m
Z is the impedance measurement value of the short device;
sm
Z is the short device inductance as defined in 4.1.5.2;
ss
Y is the admittance measurement value of the fixture with test device absent;
om
Y is the admittance measurement value of the test fixture as defined in 4.1.5.3.
os
4.1.5.2 Short compensation
For test fixture A, the applicable short device dimension and shape are as shown in Figure 4
and Table 2. The appropriate short device inductance shall be selected from Table 2
depending on the dimension of the inductor under test. The inductance of the selected short
device shall be used as a compensation value.

– 10 – IEC 62024-1:2017 © IEC 2017
d
Gold-plated copper or
gold-plated equivalent metal
IEC
Figure 4 – Short device shape
Table 2 – Short device dimensions and inductances
Size of inductor l d Inductance value
under test
mm mm nH
1608 1,6 0,95 0,43
1005 1,0 0,60 0,27
0603 0,6 0,36 0,16
0402 0,4 0,26 0,11
If an inductance value other than defined in Table 2 is used for test fixture A, the employed
value shall be specified. For test fixture B, short device dimension, shape and inductance
values shall be specified.
4.1.5.3 Open compensation
Open compensation for test fixture A shall be performed with test fixture electrodes at the
same distance apart from each other as with the inductor under test mounted in the fixture.
The admittance Y is defined as 0 S (zero Siemens) unless otherwise specified.
os
Open compensation for test fixture B shall be performed without mounting the inductor. The
admittance Y is defined as 0 S (zero Siemens) unless otherwise specified.
os
4.2 Quality factor
4.2.1 Measuring method
The Q of the inductor shall be measured by the vector voltage/current method.
4.2.2 Measuring circuit
The measurement circuit is as shown in Figure 1.
4.2.3 Mounting the inductor for test
Mounting of the inductor is described in 4.1.3.
4.2.4 Measuring methods and calculation formula
The frequency of the signal generator (Figure 1) output signal shall be set to a frequency as
separately specified. The inductor shall be connected to the measurement circuit by using the
test fixture as described above. Vector voltage E and E shall be measured by vector voltage
1 2
meters Ev and Ev respectively. The Q value shall be calculated by the following formula:
1 2
l
Im[E / E ]
1 2
Q= (6)
Re[E / E ]
1 2
where
Q is the Q of the inductor under test;
Re is the real part of the complex value;
lm is the imaginary part of the complex value;
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev .
2 2
4.2.5 Notes on measurement
Refer to 4.1.5.
4.3 Impedance
4.3.1 Measuring method
The impedance of an inductor shall be measured by the vector voltage/current method. The
vector voltage/current method is as described in 4.3.2 to 4.3.5.
4.3.2 Measuring circuit
The measurement circuit is as shown in Figure 1.
4.3.3 Mounting the inductor for test
Mounting of the inductor is described in 4.1.3.
4.3.4 Measuring method and calculation
The frequency of the signal generator (Figure 1) output signal shall be set to a frequency f as
separately specified. The inductor shall be connected to the measurement circuit by using the
test fixture as described above. Vector voltage E and E shall be measured by vector voltage
1 2
meters Ev and Ev , respectively.
1 2
The impedance shall be calculated by the following formula:
E
Z= R
(7)
E
where
Z is the absolute value of the impedance;
R is the resistance;
E is the absolute value of Ev ;
1 1
E is the absolute value of Ev
2 2.
4.3.5 Notes on measurement
Refer to 4.1.5.
– 12 – IEC 62024-1:2017 © IEC 2017
5 Resonance frequency
5.1 Self-resonance frequency
The self-resonance frequency of the inductor shall be measured by the minimum output
method in 5.2, by the reflection method in 5.3 or by the impedance analyser in 5.4.
5.2 Minimum output method
5.2.1 General
The minimum output method is as described in 5.2.2 to 5.2.5.
5.2.2 Measuring circuit
The measuring circuit is as shown in Figure 5.
L
L
L
x
R
g
C
d
R
E L L L E V
G
1 1 2 2
Earth
Test board
IEC
Key
G signal generator
R source resistance of signal generator (50 Ω)
g
L inductance of inductor under test
x
C distributed capacitance of inductor under test
d
L inductance of inductor under test
L L 50 Ω micro-strip line
1, 2
V RF voltmeter
R input resistance of RF voltmeter (50 Ω)
L
A suitably calibrated network analyser may be used for the minimum output method in place of the signal generator
and RF voltmeter.
Figure 5 – Example of test circuit for the minimum output method
5.2.3 Mounting the inductor for test
The inductor shall be mounted on the self-resonance frequency test board specified in the
individual standard for the particular inductor by the method specified in Annex A. If there is
no individual standard, the self-resonance frequency test board shall be as shown in Figure 6.

Dimensions in millimetres
50 Ω micro-strip line
l
l
19,3
Earth plane covering whole bottom area
IEC
Key
Board material 96 % alumina ceramic board (ε ≅ 9,4)
Conductive material paste-printed or plated Cu, Ag-Pd to a total thickness of (15 to 30) µm
W 0,62 mm (reference value)
Solder joint field dimensions: hatched area
W same width as 50 Ω micro-strip line
l 1/2 length of the inductor under test
l length of the inductor under test + 0,4 mm
Figure 6 – Self-resonance frequency test board (minimum output method)
5.2.4 Measuring method and calculation formula
Using a circuit of the kind shown in Figure 5, keeping E fixed, the oscillating frequency of the
signal generator should be gradually increased until resonance is obtained as indicated by E
assuming its minimum value, which is then taken as the self-resonant value.
However, if the range of frequencies where E is minimal is wide, and the frequency of the
minimal value is not easily determined, the two frequencies f and f at which E is greater
1 2 2
than the minimum by A [dB] (A ≤ 3) shall be measured, and the self-resonance frequency
shall be obtained using the following formula:
f + f
1 2
Self-resonance frequency = (8)
5.2.5 Note on measurement
The width W of the micro-strip line shall be such that the characteristic impedance is as close
as possible to 50 Ω. The E value of the micro-strip line selected shall also allow easy
identification of the minimum value of E .
5.3 Reflection method
5.3.1 General
The reflection method is as described in 5.3.2 to 5.3.5.
W
t = 0,635
5,0
– 14 – IEC 62024-1:2017 © IEC 2017
5.3.2 Measuring circuit
The measurement circuit is as shown in Figure 7. The network analyser circuit used for
measurement shall be configured as shown in Figure 7, or shall have equivalent circuit
functions. In single port (S ) reflection measurement mode, phase measurement shall be
possible and the analyser shall be suitably calibrated.
Phase adj. L
x
C
d
Phase
comp.
L
L
Power splitter
Directional
coupler
G
Earth
RF network analyser
Test board
IEC
Key
G signal generator
L inductance of inductor under test
x
C distributed capacitance of inductor under test
d
L inductance of inductor under test
L 50 Ω micro-strip line
Figure 7 – Example of test circuit for the reflection method
5.3.3 Mounting the inductor for test
The inductor shall be mounted on the self-resonance frequency test board specified in the
individual standard for the particular inductor by the method specified in Annex A. If there is
no individual standard, the self-resonance frequency test board shall be as in Figure 8.

Dimensions in millimetres
50 Ω micro-strip line
l
l
19,3
Earth plane covering whole bottom area
IEC
Key
Board material: 96 % alumina ceramic board (ε ≅ 9,4)
Conductive material: paste-printed or plated Cu, Ag-Pd to a total thickness of (15 to 30) µm
W 0,62 mm (reference value)
Solder joint field dimensions: hatched area
W same width as 50 Ω micro-strip line
l 1/2 length of the inductor under test
l length of the inductor under test + 0,4 mm
Figure 8 – Self-resonance frequency test board (reflection method)
5.3.4 Measuring method
The test board (on which the inductor has not yet been mounted) shall be connected to a
suitably calibrated network analyser, and the phase adjuster shall be adjusted so that within
the range of oscillating frequencies of the scanning signal generator, the output of the phase
comparator shows the minimum phase difference (absolute value) between the incident and
reflected waves.
The inductor for test shall then be mounted on the test board, and the oscillating frequency of
the scanning signal generator shall gradually be swept from the low end to the high end.
The oscillating frequency of the scanning signal generator when the output of the phase
comparator shows the minimum phase difference (absolute value) between the incident and
reflected waves shall be taken as the self-resonance frequency.
5.3.5 Notes on measurement
The width W of the micro-strip line shall be such that the characteristics impedance is as close
as possible to 50 Ω. The output of the scanning signal generator shall be set within a range
that ensures stable operation of the phase comparator.
W
t = 0,635 5,0
– 16 – IEC 62024-1:2017 © IEC 2017
5.4 Measurement by analyser
5.4.1 Measurement by impedance analyser
Self-resonance frequency can be measured by measuring the impedance of the inductor
using the impedance analyser. When measuring self-resonance frequency, after
compensating for the unwanted capacitance (refer to 4.1.5.3), the inductor for test shall be
connected to the test fixture.
The exact value of the self-resonance frequency shall be the frequency where the first
imaginary part value of impedance equals zero, when sweeping the frequency of the
impedance analyser from the lower value to the higher value.
The test fixture for the measurement of the self-resonance frequency shall be the same as
that of the inductance.
5.4.2 Measurement by network analyser
The self-resonance frequency of the inductor can be measured by the power attenuation
method using the network analyser. During the measurement of the self-resonance frequency,
care shall be taken to avoid the influence of electromagnetic interference from other
electronic equipment. The sweeping frequency range of the network analyser shall include the
self-resonance frequency of the inductor.
The self-resonance frequency of the inductor shall be the frequency where the power
attenuation becomes a maximum. It shall be confirmed that the measured self-resonance
frequency is not the resonance of the test fixture.
An example of a test fixture for measurement of self-resonance frequency by the power
attenuation method is shown in Figure 9.
Placement force
Micro-strip line
Receptacles to be adjusted
to measuring equipment
Inductor
under test
l
Earth plane covering
whole bottom area
Glass epoxy:
FR4 (ε = 4,3 to 4,5)
2,25 mm
l: 1/2 length of the inductor under test
IEC
Figure 9 – Suitable test fixture for measuring self-resonance frequency
6 DC resistance
6.1 Voltage-drop method
6.1.1 Measuring circuit
An example of measuring circuit for DC resistance is shown in Figure 10.
1,6 mm
6.1.2 Measuring method and calculation formula
Use the circuit as shown in Figure 10.
Calculate DC resistance R of the coil from the following formula:
x
V
R =
(9)
x
I
where
V is the value indicated on (V)
I is the value indicated on (A)
L
x
V
R
v
E
E
A
IEC
Key
L inductance of inductor under test
x
E DC power supply
V DC voltmeter
A DC ammeter
R internal resistance of DC voltmeter: R >> R
v v x
Figure 10 – Example of test circuit for voltage-drop method
6.2 Bridge method
6.2.1 Measuring circuit
An example of the measuring circuit for DC resistance is shown in Figure 11.
6.2.2 Measuring method and calculation formula
Use the circuit as shown in Figure 11, balance the bridge by adjusting the proportional arm
resistors R and R and standard variable resister R , and calculate DC resistance R of the
1 2 3 x
coil from the following formula:
R
R = × R (10)
x 3
R
– 18 – IEC 62024-1:2017 © IEC 2017
R
R
E D
R
L
x
IEC
Key
R , R resistance of proportional arm resistors R , R
1 2 1 2
R resistance of standard variable resistor R
3 3
L inductance of inductor under test
x
E DC power supply
D detector
Figure 11 – Example of test circuit for bridge method
6.3 Notes on measurement
The precautions for measurements are as follows:
• measurement of resistance shall be made by using a direct voltage of a small magnitude
for as short a time as practicable, in order that the temperature of the resistance element
will not rise appreciably during measurement;
• measuring voltage: ≤ 0,5 V;
• measurement uncertainty ±0,5 % of measured value or ±0,001 Ω, whichever is greater;
• take care so that the temperature of the specimen coincides with the ambient temperature;
• keep the current passed through the specimen within a range so that the resistance of coil
will not change greatly;
• use of a double bridge is desirable for measuring especially low resistance.
6.4 Measuring temperature
The DC resistance shall meet the specified limits at a temperature of (20 ± 1) °C. When the
test is made at a temperature T other than 20 °C, the result shall be corrected to 20 °C by
e
means of Formula (11):
R
Te
T in °C (11)
R = ;
20 e
0,92+ 0,004T
e
Annex A
(normative)
Mounting method
for a surface mounting coil
A.1 Overview
Annex A specifies the method for mounting a surface mounting coil to be tested (hereinafter
referred to as “specimen”) to the testing printed-circuit board.
A.2 Mounting printed-circuit board and mounting land
A mounting printed-circuit board suitable to the construction of the specimen shall be used,
and it shall be specified in the detail specification. If there is no provision in the detail
+0,010
specification, the board [thickness (1,6 ± 0,19) mm, copper foil 0,035 mm mm] of
−0,005
epoxide woven glass fabric copper-clad laminate sheet specified in IEC 61249-2-7 shall be
used. It shall be a printed-circuit board on which the land for mounting the specimen is
previously located. The configuration of the land is indicated by the detail specification.
A.3 Solder
The solder shall be a solder paste prepared in such a way that a weakly active flux of
colophonium system is added to the solder of composition H60A or H63A specified in
ISO 9453 having a grain size 200 mesh or more to form a creamy paste. The viscosity is
subjected to agreement between the parties concerned with acceptance.
A.4 Preparation
The solder paste shall be coated on the lands of the testing printed-circuit board specified in
the detail specification to a thickness of (200 ± 50) µm and the specimen shall be placed so
that its terminations or electrodes are positioned on the pasted lands.
A.5 Pre-heating
The printed-circuit board on which the specimen is placed shall be heated at (150 ± 10) °C for
(60 to 120) s.
A.6 Soldering
After the pre-heating, the soldering shall be carried out immediately by using the reflow
soldering device. The soldering temperature shall be (235 ± 5) °C, and the time shall be within
10 s.
A.7 Cleaning
After the soldering, the printed-circuit board shall be cleaned by using the 2-propanol
specified in ISO 6353-3 to remove the flux. If necessary, the precaution for the cleaning
method shall be specified in the detail specification.
___________
– 20 – IEC 62024-1:2017 © IEC 2017
SOMMAIRE
AVANT-PROPOS . 22
1 Domaine d'application . 24
2 Références normatives . 24
3 Termes et définitions . 24
4 Inductance, facteur Q et impédance . 24
4.1 Inductance . 24
4.1.1 Méthode de mesure . 24
4.1.2 Circuit de mesure . 25
4.1.3 Montage de la bobine pour l'essai . 25
4.1.4 Méthode de mesure et formule de calcul . 27
4.1.5 Notes sur la mesure. 27
4.2 Facteur de qualité . 29
4.2.1 Méthode de mesure . 29
4.2.2 Circuit de mesure . 29
4.2.3 Montage de la bobine pour essai . 29
4.2.4 Méthodes de mesure et formule de calcul . 29
4.2.5 Notes sur la mesure. 29
4.3 Impédance . 29
4.3.1 Méthode de mesure . 29
4.3.2 Circuit de mesure . 29
4.3.3 Montage de la bob
...