IEC TR 62343-6-5:2014

IEC TR 62343-6-5 ®
Edition 2.0 2014-06
TECHNICAL
REPORT
colour
inside
Dynamic modules –
Part 6-5: Design guide – Investigation of operating mechanical shock and
vibration tests for dynamic modules

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IEC TR 62343-6-5 ®
Edition 2.0 2014-06
TECHNICAL
REPORT
colour
inside
Dynamic modules –
Part 6-5: Design guide – Investigation of operating mechanical shock and

vibration tests for dynamic modules

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
T
ICS 33.180.20 ISBN 978-2-8322-1641-5

– 2 – IEC TR 62343-6-5:2014 © IEC 2014
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Background . 6
3 Questionnaire results in Japan . 6
4 Evaluation plan . 7
5 Evaluation results . 7
5.1 Step 1 . 7
5.1.1 Evaluation of hammer impact . 7
5.1.2 Evaluation of adjacent board insertion and rack handle impact . 9
5.2 Step 2 . 9
5.3 Step 3 . 11
5.3.1 MEMS-VOA . 11
5.3.2 WSS and tuneable laser . 14
6 Simulation . 16
6.1 Simulation model . 16
6.2 Frequency characteristics . 17
6.3 Dependence on PC board design . 18
6.4 Consistency of evaluation and simulation results . 19
7 Summary . 19
8 Conclusions . 20
Annex A (informative) Results of a questionnaire on dynamic module operating shock
and vibration test conditions . 21
A.1 Background. 21
A.2 Questionnaire methodology . 21
A.3 Survey result. 21
Bibliography . 24

Figure 1 – Photos of evaluating hammer impact, rack and boards . 7
Figure 2 – Evaluation results of hammer impact H . 8
Figure 3 – Photos of evaluating adjacent board insertion and rack handle impact . 9

Figure 4 – DUT (VOA and WSS) installed on PC boards and rack for second step of
the evaluation . 10
Figure 5 – Oscilloscope display of waveform changes in vibration and optical output . 10
Figure 6 – Evaluation results when employing MEMS-VOA for Z-axis . 11
Figure 7 – Photos of the MEMS-VOA shock/vibration test equipment . 12
Figure 8 – Operating shock characteristics of MEMS-VOA . 12
Figure 9 – Vibration evaluation results for MEMS-VOA (Z-axis; 2 G) . 13
Figure 10 – Shock and vibration evaluation system for WSS and tuneable laser . 14
Figure 11 – Shock evaluation results for WSS (directional dependence) . 15
Figure 12 – Shock evaluation results for WSS (z-axis direction and shock dependence) . 15
Figure 13 – Simulation model . 17
Figure 14 – Vibration simulation results . 17
Figure 15 – Vibration simulation results (dependence on board conditions). 18

Table 1 – Rack and board specifications, conditions of evaluating hammer impact and
acquiring data . 8
Table 2 – Dynamic modules used in evaluation and evaluation conditions . 10
Table 3 – Conditions for MEMS-VOA vibration/shock evaluation . 12
Table 4 – Results of MEMS-VOA vibration evaluation . 13
Table 5 – Conditions for simulating board shock and vibration . 16
Table 6 – Comparison of hammer impact shock evaluation results and vibration
simulation (conditions: 1,6 mm × 240 mm × 220 mm, t × H × D) . 19
Table A.1 – Summary of survey results on operating shock and vibration test

conditions . 22

– 4 – IEC TR 62343-6-5:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DYNAMIC MODULES –
Part 6-5: Design guide –
Investigation of operating mechanical shock
and vibration tests for dynamic modules

FOREWORD
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The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62343-6-5, which is a technical report, has been prepared by subcommittee 86C: Fibre
optic systems and active devices, of IEC technical committee 86: Fibre optics.
This second edition cancels and replaces the first edition published in 2011. It constitutes
technical revision.
The main change with respect to the previous edition is the addition of “Results of a
questionnaire on dynamic module operating shock and vibration test conditions“ in Annex A.

The text of this technical report is based on the following documents:
Enquiry draft Report on voting
86C/1206/DTR 86C/1246/RVC
Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 62343 series, published under the general title Dynamic modules, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC TR 62343-6-5:2014 © IEC 2014
DYNAMIC MODULES –
Part 6-5: Design guide –
Investigation of operating mechanical shock
and vibration tests for dynamic modules

1 Scope
This part of IEC 62343, which is a technical report, describes an investigation into operating
mechanical shock and vibration for dynamic modules. It also presents the results of a survey
on the evaluation and mechanical simulation of mechanical shock and vibration testing. Also
included is a study of standardization for operating mechanical shock and vibration test
methods.
2 Background
The recent deployment of advanced, highly flexible optical communication networks using
ROADM (reconfigurable optical add drop multiplexing) systems has been accompanied by the
practical utilization of dynamic wavelength dispersion compensators, wavelength blockers and
wavelength selective switches as “dynamic modules.” Since these dynamic modules
incorporate such new technology as MEMS (micro electromechanical systems), there are
concerns about the vulnerability to operating shock and vibration conditions, which urgently
require establishing evaluation methods and conditions. Standards for shock and vibration
test conditions pertaining to storage and transport are already established, but methods and
conditions for evaluating operating shock and vibration are not yet established.
The JIS (Japanese Industrial Standards) committee consequently conducted a questionnaire
survey on the shock and vibration testing of passive optical components and dynamic
modules in commercial use. The survey revealed that many respondents confirmed a need to
standardize evaluation conditions for operating shock and vibration; some suggested
earthquake, hammer impact testing and inserting an adjacent board as cases of shock and
vibration during dynamic module operation. Based on the survey results, the JIS committee
evaluated operating shock and vibration by conducting hammer impact tests using several
dynamic modules, compared the results through simulation, and then recommended specific
evaluation conditions.
This technical report is based on OITDA (Optoelectronic Industry and Technology
Development Association) – TP (Technical Paper), TP05/SP_DM-2008, "Investigation on
operating vibration and mechanical impact test conditions for optical modules for telecom
use."
3 Questionnaire results in Japan
The JIS committee conducted a questionnaire on operating shock and vibration testing. The
questionnaire allowed the respondents to specify the optical components to be tested. This
questionnaire included optical switches, VOAs (variable optical attenuators) and tuneable
filters among the mechanical components used in all possible situations. The survey covered
18 organizations: eight Japanese manufacturers of mechanical optical components, eight
device makers as users of such components, and two research institutes. Reponses were
received from 14 of these organizations for a response rate of 78 %, among which 12
respondents specified optical switches, seven specified VOAs and three chose tuneable filters.
In tabulating the data, the survey asked questions regarding these three types of components
and described occurrences not dependent on the type of component, the manufacturer and
the user, and evaluation conditions.

The results revealed a strong need for the standardization of operating shock and vibration
evaluation methods and conditions for such dynamic modules as optical switches and VOAs.
A majority of respondents also requested that the hammer impact testing and the insertion of
an adjacent PC board be included as cases of operating shock and vibration.
4 Evaluation plan
Based on the survey results described in Clause 3, the appropriate conditions for shock and
vibration testing were determined based on an evaluation. The evaluation method consisted
of the following three steps:
Step 1: Measure the shock and vibration characteristics of a board with a shock sensor
inserted into a standard rack by striking the front face of the board with a hammer or by
inserting an adjacent PC board.
Step 2: Test an optical module installed in a standard rack by repeating the procedure in
Step 1. Measure any changes in the optical characteristics of the optical module.
Step 3: Use standard shock and vibration test equipment to reproduce the shock and vibration
characteristics obtained in Step 1 and the optical characteristics of the optical module
obtained in Step 2.
5 Evaluation results
5.1 Step 1
5.1.1 Evaluation of hammer impact
Board Shock sensor
Hammer
Dynamic module (470 g weight)
IEC  2032/14
Figure 1 – Photos of evaluating hammer impact, rack and boards
A PC board with a shock sensor attached is inserted into the rack. The front of the board is
then struck repeatedly by a hammer, along with an adjacent board being forcibly inserted in
order to measure the impact and frequency detected by the shock sensor. The handles
attached to the front edge of the rack are also forcibly struck by hand, with the impact being
measured as well. Figure 1 shows photos of the hammer impact as well as the rack and PC
boards. Table 1 below summarizes the specifications of the rack and PC boards, and the
conditions of evaluating hammer impact and the acquisition of data.

– 8 – IEC TR 62343-6-5:2014 © IEC 2014
Table 1 – Rack and board specifications, conditions
of evaluating hammer impact and acquiring data
Item Specification/Conditions
Rack size
432 mm (W) × 240 mm (D) × 262 mm (H)
Back connectors 2 pins – 96 pins
Number of PC boards 20
–
2 2
Striking force (acceleration intensity) H (1 800 m/s 2 400 m/s ) ~ 210 G
2 2
M (1 200 m/s – 1 600 m/s ) ~ 140 G
–
2 2
L (300 m/s 400 m/s ) ~ 35 G
Places to strike Top, middle of front panel of board
Board thickness 1,6 mm, 1,5 mm, 1,2 mm
Location of board Centre, side
Number of boards One, full size
Directions x, y, z
Data acquisition
40 µs × 5 000 points (200 ms)
Sensing frequency band 10 Hz – 10 kHz

Figure 2a shows the measurement results. Here, H denotes a high level of hammer impact (at
210 G). The location of impact is at the centre of the front face of a PC board 1,6 mm thick,
located at the centre of the 20 installed PC boards, with data being acquired on tests
repeated 11 times. Figure 2b shows the Fourier transform results of data based on the
frequency component.
IEC  2034/14
IEC  2033/14
Figure 2a – Measurement results Figure 2b – Fourier transformation data
Figure 2 – Evaluation results of hammer impact H
The results show vibration time in the range of 100 ms to 200 ms, with vibration amplitude
descending in order of z-axis > x-axis > y-axis. The peak shock (initial pulse) was 5 G to
10 G (in 2 ms to 5 m
...