IEC PAS 62239:2001

IEC/PAS 62239
Edition 1.0
2001-04
PRE-STANDARD
Electronic component
management plans
PUBLI C LY AVAI LABLE SPECI F I CATI O N
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62239
C O MMI S S I O N
INTERNATIONAL ELECTROTECHNICAL COMMISSION

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ELECTRONIC COMPONENT MANAGEMENT PLANS

FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to
promote international co-operation on all questions concerning standardization in the electrical and
electronic fields. To this end and in addition to other activities, the IEC publishes International Standards.
Their preparation is entrusted to technical committees; any IEC National Committee interested in the
subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates
closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has
representation from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the
form of standards, technical specifications, technical reports or guides and they are accepted by the
National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC
International Standards transparently to the maximum extent possible in their national and regional
standards. Any divergence between the IEC Standard and the corresponding national or regional standard
shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for
any equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the
subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
This PAS Pre-Standard has been published using a rapid procedure as a result of
technical consensus at the level of experts working on the subject within the IEC. The
normal IEC procedure for the preparation of an International Standard is pursued in
parallel and this Pre-Standard will be withdrawn upon publication of the corresponding
International Standard.
IEC-PAS 62239 has been processed by IEC technical committee 107: Process
management for avionics.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
107/2/PAS 107/7/RVD
Full information on the voting for the approval of this PAS Pre-Standard can be found in
the report on voting indicated in the above table.
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ELECTRONIC COMPONENT MANAGEMENT PLANS

Purpose
This document is intended to help aerospace equipment manufacturers, subcontractors,

maintenance facilities, and other aerospace component users develop their own

Electronic Component Management Plans (ECMPs), hereinafter also called the Plan.

This document states objectives to be accomplished; it does not require specific tasks to

be performed, specific data to be collected or reports to be issued. Those who prepare

Plans in compliance with this document are encouraged to document processes that are
the most effective and efficient for them in accomplishing the objectives of this
document. In order to allow flexibility in implementing and updating the documented
processes, Plan preparers are encouraged to refer to their own internal process documents
instead of including detailed process documentation within their Plans.
This component management document is intended for aerospace users of electronic
components. It is not intended for use by the manufacturers of electronic components.
Components selected and managed according to the requirements of a Plan compliant to
this document may be approved by the concerned parties for the proposed application,
and for other applications with equal or less severe requirements.
Organizations that prepare such Plans may prepare a single Plan, and use it for all
relevant products supplied by the organization, or may prepare a separate Plan for each
relevant product or customer.
1Scope
This document defines the requirements to assure customers and regulatory agencies that
all of the electronic components in the equipment of Electronic Component Management
Plan owners are selected and applied in controlled processes; and that the following
objectives are accomplished:
• Components are applied properly in the design
• Components are qualified for the intended application
• The quality of every individual component
• Component integrity and compatibility with manufacturing processes

• A process is in place to collect, store, retrieve, analyse, and act upon data related to
the component itself, and also relevant component data from equipment design,
equipment manufacturing, and component use in service
• Components are selected, substituted, and managed systematically by the equipment
supplier to maintain a traceable path to the qualified equipment through the operation
of an effective configuration control system
• Component availability, obsolescence and reliability are understood, and their
impacts on the application are understood and managed
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2 References
2.1 Normative References
2.2 Informative References
AS 9000 Aerospace Basic Quality System Standard, Appendix 1 Revised

1998, Society of Automotive Engineers

BSI PD6503 (1990) Toxicity of Combustion Products

BSI BS EN 190000 Harmonised System of Quality Assurance for Electronic
Components, Generic Specification Monolithic Integrated Circuits
CDF-AEC Q100 Stress Test Qualification for Automotive-Grade Integrated
Circuits, Chrysler-Delco-Ford Automotive Electronics Council
CDF-AEC Q101 Stress Test Qualification for Automotive-Grade Discrete
Semiconductors, Chrysler-Delco-Ford Automotive Electronics
Council
CDF-AEC Q200 Stress Test Qualification for Automotive-Grade Passive
Components, Chrysler-Delco-Ford Automotive Electronics
Council
CECC EN 190000 Harmonised System of Quality Assurance for Electronic
Components General Specification Monolithic Integrated Circuits
CECC 00114 Rules of Procedure Quality Assessment Procedures
EIA JESD22-A112-A JEDEC Standard –Test Method A112-A, Moisture Induced Stress
Sensitivity for Plastic Surface Mount Devices
EIA JESD22-A113-B(1999)Test Method A113-B Preconditioning of Nonhermetic
Surface Mount Devices Prior to Reliability Testing
EN 100015-1 (1992) Basic Specification: Protection of Electrostatic Sensitive
Devices - Part 1: General Requirements
EN 100015-2 (1993) Basic Specification: Protection of Electrostatic Sensitive
Devices - Part 2: Requirements for Low Humidity Conditions
EN 100015-3 (1993) Basic Specification: Protection of Electrostatic Sensitive
Devices - Part 3: Requirements for Clean Room Areas

EN 100015-4 (1993) Basic Specification: Protection of Electrostatic Sensitive
Devices - Part 4: Requirements for High-Voltage Environments
EN 100114-1 (1996) Rules of Procedure 14: Quality Assessment Procedures –
Part 1: CECC Requirements for the Approval of an Organisation
EN 100114-6 (1996) Rules of Procedure 14: Quality Assessment Procedures –
Part 6: Technology Approval of Electronic Component
Manufacturers
EN ISO 9000-1 (1994) Quality Management and Quality Assurance Standards –
Part 1: Guidelines for Selection and Use
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EN ISO 9000-2 (1997) Quality Management and Quality Assurance Standards –

Part 2: Generic Guidelines for the Application of ISO 9001, ISO

9002 and ISO 9003
EN ISO 9000-3 (1997) Quality Management and Quality Assurance Standards –

Part 3: Guidelines for the Application of ISO 9001:1994 to the

Development, Supply, Installation and Maintenance of Computer

Software
EN ISO 9000-4 (1993) Quality Management and Quality Assurance Standards –

Part 4: Guide to Dependability Program Management.

IEC/CEI 300-1
IEC 107/3/PAS IEC PAS Pre-Standard 62240 Avionics Industry: Use of
Semiconductor Devices Outside Manufacturers’ Specified
Temperature Ranges
IEC 107/4/PAS Avionics Industry: Reliability Assessment of Electronic Equipment
IEC QC 001002-3 Rules of Procedure, Part 3: Approval procedures
IEC QC001004 Specification List
IEC 47A/532/CD (1998)[Draft] Integrated Circuits, Measurement of
Electromagnetic Emissions, 150 KHz to 1 GHz (IEC Project
No 61967)
IEC 61340-5-1 (1998) Electrostatics – Part 5-1: Protection of Electronic Devices
from Electrostatic Phenomena – General Requirements
IEC 61340-5-2 (1999) Electrostatics – Part 5-1: Protection of Electronic Devices
from Electrostatic Phenomena – User Guide
IPC/JEDEC J-STD-020A (1999)Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
ISO 9000 Quality Management and Quality Assurance Standards
ISO 9001 Quality Systems – Model for Quality Assurance in Design,
Development, Production, Installation and Servicing
MIL-PRF-38535 Microcircuit Manufacturing, General Requirements for
MIL-STD-883 Test Method Standards, Microcircuits

MIL-PRF-19500 Semiconductor Devices, General Specification for
QS 9000 Quality System Requirements – Automotive Industry
S0001 General Requirements for Integrated Circuits, Stack International
3 Terms and Definitions
Airborne equipment environment is the applicable environmental conditions (as described
per the equipment specification) that the equipment shall be able to withstand without
loss or degradation in equipment performance during all of its manufacturing cycle and
service life.
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Capable is a term used to indicate that a component can be used successfully in the

intended application.
Certified indicates compliance to an applicable government standard, an applicable

industry consensus standard, or the component manufacturer’s documented, equivalent

internal standard.
Characterization is a process of testing a sample of components to determine the key

electrical parameter values that can be expected of all produced components of the type

tested.
Component application is the process that assures that the component meets the design

requirements of the equipment in which it is used.
Component manufacturer is the organization responsible for the component specification
and its production.
Component obsolescence management is the range of management actions taken to avoid
or resolve the effects of components not being procurable due to the manufacturer(s)
ceasing production. Component obsolescence management should be considered an
element of risk management. (See risk management.)
Component qualification is the process used to demonstrate that the component is capable
of meeting its specification in all the required environments.
Component quality assurance is all activities and processes to provide adequate
confidence that each individual component is free of defects.
Component selection is the process of choosing a specific component for a specific
application.
Dependability is the measure of being dependable through meeting reliability,
maintainability or survivability expectations.
Distributor is an organization contractually authorized by a manufacturer to store, split,
repack and distribute completely finished components which have been declared by the
manufacturer as conforming to their specifications. The distributor is responsible for
providing any technical information and traceability information supplied by the
component manufacturer.
Electronic Component Management Plan (ECMP) is an equipment manufacturer's
document that defines the processes and practices for applying components to an
equipment or range of equipment. Generally, it addresses all relevant aspects of

controlling components during system design, development, production, and post-
production support.
Electronic components are electrical or electronic devices that are not subject to
disassembly without destruction or impairment of design use. They are sometimes called
electronic parts, or piece parts. Examples are resistors, capacitors, diodes, integrated
circuits, hybrids, application specific integrated circuits, wound components and relays.
Electronic equipment is an item produced by the Plan owner, which incorporates
electronic components. Examples are end items, sub-assemblies, line-replaceable units
and shop-replaceable units.
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May indicates a course of action which is permissible within the limits of this document.

Normative reference is a reference for which compliance is required by this document.

Informative reference is a reference that is for information only, and compliance is not

required by this document.
Obsolete component is a component which is no longer manufactured, and may or may

not still be available.
Risk is a measure of the potential inability to achieve overall program objectives within

defined cost, schedule, and technical constraints. Risk has two components: (1) the

probability (or likelihood) of failing to achieve a particular outcome, and (2) the
consequences (or impact) of failing to achieve that outcome.
Risk management is the act or practice of dealing with risk. It includes planning for risk,
assessing (identifying and analyzing) risk areas, developing risk-handling options,
monitoring risks to determine how risks have changed, and documenting the overall risk
management program. (See Risk.)
Shall indicates a requirement.
Should offers a guideline or recommendation that might be used or helpful to assure
compliance to an objective.
Single event effect is the radiation response of a component caused by the impact of
galactic cosmic rays, solar enhanced particles and/or energetic neutrons and protons. The
range of responses can include both non-destructive (e.g. upset) and destructive (e.g.
latch-up or gate rupture) phenomena.
Subcontractor is a person or entity to whom the holder of obligations under a contract has
delegated part or all of such obligations.
Substitute or substitute component is a component used as a replacement in equipment
after the equipment design has been approved. (In some contexts, the term “alternate
component” is used to describe a substitute component that is “equal to or better than”
the original component.)
Will expresses a declaration of intent when used in the context of being compliant to this
document or to an ECMP.
4 Technical Requirements
The Plan shall document the processes used by the Plan owner to accomplish the
objectives listed in clause 1 of this document. The Plan shall state clearly, concisely, and
unambiguously:
! What the Plan owner does to accomplish each of the objectives;
! How compliance to the Plan is demonstrated; and
! The evidence that is available to show that the objectives have been accomplished.
The Plan shall document the processes used to address each of the requirements of this
clause.
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Where specific objectives of clause 1 do not apply, the Plan owner may, with appropriate

justification, amend the list of objectives in clause 1 by adding, deleting, or modifying

objectives. If this is done, the Plan shall be assessed according to the amended list of

objectives, as stated in the Plan.

If the Plan owner obtains components from a distributor or other third party source, the

relevant requirements of this document shall apply also to that source. The following

requirements apply to all electronic components, including commercial-off-the shelf

(COTS), which are defined by the component manufacturer data sheet, and custom,

which are defined by the design holder specification.

The selected components shall fulfill all functional requirements and parameters, as
specified and required for the overall environment and mission profile (thermal,
mechanical, radiation, etc.) for all their forecasted life.
The conditions for use of the component shall be adequately identified, from the
component specification based on the component manufacturer’s data sheet and any
additional requirements to ensure suitability in the end application. Availability and level
of obsolescence risk shall be considered as a major component selection criterion.
4.1 Component Application
Listed here are some categories of component application processes that may be
documented in a Plan. Not all of the categories listed below are relevant to every
component application; therefore, the requirements listed below are applicable only if
relevant to the given application.
4.1.1 Functionality
The documented processes shall verify that the selected components satisfy the
functional requirements for each application.
Note: Examples of these processes include analysis, modelling, simulation, and testing. If
software is used for any of these processes, it should be described briefly.
4.1.2 Electromagnetic Compatibility
The documented processes shall verify that the component is capable of electromagnetic
compatibility (EMC) compliance at the equipment level.
Note: Certain components, e.g., high-power switching devices, may generate stronger
electromagnetic signals than others, and some components are more susceptible than others to
electromagnetic interference. IEC 47A/532/NP addresses this in more detail.
Note: EMC compatibility may be demonstrated by analysis, testing, and simulation.
4.1.3 De-rating and Stress Analysis
The documented processes shall define the limits within which the component is used,
and the methods and criteria used to determine those limits.
The documented processes shall verify that the component is used within the limits
defined above.
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All instances in which a component is not used within the limits defined above shall be

documented in the design records. In all such instances, either corrective action shall be

taken, or justification for not satisfying the criteria shall be documented.

Note: Typically, the component manufacture provides derating criteria and methods, and

they should be used where applicable. If the component manufacturer does not provide this

information, or if it is not applicable, then the Plan owner should develop and document

them.
4.1.4 Thermal Analysis
The documented processes shall verify that the component is used within the temperature
limits specified by the component manufacturer, or by the Plan owner.
If the component is not used within the temperature limits specified by the component
manufacturer, then the processes of IEC CA-AWG/2/DC shall be followed.
Note: A common maximum temperature for semiconductor devices is the junction
temperature. In some instances for semiconductor devices, and for other types of
components, other temperatures may be specified.
Note: In some instances, the maximum temperature may not be specified by the
manufacturer. In such instances, the maximum temperature may be calculated from other
information supplied by the component manufacturer.
Note: Verification processes may include analysis, modelling, thermal survey, simulation, or
testing.
4.1.5 Mechanical Analysis
The documented processes shall verify that the component is mechanically compatible
with the application. This includes mechanical fit, as well as the ability to withstand
vibration, mechanical shock, mechanical stresses generated by mismatches of coefficients
of thermal expansion of the different materials, and other mechanical stresses.
Note: Verification processes may include analysis, modeling, simulation, or testing.
4.1.6 Producibility
The documented processes shall verify that the component is useable in the production
cycle of the equipment, in an efficient manner, without detrimental effects on the
component.
4.1.7 Testing, Testability, and Maintainability
The documented processes shall assure testability of the equipment.
Note: The focus here is on testing and testability with regard to component verification, not
on software or system verification. Examples include board level or sub-assembly level
testing, provision for test pins, and that other equipment level tests will be available to verify
component function at the appropriate level. Exhaustive testing of complex components is not
always realistic, but documented processes should assure some level of evaluation of all
components at appropriate points in the production flow.
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Note: This requirement also includes design for maintainability, e.g., placement for ease of

component replacement, mounting that minimises the risk of damage during maintenance and

assures equipment quality following maintenance or repair.

4.1.8 Avionics Radiation Environment

The documented processes shall verify that the component will operate successfully in

the application with regard to the effects of atmospheric radiation, including single event

upset (SEU), single event latchup (SEL), and single event burnout (SEB). If radiation

effects are accommodated by the equipment design, then the method of accommodation

shall be documented in the equipment design records.
4.1.9 Toxic Emissions
The documented processes shall verify that the component, when overheated or burned,
will not emit sufficient quantities of toxic or otherwise harmful gases to compromise the
safety or health of personnel associated with the application.
Note: Personnel may include pilots, flight attendants, passengers, maintenance personnel, or
others. In some applications, e.g., satellites in service, the relevance of this requirement may
be limited or non-existent.
Note: A suitable method to evaluate toxicity of materials is described in BSI PD 6503, Parts
1 and 2.
4.2 General Qualification Requirements
The documented processes shall verify that the component is qualified using relevant,
credible data.
This requirement lists the requirements for qualifying components used within the
component manufacturer’s specification range. If the component is used outside the
manufacturer’s specification range, then the processes of IEC CA-AWG/2/DC shall be
used in addition to these requirements.
Note: This clause lists the requirements for qualifying component manufacturers (5.2.1), the
qualification requirements for components obtained from qualified component manufactures
(5.2.2), and the qualification requirements for components obtained from component
manufacturers who have not been qualified (5.2.3).
4.2.1 Component Manufacturer Qualification

The following shall be required to qualify an electronic component manufacturer
A. Quality Management System: The component manufacturer shall have a quality
management system assessed and approved according to the relevant parts of ISO
9000, or equivalent.
B. Component Qualification: Components manufactured by the component
manufacturer shall be qualified according to an applicable government standard, an
applicable industry consensus standard, or the component manufacturer’s
documented, applicable qualification process.
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C. Component Manufacturing and Quality Assurance: The component manufacturer

shall have manufacturing and quality assurance processes assessed and approved

according to relevant standards.

Note: Recommended assessment bodies are the IECQ, CECC, STACK International, Defense

Supply Center Columbus (DSCC), or equivalent.

4.2.2 Qualifying Components from Qualified Component Manufacturers

Components obtained from component manufacturers who have been qualified according

to the requirements of 5.2.1 shall be qualified with data from one or more of the

following:
A. Component Standards: The components shall be compliant to an applicable
government standard, an applicable industry consensus standard, or the component
manufacturer’s documented,
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