EN 60747-16-4:2004

SLOVENSKI STANDARD
01-december-2005
Polprevodniški elementi – 16-4. del: Mikrovalovna integrirana vezja – Stikala (IEC
60747-16-4:2004)
Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches
Halbleiterbauelemente -- Teil 16-4: Integrierte Mikrowellenschaltkreise - Schalter
Dispositifs à semiconducteurs -- Partie 16-4 : Circuits intégrés hyperfréquences -
Commutateurs
Ta slovenski standard je istoveten z: EN 60747-16-4:2004
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60747-16-4
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2004

ICS 31.080.99
English version
Semiconductor devices
Part 16-4: Microwave integrated circuits –
Switches
(IEC 60747-16-4:2004)
Dispositifs à semiconducteurs Halbleiterbauelemente
Partie 16-4 : Circuits intégrés Teil 16-4: Integrierte
hyperfréquences – Mikrowellenschaltkreise –
Commutateurs Schalter
(CEI 60747-16-4:2004) (IEC 60747-16-4:2004)

This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60747-16-4:2004 E
Foreword
The text of document 47E/256/FDIS, future edition 1 of IEC 60747-16-4, prepared by SC 47E,
Discrete semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the
IEC-CENELEC parallel vote and was approved by CENELEC as EN 60747-16-4 on 2004-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60747-16-4:2004 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60747-16-1 NOTE Harmonized as EN 60747-16-1:2002 (not modified).
__________
- 3 - EN 60747-16-4:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60617-12 - Graphical symbols for diagrams EN 60617-12 1998
Part 12: Binary logic elements

1) 2)
IEC 60617-13 - Part 13: Analogue elements EN 60617-13 1993

IEC 60747-1 1983 Semiconductor devices - Discrete devices- -
Part 1: General
A3 1996 - -
1)
IEC 60747-4 - Part 4: Microwave diodes and transistors- -

1)
IEC 60748-2-1 - Semiconductors devices - Integrated - -
circuits
Part 2: Digital integrated circuits - Section
one - Blank detail specification for bipolar
monolithic digital integrated circuit gates
(excluding uncommitted logic arrays)

1)
IEC 60748-3 - Part 3: Analogue integrated circuits - -

1)
IEC 60748-4 - Part 4: Interface integrated circuits - -

1)
Undated reference.
2)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD 60747-16-4
First edition
2004-07
Semiconductor devices –
Part 16-4:
Microwave integrated circuits –
Switches
” IEC 2004  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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– 2 – 60747-16-4 ” IEC:2004(E)
CONTENTS
FOREWORD.3
1 Scope .5
2 Normative references .5
3 Terms and definitions .5
4 Essential ratings and characteristics .7
4.1 Circuit identification and types .7
4.2 Application description.8
4.3 Specification of the function .8
4.4 Limiting values (absolute maximum rating system) .10
4.5 Operating conditions (within the specified operating temperature range) .11
4.6 Electrical characteristics .11
4.7 Mechanical and environmental ratings, characteristics and data .12
4.8 Additional information .12
5 Measuring methods .13
5.1 General .13
5.2 Insertion loss (L ) .14
ins
5.3 Isolation (L ) .16
iso
5.4 Return loss (L ) .18
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) .20
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ).21
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) .23
o(mod) adj
5.8 n-th order harmonic distortion ratio (P /P ).26
nth 1
Bibliography .28
Figure 1 – Circuit diagram for the measurement of the insertion loss L .14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L .16
iso
Figure 3 – Circuit for the measurements of the return loss .18
Figure 4 – Circuit for the measurements of switching time.21
Figure 5 – Input and output waveforms.21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio .23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio .26

60747-16-4 ” IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/256/FDIS 47E/261/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 60747-16-4 ” IEC:2004(E)
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

60747-16-4 ” IEC:2004(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-4: Microwave integrated circuits –
Switches
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition
...