EN 62047-5:2011

SLOVENSKI STANDARD
01-oktober-2011
Polprevodniški elementi - Mikroelektromehanski elementi - 5. del: Stikala RF
MEMS
Semiconductor devices - Microelectromechanical devices - Part 5: RF MEMS switches
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 5 :
Commutateurs MEMS-RF
Ta slovenski standard je istoveten z: EN 62047-5:2011
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62047-5
NORME EUROPÉENNE
August 2011
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices -
Part 5: RF MEMS switches
(IEC 62047-5:2011)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauelemente der Mikrosystemtechnik -
Partie 5: Commutateurs MEMS-RF Teil 5: Hochfrequenz-MEMS-Schalter
(CEI 62047-5:2011) (IEC 62047-5:2011)

This European Standard was approved by CENELEC on 2011-08-17. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-5:2011 E
Foreword
The text of document 47F/83/FDIS, future edition 1 of IEC 62047-5, prepared by SC 47F, Micro-
electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC
parallel vote and was approved by CENELEC as EN 62047-5 on 2011-08-17.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2012-05-17
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2014-08-17
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-5:2011 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62047-5:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60747-1 2006 Semiconductor devices - - -
+ corr. August 2008 Part 1: General

IEC 60747-16-1 - Semiconductor devices - EN 60747-16-1 -
Part 16-1: Microwave integrated circuits -
Amplifiers
IEC 60747-16-4 2004 Semiconductor devices - EN 60747-16-4 2004
Part 16-4: Microwave integrated circuits -
Switches
IEC 60749-5 - Semiconductor devices - Mechanical and EN 60749-5 -
climatic test methods -
Part 5: Steady-state temperature humidity
bias life test
IEC 60749-10 - Semiconductor devices - Mechanical and EN 60749-10 -
climatic test methods -
Part 10: Mechanical shock
IEC 60749-12 - Semiconductor devices - Mechanical and EN 60749-12 -
climatic test methods -
Part 12: Vibration, variable frequency

IEC 60749-27 - Semiconductor devices - Mechanical and EN 60749-27 -
climatic test methods -
Part 27: Electrostatic discharge (ESD)
sensitivity testing - Machine model (MM)

IEC 62047-5 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 5: RF MEMS switches
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 5: Commutateurs MEMS-RF

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX V
ICS 31.080.99 ISBN 978-2-88912-584-5

– 2 – 62047-5  IEC:2011
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
3.1 Switching operation . 7
3.2 Switching configuration . 7
3.3 Actuating mechanism . 7
3.4 Switching network configurations . 8
3.5 Reliability (performance) . 8
3.6 Electrical characteristics . 9
4 Essential ratings and characteristics . 10
4.1 Identification and types . 10
4.2 Application and specification description . 11
4.3 Limiting values and operating conditions . 11
4.4 DC and RF characteristics . 11
4.5 Mechanical and environmental characteristics . 12
4.6 Additional information . 12
5 Measuring methods . 12
5.1 General . 12
5.1.1 General precautions . 12
5.1.2 Characteristic impedances . 12
5.1.3 Handling precautions . 12
5.1.4 Types . 12
5.2 DC characteristics . 12
5.2.1 DC actuation voltage . 12
5.2.2 On or off resistance (d.c. contact or resistive type) . 14
5.2.3 On or off capacitance (capacitive type) . 15
5.2.4 Power consumption . 16
5.3 RF characteristics . 17
5.3.1 Insertion loss (L ) . 17
ins
5.3.2 Isolation (L ) . 19
iso
5.3.3 Voltage standing wave ratio (VSWR) . 20
5.3.4 Input power at the intercept point . 21
5.4 Switching characteristics . 21
5.4.1 General . 21
5.4.2 Switching time measurement . 21
6 Reliability (performance). 22
6.1 General . 22
6.2 Life time cycles . 22
6.2.1 General . 22
6.2.2 Cold switching . 23
6.2.3 Hot switching or power handling . 23
6.3 Temperature cycles . 24
6.3.1 General . 24
6.3.2 Test temperature . 24
6.3.3 Test cycle . 24

62047-5  IEC:2011 – 3 –
6.4 High temperature and high humidity testing . 24
6.5 Shock testing . 25
6.6 Vibration testing . 25
6.7 Electrostatic discharge (ESD) sensitivity testing . 25
Annex A (informative) General description of RF MEMS Switches. 26
Annex B (informative) Geometry of RF MEMS switches . 27
Annex C (informative) Packaging of RF MEMS switches . 30
Annex D (informative) Failure mechanism of RF MEMS switches . 31
Annex E (informative) Applications of RF MEMS switches . 32
Annex F (informative) Measurement procedure of RF MEMS switches . 34

Figure 1 – Terminals of RF MEMS switch . 11
Figure 2 – Circuit diagram for measuring d.c. actuation voltage and RF characteristics
of RF MEMS switches . 13
Figure 3 – Circuit diagram for measuring impedance between the input and output
ports . 14
Figure 4 – Circuit diagram for measuring RF characteristics between the input and
output ports using a network analyzer . 18
Figure 5 – Circuit block diagram of a test setup to evaluate life time of RF MEMS
switch . 22
Figure 6 – Circuit block diagram of a test setup for power handling capability of RF
MEMS switch . 24
Figure B.1 – RF MEMS series d.c. contact switch with two contact areas. . 27
Figure B.2 – RF MEMS series d.c. contact switch with one contact area . 27
Figure B.3 – RF MEMS shunt d.c. contact switch . 28
Figure B.4 – RF MEMS series capacitive type switch with one contact area . 28
Figure B.5 – RF MEMS shunt capacitive type switch . 29
Figure F.1 – Measurement procedure of RF MEMS switches . 34

Table A.1 – Comparison of semi
...