prEN IEC 62496-2-6:2026
(Main)Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field pattern analysis of multimode optical waveguides with rectangular core(s) using encircled flux methodology
Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field pattern analysis of multimode optical waveguides with rectangular core(s) using encircled flux methodology
Cartes à circuits optiques - Partie 2-6: Procédures fondamentales d’essais et de mesures - Analyse de diagrammes de rayonnement en champ proche de guides d’ondes optiques multimodales à cœurs rectangulaires en utilisant la méthodologie du flux inscrit
Plošče z optičnimi vezji - 2-6. del: Osnovni preskusni in merilni postopki - Analiza vzorca bližnjega polja mnogorodovnih optičnih valovodov s pravokotnim jedrom (jedri) z uporabo metodologije obkroženega toka
General Information
- Status
- Not Published
- Publication Date
- 25-Jul-2027
- Technical Committee
- CLC/SR 86 - Fibre optics
- Current Stage
- 4020 - Enquiry circulated - Enquiry
- Start Date
- 09-Jan-2026
- Due Date
- 30-May-2025
- Completion Date
- 09-Jan-2026
Overview
prEN IEC 62496-2-6:2026 is a draft international standard developed by the International Electrotechnical Commission (IEC) and the European Committee for Electrotechnical Standardization (CLC). It defines basic test and measurement procedures for the near field pattern analysis of multimode optical waveguides with rectangular cores, using the encircled flux (EF) methodology. Focusing exclusively on optical circuit boards, this standard establishes consistent measurement protocols crucial for ensuring reliable performance and interoperability of optical interconnects, especially as demand for high bandwidth density and signal integrity continues to grow.
Key Topics
- Near Field Pattern (NFP) Analysis: Specifies methods for capturing and analyzing the two-dimensional optical power distribution at the end facet of multimode optical waveguides with rectangular core(s).
- Encircled Flux (EF) Methodology: Outlines procedures for using the EF method to quantify the optical power distribution, aiding comparison between devices and supporting rigorous product assessment.
- Test Equipment and Setup:
- Light sources suited for multimode waveguides
- Imaging devices (CCD/CMOS sensors)
- Micro-positioners for precise alignment
- Near field pattern optical systems and analyzer modules
- Measurement Process:
- Removal of dark current from imaging devices
- Alignment of waveguide end-faces
- Acquisition of near field images
- Determination of core center, region of interest (ROI), and background noise regions
- Computation of power distribution using the encircled flux scale
- Data and Results:
- Ensures clarity on what information must be provided with each measurement and upon request
- Guidance on analyzing typical measurement outputs and example cases
Applications
prEN IEC 62496-2-6:2026 delivers real practical value across industries implementing high-speed optical interconnects, especially in the development and testing of optical printed circuit boards (OPCBs). Key applications include:
- Data Communication Systems: Supports the reliable integration of optical interconnects within backplanes, motherboards, and peripheral circuit boards to meet escalating bandwidth and signal integrity requirements.
- Automotive Networks: Facilitates the testing of waveguides integral to high-bandwidth, in-vehicle communication systems, enhancing electromagnetic compatibility and supporting advanced driver-assistance and autonomous vehicle technologies.
- Telecommunications: Enables standardized measurement necessary for quality control in the mass deployment of optical networking hardware.
- Device Qualification and R&D: Provides test houses, OEMs, and research institutions with harmonized methods to characterize and compare multimode optical waveguides, ensuring products meet international performance and safety criteria.
Related Standards
Implementing prEN IEC 62496-2-6:2026 may require reference to several related international standards, including:
- IEC 62496 Series: Covers other aspects of optical circuit boards, test methods, and measurement procedures.
- IEC 60825-1: Safety of laser products, specifying equipment classification and requirements for safety in test environments.
- IEC 60793-2-10: Optical fiber types, particularly for OM3 multimode fibers.
- IEC 60793-2-40: Specifications for A4i multimode optical fibers relevant for connecting waveguides.
- IEC 61280-1-4: Defines the encircled flux (EF) measurement method for multimode optical fibers.
Summary
By adopting prEN IEC 62496-2-6:2026, organizations can ensure precise, repeatable assessments of multimode optical waveguides with rectangular cores, underpinning the performance, interoperability, and quality of optical circuit boards in advanced communication systems. This standard aligns measurement practices across manufacturers and industries, supporting innovation and reliability in the rapidly evolving field of optical interconnects.
Frequently Asked Questions
prEN IEC 62496-2-6:2026 is a draft published by CLC. Its full title is "Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field pattern analysis of multimode optical waveguides with rectangular core(s) using encircled flux methodology". This standard covers: Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field pattern analysis of multimode optical waveguides with rectangular core(s) using encircled flux methodology
Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field pattern analysis of multimode optical waveguides with rectangular core(s) using encircled flux methodology
prEN IEC 62496-2-6:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2026
Plošče z optičnimi vezji - 2-6. del: Osnovni preskusni in merilni postopki - Analiza
vzorca bližnjega polja mnogorodovnih optičnih valovodov s pravokotnim jedrom
(jedri) z uporabo metodologije obkroženega toka
Optical circuit boards - Part 2-6: Basic test and measurement procedures - Near field
pattern analysis of multimode optical waveguides with rectangular core(s) using
encircled flux methodology
Cartes à circuits optiques - Partie 2-6: Procédures fondamentales d’essais et de
mesures - Analyse de diagrammes de rayonnement en champ proche de guides d’ondes
optiques multimodales à cœurs rectangulaires en utilisant la méthodologie du flux inscrit
Ta slovenski standard je istoveten z: prEN IEC 62496-2-6:2026
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
33.180.01 Sistemi z optičnimi vlakni na Fibre optic systems in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
86/669/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62496-2-6 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2026-01-02 2026-03-27
SUPERSEDES DOCUMENTS:
86/659/CD, 86/668/CC
IEC TC 86 : FIBRE OPTICS
SECRETARIAT: SECRETARY:
United States of America Mr Peter Pondillo
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
SC 86A,SC 86B,SC 86C
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of
which they are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries”
clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for
submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Optical circuit boards – Part 2-6: Basic test and measurement procedures – Near field pattern
analysis of multimode optical waveguides with rectangular core(s) using encircled flux
methodology
PROPOSED STABILITY DATE: 2029
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
IEC CDV 62496-2-6 © IEC 2026
1 CONTENTS
2 FOREWORD . 3
3 INTRODUCTION . 5
4 1 Scope . 6
5 2 Normative references . 6
6 3 Terms and definitions . 6
7 4 Abbreviated terms . 7
8 5 Device under test . 7
9 6 Apparatus . 8
10 6.1 Overview. 8
11 6.2 Light source . 8
12 6.3 Micro positioner . 8
13 6.4 NFP optical system . 8
14 6.5 Imaging device . 9
15 6.6 Analyser module . 9
16 7 Safety . 9
17 8 Measurement procedure . 9
18 8.1 Removal of dark current of the imaging device . 9
19 8.2 Near field image acquisition for rectangular waveguide . 9
20 8.2.1 Waveguide end-face alignment . 9
21 8.2.2 NFP image acquisition . 10
22 8.3 Determination of the centre, core region, and ROI . 10
23 8.3.1 Centre determination . 10
24 8.3.2 Core region radius determination . 10
25 8.3.3 ROI (region of interest) centre determination . 10
26 8.3.4 Background noise measurement region determination . 10
27 8.4 Removal of background noise . 10
28 8.5 Computation for analysing NFP (power distribution ratio using EF scale) . 11
29 9 Results . 11
30 9.1 Information available with each measurement . 11
31 9.2 Information available upon request . 12
32 10 Details to be specified . 12
33 Annex A (informative) EF analysis examples of various optical waveguides . 13
34 A.1 General . 13
35 A.2 Sample . 13
36 A.3 Measurement result . 13
37 Annex B (informative) ROI centre determination process . 15
38 B.1 General . 15
39 B.2 NFP outline determination . 15
40 B.3 Geometrical centroid . 15
41 Annex C (informative) Background of the analysis of rectangular mode fields . 16
42 Bibliography . 18
44 Figure 2 – NFP optical system schematic view . 11
45 Figure 3 – Example of the acquired near field image . 12
IEC CDV 62496-2-6 © IEC 2026
46 Figure 4 – Transformation of x-y to polar coordinates on the image sensor plane . 13
47 Figure A.1 – Examples of EF chart . 16
48 Figure C.1 – Conventional circuit board design . 18
49 Figure C.2 – On-board optics design . 18
51 Table A.1 – Measured samples . 15
IEC CDV 62496-2-6 © IEC 2026
56 INTERNATIONAL ELECTROTECHNICAL COMMISSION
57 ____________
59 OPTICAL CIRCUIT BOARDS –
61 Part 2-6: Basic test and measurement procedures – Near field pattern
62 analysis of multimode optical waveguides with rectangular core(s) using
63 encircled flux methodology
65 FOREWORD
66 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
67 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
68 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
69 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
70 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
71 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
72 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
73 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
74 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
75 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
76 consensus of opinion on the relevant subjects since each technical committee has representation from all
77 interested IEC National Committees.
78 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
79 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
80 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
81 misinterpretation by any end user.
82 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
83 transparently to the maximum extent possible in their national and regional publications. Any divergence between
84 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
85 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
86 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
87 services carried out by independent certification bodies.
88 6) All users should ensure that they have the latest edition of this publication.
89 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
90 members of its technical committees and IEC National Committees for any personal injury, property damage or
91 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
92 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
93 Publications.
94 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
95 indispensable for the correct application of this publication.
96 9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
97 patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
98 respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
99 may be required to implement this document. However, implementers are cautioned that this may not represent
100 the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
101 shall not be held responsible for identifying any or all such patent rights.
102 IEC 62496-2-6 has been prepared by IEC technical committee 86: FIBRE OPTICS. It is an
103 International Standard.
104 The text of this International Standard is based on the following documents:
Draft Report on voting
86/XX/FDIS 86/XX/RVD
106 Full information on the voting for its approval can be found in the report on voting indicated in
107 the above table.
108 The language used for the development of this International Standard is English.
IEC CDV 62496-2-6 © IEC 2026
109 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
110 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
111 at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
112 described in greater detail at www.iec.ch/publications.
113 The committee has decided that the contents of this document will remain unchanged until the
114 stability date indicated on the IEC website under webstore.iec.ch in the data related to the
115 specific document. At this date, the document will be
116 • reconfirmed,
117 • withdrawn, or
118 • revised.
IEC CDV 62496-2-6 © IEC 2026
121 INTRODUCTION
122 Bandwidth densities in modern data communication systems are driven by interconnect speeds
123 and scalable input/output (I/O) and will continue to increase over the coming years, thereby
124 severely impacting cost and performance in future data communication systems, bringing
125 increased demands in terms of signal integrity and power consumption.
126 The projected increase in capacity, processing power and bandwidth density in future
127 information communication systems will need to be addressed by the migration of embedded
128 optical interconnects into system enclosures. In particular, this would necessitate the
129 deployment of optical circuit board technologies on some or all key system cards, such as the
130 backplane, motherboard, and peripheral circuit boards.
131 Recently, high bandwidth in-vehicle network systems to support advanced driving assistance
132 and autonomous driving systems are in strong demand in the automotive market, where active
133 human safety and reduction of carbon consumption are the urgent subjects.
134 Considering the electromagnetic environment in automotive, the condition is worst in both
135 conventional internal combustion engine vehicles and modern electrical vehicles; the in-vehicle
136 network is always subjected to the high electromagnetic noise environment.
137 A fibre optic network system is thought of as one of the best solutions for electromagnetic noise,
138 and the specifications of high bandwidth (multi Gbps) optical Ethernet are nearly complet e in
139 the IEEE 802.3 working group.
140 This document specifies the method to measure and analyse the rectangular mode field (near
141 field) based on EF methodology.
IEC CDV 62496-2-6 © IEC 2026
143 OPTICAL CIRCUIT BOARDS –
145 Part 2-6: Basic test and measurement procedures – Near field pattern
146 analysis of multimode optical waveguides with rectangular core(s) using
147 encircled flux methodology
148 1 Scope
149 This document defines the procedure of NFP (near field pattern) analysis of a multimode optical
150 wave
...




Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.
Loading comments...