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EUROPEAN STANDARD
EN 62047-3
NORME EUROPÉENNE
September 2006
EUROPÄISCHE NORM
ICS 31.080.99
English version
Semiconductor devices -
Micro-electromechanical devices
Part 3: Thin film standard test piece for tensile testing
(IEC 62047-3:2006)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques Bauteile der Mikrosystemtechnik
Partie 3: Eprouvette d'essai normalisée Teil 3: Dünnschicht-Standardmikroprobe
en couche mince pour l'essai de traction für die Prüfung der Zugbeanspruchung
(CEI 62047-3:2006) (IEC 62047-3:2006)

This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-3:2006 E
Foreword
The text of document 47/1866/FDIS, future edition 1 of IEC 62047-3, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62047-3 on 2006-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-3:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62047-3:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1) 2)
IEC 62047-2 - Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices
Part 2: Tensile testing method of thin film
materials
1)
ISO 17561 - Fine ceramics (advanced ceramics, advanced - -
technical ceramics) - Test method for elastic
moduli of monolithic ceramics at room
temperature by sonic resonance

1)
Undated reference.
2)
Valid edition at date of issue.

NORME CEI
INTERNATIONALE
IEC
62047-3
INTERNATIONAL
Première édition
STANDARD
First edition
2006-08
Dispositifs à semiconducteurs –
Dispositifs microélectromécaniques –
Partie 3:
Eprouvette d'essai normalisée en
couche mince pour l'essai de traction

Semiconductor devices –
Micro-electromechanical devices –
Part 3:
Thin film standard test piece for tensile testing

 IEC 2006 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
H
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

62047-3  IEC:2006 – 3 –
CONTENTS
FOREWORD.5

1 Scope.9
2 Normative references .9
3 Test piece materials .9
4 Test piece fabrications .9
5 Plane shape of test piece .11
6 Test piece thickness.11
7 Gauge mark.11
8 Test.11
9 Document attached to standard test pieces .13

Annex A (informative) Test piece .15

62047-3  IEC:2006 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 3: Thin film standard test piece
for tensile testing
FOREWORD
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