EN IEC 61189-5-601:2021

SLOVENSKI STANDARD
01-maj-2021
Preskusne metode za električne materiale, tiskana vezja ter druge povezovalne
strukture in sestave - 5-601. del: Splošne preskusne metode za materiale in
sestave - Preskus zmožnosti valovnega spajkanja za spajkane spoje in preskus
toplotne odpornosti za tiskana vezja
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 5-601: General test methods for materials and assemblies -
Reflow soldering ability test for solder joint, and reflow heat resistance test for printed
boards
Ta slovenski standard je istoveten z: EN IEC 61189-5-601:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-5-601

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 5-601: General
test methods for materials and assemblies - Reflow soldering
ability test for solder joint, and reflow heat resistance test for
printed boards
(IEC 61189-5-601:2021)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen – Teil 5-
ensembles - Partie 5-601: Méthodes d'essai générales pour 601: Allgemeine Prüfverfahren für Materialien und
les matériaux et les assemblages - Essai d'aptitude au Baugruppen – Prüfverfahren für die Aufschmelz-Lötfähigkeit
brasage par refusion pour un joint brasé, et essai de für Lötverbindungen und die Aufschmelz-
résistance à la chaleur de refusion pour les cartes Lötwärmebeständigkeit von Leiterplatten
imprimées (IEC 61189-5-601:2021)
(IEC 61189-5-601:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-5-601:2021 E

European foreword
The text of document 91/1601/CDV, future edition 1 of IEC 61189-5-601, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-5-601:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-5-601:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8
IEC 61189-5-3 NOTE Harmonized as EN 61189-5-3
IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61249 (series) NOTE Harmonized as EN 61249 (series)
IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7
IEC 61249-2-8 NOTE Harmonized as EN 61249-2-8
IEC 61760-1:2006 NOTE Harmonized as EN 61760-1:2006 (not modified)
IEC 62137-1-1 NOTE Harmonized as EN 62137-1-1
IEC 62137-4:2014 NOTE Harmonized as EN 62137-4:2014 (not modified)
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2 series Environmental testing EN 60068-2 series
IEC 60068-2-14 - Environmental testing - Part 2-14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60191-6-2 - Mechanical standardization of EN 60191-6-2 -
semiconductor devices - Part 6-2: General
rules for the preparation of outline drawings
of surface mounted semiconductor devices
packages - Design guide for 1,50 mm, 1,27
mm and 1,00 mm pitch ball and column
terminal packages
IEC 60191-6-5 - Mechanical standardization of - -
semiconductor devices - Part 6-5: General
rules for the preparation of outline drawings
of surface mounted semiconductor device
packages - Design guide for fine-pitch ball
grid array (FBGA)
IEC 60191-6-19 - Mechanical standardization of EN 60191-6-19 -
semiconductor devices - Part 6-19:
Measurement methods of the package
warpage at elevated temperature and the
maximum permissible warpage
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
Under preparation. Stage at the time of publication: IEC/FDIS 60194-1:2020.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61190-1-3 - Attachment materials for electronic EN IEC 61190-1-3 -
assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed
and non-fluxed solid solder for electronic
soldering applications
IEC 62137-3 - Electronics assembly technology - Part 3: EN 62137-3 -
Selection guidance of environmental and
endurance test methods for solder joints

IEC 61189-5-601 ®
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-601: General test methods for materials and assemblies – Reflow

soldering ability test for solder joint, and reflow heat resistance test for printed

boards
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 5-601: Méthodes d’essai générales pour les matériaux et

les assemblages – Essai d’aptitude au brasage par refusion pour un joint brasé,

et essai de résistance à la chaleur de refusion pour les cartes imprimées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9293-8

– 2 – IEC 61189-5-601:2021 © IEC 2021
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Grouping of soldering processes and related test severities . 10
5 Specimens . 11
5.1 Devices . 11
5.2 Test substrate . 13
5.3 Solder paste . 13
5.4 Solder ball . 14
6 Apparatus and equipment . 14
6.1 Constant temperature and humidity testing equipment . 14
6.2 Device-mounting equipment . 15
6.3 X-ray transmission equipment . 15
6.4 Electrical resistance recorder . 15
6.5 Warpage measurement equipment . 15
6.6 Temperature cycling chamber . 16
6.7 Pull strength test equipment . 16
7 Tg Solder joint initial quality after reflow . 16
7.1 General . 16
7.2 Specimen preparation . 16
7.3 Pre-process . 16
7.3.1 Pre-conditioning . 16
7.3.2 Initial measurement . 16
7.3.3 Moistening process (1) . 17
7.3.4 Baking and warp correction . 17
7.3.5 Pre-reflow heating . 17
7.3.6 Moistening process (2) . 17
7.4 Assembly process . 17
7.4.1 Solder paste printing . 17
7.4.2 Device mounting . 18
7.4.3 Reflow heating . 21
7.5 Recovery . 22
7.6 Final measurement . 22
8 Tg warpage of component and printed boards in reflow process . 22
8.1 General . 22
8.2 Specimen preparation . 22
8.3 Assembly process . 23
8.3.1 Initial measurement . 23
8.3.2 Baking and warp correction . 23
8.3.3 Pre-reflow heating . 23
8.4 Final measurement . 23
8.4.1 Warpage measurement . 23
8.4.2 Measurement area . 23
8.4.3 Gap measurement . 23

IEC 61189-5-601:2021 © IEC 2021 – 3 –
9 Tg Resistance to soldering heat of printed boards . 25
9.1 General . 25
9.2 Specimen preparation . 26
9.3 Pre-process . 26
9.3.1 Pre-conditioning . 26
9.3.2 Initial measurement . 26
9.3.3 Moistening process (1) . 26
9.3.4 Baking and warp correction . 26
9.4 Reflow heating . 26
9.5 Final measurement . 27
10 Tg Wetting and dewetting of a printed-board land . 27
10.1 General . 27
10.2 Specimen preparation . 27
10.3 Pre-process . 27
10.3.1 Pre-conditioning . 27
10.3.2 Initial measurement . 28
10.3.3 Moistening process (1) . 28
10.3.4 Pre-baking . 28
10.3.5 Pre-reflow heating . 28
10.3.6 Moistening process (2) . 28
10.4 Assembly process . 28
10.4.1 Solder paste printing . 28
10.4.2 Reflow heating . 28
10.5 Final measurement . 29
10.5.1 Measurement . 29
10.5.2 Flux removal . 30
11 Tg Resistance to dissolution of a printed-board land . 30
11.1 General . 30
11.2 Specimen preparation . 31
11.3 Pre-process . 31
11.3.1 Pre-conditioning . 31
11.3.2 Initial measurement . 31
11.4 Assembly process . 31
11.4.1 Solder paste printing . 31
11.4.2 Reflow heating . 31
11.5 Final measurement . 31
11.5.1 Observation . 31
11.5.2 Observation method . 32
11.5.3 Measurement . 32
11.5.4 Example of influence upon occurrence of dissolution . 33
12 Tg Pull strength of the test substrate land . 33
12.1 General . 33
12.2 Specimen preparation . 34
12.3 Pre-process . 34
12.3.1 Pre-conditioning . 34
12.3.2 Initial measurement . 34
12.3.3 Pre-baking . 34
12.3.4 Pre-reflow heating . 34

– 4 – IEC 61189-5-601:2021 © IEC 2021
12.4 Assembly process . 34
12.4.1 Solder paste printing . 34
12.4.2 Solder ball placement . 34
12.4.3 Reflow heating process . 35
12.5 Final measurement . 35
12.5.1 Pull strength measurement . 35
12.5.2 Pull strength measuring method A – Probe heat bond method . 35
12.5.3 Pull strength measuring method B – Ball pinch method . 35
12.5.4 Pull strength measuring method C – Pin pull down method . 36
12.5.5 Pull strength measuring method D – Lead pull method . 36
12.5.6 Final observation . 36
Annex A (informative) Test process items and meaning of processing contents and
condition . 38
A.1 General . 38
A.2 Meaning of processing contents and condition . 38
A.3 Test process items . 38
Bibliography . 40

Figure 1 – Example of a test circuit for the electrical continuity test of a solder joint . 12
Figure 2 – Example of area array type packages . 12
Figure 3 – Example of leaded type devices . 12
Figure 4 – Example of leadless termination type devices . 12
Figure 5 – Example of connector for card type devices . 13
Figure 6 – Example of shielding metal components . 13
Figure 7 – Recommended solder ball shape. 14
Figure 8 – Test procedure for Tg . 16
Figure 9 – Example of printed conditions of solder paste . 18
Figure 10 – Typical reflow soldering profile for Sn63Pb37 solder alloy . 18
Figure 11 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy . 19
Figure 12 – Reflow temperature profile for soldering ability . 20
Figure 13 – Temperature measurement of the package device using thermocouples . 21
Figure 14 – Temperature measurement of other specimen using thermocouples . 21
Figure 15 – Test procedure for Tg . 22
Figure 16 – Contact point . 24
Figure 17 – Maximum gap . 25
Figure 18 – Test procedure for Tg . 26
Figure 19 – Test procedure for Tg . 27
Figure 20 – State of solder wetting. 30
Figure 21 – Solder contact angle . 30
Figure 22 – Test procedure for Tg . 31
Figure 23 – Evaluation of resistance to dissolution of land . 32
Figure 24 – Cross-section observation . 33
Figure 25 – Test procedure for Tg . 34
Figure 26 – Measuring methods for pull strength . 35

IEC 61189-5-601:2021 © IEC 2021 – 5 –
Figure 27 – Breaking modes in pull strength test . 37

Table 1 – Test items defined in this standard . 8
Table 2 – Grouping of soldering processes and typical test severities – Overview . 11
Table 3 – Stencil design standard for devices . 15
Table 4 – Maximum reflow heating conditions . 20
Table 5 – Minimum reflow heating conditions . 21
Table 6 – Wetting level . 29
Table A.1 – Meaning of processing contents and condition . 38
Table A.2 – Test process items and clauses . 39

– 6 – IEC 61189-5-601:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-601: General test methods for materials and assemblies –
Reflow soldering ability test for solder joint, and reflow heat
resistance test for printed boards

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-5-601 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1601/CDV 91/1674/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

IEC 61189-5-601:2021 © IEC 2021 – 7 –
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 8 – IEC 61189-5-601:2021 © IEC 2021
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 5-601: General test methods for materials and assemblies –
Reflow soldering ability test for solder joint, and reflow heat
resistance test for printed boards

1 Scope
This part of IEC 61189 specifies the reflow soldering ability test method for components
mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid
printed boards, and the reflow soldering ability test method for the lands of organic rigid printed
boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or
lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass
laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the
lands of the printed boards. In addition, test methods are provided to ensure that the printed
boards can resist the heat load to which they are exposed during soldering.
This document covers tests Tg , Tg , Tg , Tg , Tg , and Tg listed in Table 1:
1 2 3 4 5 6
Table 1 – Test items defined in this document
Number of
Test Method
test method
Tg
Solder joint initial quality after reflow
Tg
Warpage of component and printed boards in reflow process
Tg
Resistance to soldering heat of printed boards
Reflow
Tg
Wetting and dewetting of printed board land
Tg
Resistance to dissolution of printed board land
Tg
Pull strength of the test substrate land
NOTE The test methods do not apply to the solder bath method.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2 (all parts), Environmental testing
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature

IEC 61189-5-601:2021 © IEC 2021 – 9 –
IEC 60191-6-2, Mechanical standardization of semiconductor devices – Part 6-2: General rules
for the preparation of outline drawings of surface mounted semiconductor devices packages –
Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-5, Mechanical standardization of semiconductor devices – Part 6-5: General rules
for the preparation of outline drawings of surface mounted semiconductor device packages –
Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-19, Mechanical standardization of semiconductor devices – Part 6-19:
Measurement methods of the package warpage at elevated temperature and the maximum
permissible warpage
IEC 60194-1 , Printed boards design, manufacture and assembly – Vocabulary – Part 1:
Common usage in printed board and electronic assembly technologies
IEC 60194-2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering
applications
IEC 62137-3, Electronics assembly technology – Part 3: Selection guidance of environmental
and endurance test methods for solder joints
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60191-6-2,
IEC 60191-6-5, IEC 60194-1 and IEC 60194-2, as well as the following, apply.
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
solderability
ability of the lead or termination of a component or electrode of a component or printed board
to be wetted by solder at the temperature of the lead, termination or electrode, which is assumed
to be the lowest temperature in the soldering process, within the applicable temperature range
of the solder alloy
Note 1 to entry: The term "solderability" is often used in combination with the term "test", indicating a specific
method to evaluate the wettability or ability to be soldered of a surface under worst case conditions (soldering
temperature and contact time with solder). It is not to be confused with the concepts "soldering ability" (see 3.3).
3.2
wettability
intrinsic property of the termination material to form an alloy with the solder
___________
Under preparation. Stage at the time of publication: IEC/FDIS 60194-1:2020.

– 10 – IEC 61189-5-601:2021 © IEC 2021
Note 1 to entry: Wettability depends on the base metal used to produce the termination or, in the case of a plated
termination, the condition and material used to plate the base metal.
3.3
soldering ability
ability of a specific combination of components to facilitate the formation of a proper solder joint
Note 1 to entry: See 3.2, wettability.
3.4
resistance to soldering heat
ability of the component to withstand the highest temperature in terms of temperature gradient,
peak temperature and duration of the soldering process, within the applicable temperature
range of the solder alloy
3.5
reflow soldering
joining of surfaces that have been tinned and/or have solder between them, placing them
together, heating them until the solder flows, and allowing the surface and the solder to cool in
the joined position
3.6
wetting
formation of an adherent coating of solder on a surface indicated by a small contact angle
3.7
dewetting
retraction of molten solder on a solid area that it has initially wetted
Note 1 to entry: In some cases, an extremely thin film of solder may remain. As the solder retracts, the contact
angle increases.
3.8
non-wetting
inability to form an adherent coating of solder on a surface indicated by a contact angle greater
than 90°
3.9
dissolution of printed-board land
process of dissolving metal, usually by introduction of chemicals
4 Grouping of soldering processes and related test severities
The melting temperatures of lead-free solder alloys selected for industrial processes are
significantly different from those for Sn-Pb solder alloy. Moreover, the melting temperatures of
lead-free solder alloys are different from each other but can be clustered in groups.
The groups of soldering processes indicated in Table 2 are given as a guideline to select the
severities for the wetting and resistance tests at a specified soldering heat.

IEC 61189-5-601:2021 © IEC 2021 – 11 –
Table 2 – Grouping of soldering processes and typical test severities – Overview
a
Process temperature group 1 2
Typical solder alloy group Sn-Pb Sn-Ag-Cu
Typical
process Reflow peak temperature 210 °C to 240 °C 235 °C to 250 °C
temperature
Test
Test property Reflow peak temperature/Duration
method
b
Solder joint initial Maximum profile
Reflow
235 °C / 20 s or more 245 °C / 30 s or more
quality "Soldering temperature

ability"
Minimum profile
215 °C / 10 s or less 235 °C / 10 s or less
temperature
Warpage 235 °C / 20 s or more 245 °C / 30 s or more
Resistance to soldering heat 235 °C / 20 s or more 245 °C / 30 s or more
Wetting and dewetting 215 °C / 10 s or less 235 °C / 10 s or less
Resistance to dissolution 235 °C / 20 s or more 245 °C / 30 s or more
Pull strength 235 °C / 20 s or more 245 °C / 30 s or more
Typical process temperatures for reflow soldering are the land temperatures in device area on printed boards.
The Sn-Ag-Cu alloy listed in this table represents compositions that are currently preferred for lead-free soldering

processes. However, other solder alloys when matching with the specified group should not be excluded.
a
Refer to each appropriate subclauses for the detailed test conditions.
b
Measured at the solder joint or land of printed boards.

5 Specimens
5.1 Devices
Device specimens for this test are specified in IEC 62137-3.
When the evaluation needs to be conducted, the device used for this test is a dummy device
within which the terminations are connected as shown in Figure 1.
When the evaluation for leadless termination type devices needs to be conducted on the
resistance device, the device resistance for the test is a low-resistance device [as shown in
Figure 1 b)]. The resistance of the low-resistance device should be 50 mΩ or less.

– 12 – IEC 61189-5-601:2021 © IEC 2021

a) Example of area array type packages

b) Example of leadless termination type devices
Figure 1 – Example of a test circuit for the electrical continuity test of a solder joint
The following Figure 2, Figure 3, Figure 4, Figure 5 and Figure 6 show the typical appearance
of each package type.
Figure 2 – Example of area array type packages

Figure 3 – Example of leaded type devices

Figure 4 – Example of leadless termination type devices

IEC 61189-5-601:2021 © IEC 2021 – 13 –

Figure 5 – Example of connector for card type devices

Figure 6 – Example of shielding metal components
5.2 Test substrate
The test substrate material shall be single or double-sided mounting with single-layer, double-
layer or multilayer printed boards for material structure used with product. Unless otherwise
specified in the product specification, the test substrate shall be as follows.
a) Test substrate material
Test substrate material shall be a single-sided printed board for general use, for example,
copper-clad epoxide woven fiberglass reinforced laminated sheets as specified in
IEC 61249-2-7 or IEC 61249-2-8. The thickness shall be (1,6 ± 0,2) mm including copper
foil. The copper foil thickness shall be (35 ± 10) µm.
b) Test substrate dimensions
The test substrate dimensions depend on the mounted package size and shape. However,
the test substrate dimensions shall be able to be fixed on the pull strength test equipment.
c) Land shape and land dimensions
Land shape and land dimensions should be the same specification as used for product
design. Land shape and land dimensions should be as specified in IEC 61188-5-8.
Moreover, the test substrate and the test package shall be designed in such a way that their
land pattern forms a daisy chain circuit after mounting for the electrical continuity
measurement.
d) Surface finish of land pattern
If specified in the product specification, the surface finish treatment (for land pattern of the
printed board) shall be the same as specified in the product specification.
EXAMPLE: organic solderability preservative (OSP) or electroless nickel immersion gold (ENIG) plating layer.
5.3 Solder paste
Solder paste is made of flux, finely divided particles of solder, and additives to promote wetting
and to control viscosity, tackiness, slumping, drying rate, etc. Unless otherwise specified in the
product specification, one of the solder alloys listed below (as specified in IEC 61190-1-3) shall
be used. The product specification shall specify details of the solder paste.
The major composition of the solder alloys are as follows:
a) 63 % mass fraction of Sn (tin) and 37 % mass fraction of Pb (lead);
b) fr
...