EN 60249-2-19:1993/A1:1994
(Amendment)Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Basismaterialien für gedruckte Schaltungen - Teil 2: Einzelbestimmungen - Einzelbestimmung Nr. 19: Dünne kupferkaschierte mit Bismaleinimid/Triazin modifizierte Epoxid-Glashartgewebetafeln definierter Brennbarkeit zur Herstellung gedruckter Mehrlagenleiterplatten
Matériaux de base pour circuits imprimés - Partie 2: Spécifications - Spécification n° 19: Feuille de stratifié mince en tissu de verre époxyde avec bismaléimide/triazine recouverte de cuivre, d'inflammabilité définie, destinée à la fabrication de cartes imprimées multicouches
Base materials for printed circuits - Part 2: Specifications - Specification No.19: Thin bismaleimide/triazine modified epoxide woven glass fabric cooper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards - Amendment A1 (IEC 249-2-19:1992/A1:1993)
General Information
- Status
- Withdrawn
- Publication Date
- 21-Mar-1994
- Withdrawal Date
- 31-Jan-2006
- Technical Committee
- CLC/SR 91 - Electronics assembly technology
- Drafting Committee
- IEC/TC 91 - IEC_TC_91
- Parallel Committee
- IEC/TC 91 - IEC_TC_91
- Current Stage
- 9960 - Withdrawal effective - Withdrawal
- Start Date
- 01-Feb-2006
- Completion Date
- 01-Feb-2006
Relations
- Effective Date
- 03-Feb-2026
- Effective Date
- 29-Jan-2023
Frequently Asked Questions
EN 60249-2-19:1993/A1:1994 is a amendment published by CLC. Its full title is "Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards". This standard covers: Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
EN 60249-2-19:1993/A1:1994 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60249-2-19:1993/A1:1994 has the following relationships with other standards: It is inter standard links to EN 60065:2014, EN 60249-2-19:1993. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60249-2-19:1993/A1:1994 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-avgust-1997
Base materials for printed circuits - Part 2: Specifications - Specification No.19:
Thin bismaleimide/triazine modified epoxide woven glass fabric cooper-clad
laminated sheet of defined flammability for use in the fabrication of multilayer
printed boards - Amendment A1 (IEC 249-2-19:1992/A1:1993)
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 19: Thin
bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet
of defined flammability for use in the fabrication of multilayer printed boards
Basismaterialien für gedruckte Schaltungen -- Teil 2: Einzelbestimmungen --
Einzelbestimmung Nr. 19: Dünne kupferkaschierte mit Bismaleinimid/Triazin modifizierte
Epoxid-Glashartgewebetafeln definierter Brennbarkeit zur Herstellung gedruckter
Mehrlagenleiterplatten
Matériaux de base pour circuits imprimés -- Partie 2: Spécifications -- Spécification n° 19:
Feuille de stratifié mince en tissu de verre époxyde avec bismaléimide
...
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