EN 62137-3:2012

SLOVENSKI STANDARD
01-marec-2012
Tehnologija elektronskega sestavljanja - 3. del: Napotki za izbiro metod za
preskušanje vplivov na okolje in vzdržljivosti s kositrom spajkanih spojev
Electronics assembly technology - Part 3: Selection guidance of environmental and
endurance test methods for solder joints
Montageverfahren für elektronische Baugruppen - Teil 3: Leitfaden für die Auswahl von
Umwelt- und (Lebens)dauerprüfungen für Lötverbindungen
Techniques d'assemblage des composants électroniques - Guide de choix des
méthodes d'essai d'environnement et d'endurance des joints brasés
Ta slovenski standard je istoveten z: EN 62137-3:2012
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62137-3
NORME EUROPÉENNE
EUROPÄISCHE NORM January 2012
ICS 31.190
English version
Electronics assembly technology -
Part 3: Selection guidance of environmental and endurance test methods
for solder joints
(IEC 62137-3:2011)
Techniques d'assemblage des Montageverfahren für elektronische
composants électroniques - Baugruppen -
Partie 3: Guide de choix des méthodes Teil 3: Leitfaden für die Auswahl von
d'essai d'environnement et d'endurance Umwelt- und (Lebens)dauerprüfungen für
des joints brasés Lötverbindungen
(CEI 62137-3:2011) (IEC 62137-3:2011)

This European Standard was approved by CENELEC on 2011-12-13. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62137-3:2012 E
Foreword
The text of document 91/986/FDIS, future edition 1 of IEC 62137-3, prepared by IEC/TC 91 "Electronics
assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
(dop) 2012-09-13
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2014-12-13

standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 62137-3:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-1:1988 NOTE  Harmonized as EN 60068-1:1994 (not modified).
+ A1:1992
IEC 60068-2-2 NOTE  Harmonized as EN 60068-2-2.
IEC 60068-2-14 NOTE  Harmonized as EN 60068-2-14.
IEC 60068-2-78 NOTE  Harmonized as EN 60068-2-78.
IEC 61760-1 NOTE  Harmonized as EN 61760-1.
IEC 62137:2004 NOTE  Harmonized as EN 62137:2004 (not modified).

- 3 - EN 62137-3:2012
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions

IEC 61188-5 Series Printed boards and printed board assemblies -EN 61188-5 Series
Design and use -
Part 5: Attachment (land/joint) considerations

IEC 61249-2-7 - Materials for printed boards and other EN 61249-2-7 -
interconnecting structures -
Part 2-7: Reinforced base materials, clad and
unclad - Epoxide woven E-glass laminated
sheet of defined flammability (vertical burning
test), copper-clad
IEC 62137-1-1 2007 Surface mounting technology - Environmental EN 62137-1-1 2007
and endurance test methods for surface
mount solder joint -
Part 1-1: Pull strength test
IEC 62137-1-2 2007 Surface-mounting technology - Environmental EN 62137-1-2 2007
and endurance test methods for surface
mount solder joint -
Part 1-2: Shear strength test
IEC 62137-1-3 2008 Surface mounting technology - Environmental EN 62137-1-3 2009
and endurance test methods for surface
mount solder joint -
Part 1-3: Cyclic drop test
IEC 62137-1-4 2009 Surface mounting technology - Environmental EN 62137-1-4 2009
and endurance test methods for surface
mount solder joint -
Part 1-4: Cyclic bending test
IEC 62137-1-5 2009 Surface mounting technology - Environmental EN 62137-1-5 2009
and endurance test methods for surface
mount solder joint -
Part 1-5: Mechanical shear fatigue test

IEC 62137-3 ®
Edition 1.0 2011-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –
Part 3: Selection guidance of environmental and endurance test methods for
solder joints
Techniques d'assemblage des composants électroniques –
Partie 3: Guide de choix des méthodes d'essai d'environnement et d'endurance
des joints brasés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.190 ISBN 978-2-88912-711-5

– 2 – 62137-3 © IEC:2011
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General remarks . 9
5 Procedure of selecting the applicable test method . 10
5.1 Stress to solder joints in the field and test methods . 10
5.2 Selection of test methods based on the shapes and terminations/leads of
electronic devices . 12
5.2.1 Surface mount devices . 12
5.2.2 Lead insertion type device . 13
6 Common subjects in each test method . 14
6.1 Mounting device and materials used . 14
6.2 Soldering condition . 15
6.2.1 General . 15
6.2.2 Reflow soldering . 15
6.2.3 Wave soldering . 17
6.3 Accelerated stress conditioning . 18
6.3.1 Rapid temperature change (applies to all solder alloys in this
document) . 18
6.3.2 Dry heat (applies to Bi58Sn42 alloy solder only) . 19
6.3.3 Damp heat (steady state) (applies to Sn91Zn9 and Sn89Zn8Bi3 alloy
solder) . 19
6.4 Selection of test conditions and judgement of test results . 19
7 Evaluation test method . 19
7.1 Solder joint strength test of SMD . 19
7.1.1 General . 19
7.1.2 Pull strength test . 19
7.1.3 Shear strength test . 20
7.1.4 Torque shear strength test . 21
7.1.5 Monotonic bending strength test . 21
7.2 Cyclic bending strength test . 22
7.3 Mechanical shear fatigue test . 23
7.4 Cyclic drop test and cyclic steel ball drop strength test . 24
7.4.1 Overview . 24
7.4.2 Cyclic steel ball drop strength test . 25
7.5 Solder joint strength test for lead insertion type device . 26
7.5.1 Pull strength test for insertion type device . 26
7.5.2 Creep strength test for lead insertion type device . 26
Annex A (informative) Condition of rapid temperature change . 28
Annex B (informative) Electrical continuity test for solder joint . 30
Annex C (informative) Torque shear strength test . 31
Annex D (informative) Monotonic bending strength test . 34
Annex E (informative) Cyclic steel ball drop strength test . 36
Annex F (informative) Pull strength test . 38
Annex G (informative) Creep strength test . 39

62137-3 © IEC:2011 – 3 –
Annex H (informative) Evaluation method for the fillet lifting phenomenon of a lead
insertion type device solder joint . 41
Bibliography . 43

Figure 1 – Joint regions for the reliability tests . 9
Figure 2 – Factors affecting the joint reliability made by lead-free solder . 10
Figure 3 – An example of the mounting position of SMD for monotonic bending and
cyclic bending tests . 15
Figure 4 – An example of reflow soldering temperature profile (Sn96,5Ag3Cu,5) . 16
Figure 5 – Examples of reflow soldering temperature profile other than
Sn96,5Ag3Cu,5 . 16
Figure 6 – An example of wave soldering temperature profile (Sn96,5Ag3Cu,5) . 17
Figure 7 – An example of wave soldering temperature profile . 18
Figure 8 – Pull strength test . 20
Figure 9 – Shear strength test. 20
Figure 10 – Torque shear strength test . 21
Figure 11 – Monotonic bending strength test .
...