EN 60194:2006

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EUROPEAN STANDARD EN 60194 NORME EUROPÉENNE
EUROPÄISCHE NORM July 2006
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60194:2006 E
ICS 31.180; 31.190
English version
Printed board design, manufacture and assembly -
Terms and definitions (IEC 60194:2006)
Conception, fabrication et
assemblage des cartes imprimées -
Termes et définitions (CEI 60194:2006)
Konstruktion, Herstellung und
Bestückung von Leiterplatten -
Begriffe und Definitionen (IEC 60194:2006)
This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in English only. A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

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Foreword The text of the International Standard IEC 60194:2006, prepared by IEC TC 91, Electronics assembly technology, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 60194 on 2006-06-01 without any modification. This European Standard should be used in conjunction with IEC 60050-541 which provides for basic technical terms for board assembly technology not included in this standard. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2007-06-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2009-06-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60194:2006 was approved by CENELEC as a European Standard without any modification. __________

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Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050-541 -1) International electrotechnical vocabulary - Chapter 541: Printed circuits - -
1) Undated reference.
INTERNATIONAL STANDARD IEC60194 Fifth edition2006-02 Printed board design, manufacture
and assembly – Terms and definitions
 IEC 2006

Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch
Web: www.iec.ch XE For price, see current cataloguePRICE CODE
Commission Electrotechnique InternationaleInternational Electrotechnical Commission

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INTERNATIONAL ELECTROTECHNICAL COMMISSION ___________
PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY – TERMS AND DEFINITIONS
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60194 has been prepared by IEC technical committee 91: Electronics assembly technology.
This fifth edition cancels and replaces the fourth edition (1999) and constitutes a technical revision. The major change with regard to the previous edition concerns the addition of some four hundred new terms necessary to industry, added as a result of considerable development in
assembly technology in recent years.
The text of this standard is based on the following documents: FDIS Report on voting 91/566/FDIS 91/578/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 60194 should be read in conjunction with IEC 60050(541) which provides for basic technical terms for board assembly technology not included in this standard.

60194  IEC:2006(E) – 3 –
The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended. A bilingual version of this standard may be issued at a later date.

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PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY – TERMS AND DEFINITIONS
1 Scope This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(541), International Electrotechnical Vocabulary (IEV) – Chapter 541: Printed circuits
3 General The terms have been classified according to the decimal classification code (DCC) and this DCC number appears to the right of the defined term. The DCC numbering is explained fully in Annex A. In order to avoid two ID numbers, the usual practice of numbering every paragraph (every term and definition) in front of the paragraph has not been followed in this standard. The official IEC number is the number which follows the DCC and the period (21.xxxx). Annex B provides a list of acronyms listed numerically according to the DCC number.

60194  IEC:2006(E) – 5 –
4 Terms and definitions
Abrasion Resistance 54.1821 The ability of a material to withstand surface wear.
Abrasive Trimming
54.1318 Adjusting the value of a film component by notching it with a finely- adjusted stream of an abrasive material against the resistor surface.
Absorption Coefficients
40.1727 The degree to which various materials absorb heat or radiant energy when compared to each other.
Absorptivity, Infra-red 40.0087 The ratio (or percentage) of the amount of energy absorbed by a substrate as compared with the total amount of incident energy.
Accelerated Aging
93.0001 A test in which the parameters such as voltage and temperature are increased above normal operating values to obtain observable or measurable deterioration in a relatively short period of time.
Accelerated Life Test 93.0119 See “Accelerated Aging”.
Accelerated Test 93.0216 A test to check the life expectancy of an electronic component or electronic assembly in a short period of time by applying physically severe condition(s) to the unit under test.
Accelerator
53.0002 See “Catalyst”.
Acceleration Factor (AF)
93.0260 The ratio of stress in reliability testing to the normal operating condition.
Acceptance Quality Level (AQL)
90.0003 The maximum number of defectives likely to exist within a population (lot) that can be considered to be contractually tolerable; normally associated with statistically derived sampling plans.
Acceptance Tests
92.0004 Those tests deemed necessary to determine the acceptability of a product and as agreed to by both purchaser and vendor.
Acceptance Inspection (Criteria) 92.0288 An inspection that determines conformance of a product to design specifications as the basis for acceptance.
Access Hole
60.1319 A series of holes in successive layers of a multilayer board, each set having their centres on the same axis. These holes provide access to the surface of the land on one of the layers of the board. (See Figure A.1.)
Figure A.1 – Access hole
Access Protocol
21.0005
An agreed principle for establishing how nodes in a network communicate electronically.
Accordion Contact 36.0006
A type of connector contact that consists of a flat spring formed into a "Z" shape in order to permit high deflection without overstress.
Accuracy
90.0007 The deviation of the measured or observed value from the true value.
Acid Flux
46.0009 A solution of an acid and an inorganic, organic, or water soluble organic flux. (See also “Inorganic Flux,” “Organic Flux,” and “Water Soluble Organic Flux”.)
Acid Number
54.0010 The amount of potassium hydroxide in milligrams that is required to neutralize one gram of an acid medium.

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Acid Value
54.1217 See “Acid Number”
Acid-Core Solder
46.0008 Wire solder with a self-contained acid flux.
Actinic Radiation
52.0011 Light energy that reacts with a photosensitive material in order to produce an image.
Active Desiccant
30.0397 Desiccant that is either fresh (new) or has been baked according to the manufacturer’s recommendations to renew desiccant to original specifications.
Activated Rosin Flux
46.0012 A mixture of rosin and small amounts of organic-halide or organic-acid activators. (See also “Synthetic Activated Flux”.)
Activating
53.0013 A treatment that renders nonconductive material receptive to electroless deposition.
Activating Layer
53.0014 A layer of material that renders a nonconductive material receptive to electroless deposition.
Activator
46.0015 A substance that improves the ability of a flux to remove surface oxides from the surfaces being joined.
Active Device
30.0016
An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital circuits in either monolithic or hybrid form.)
Active Metal
36.0017 A metal that has a very high electromotive force.
Active Trimming
54.1321 Adjusting the value of a film circuit element in order to obtain a specified functional output from the circuit while it is electrically activated.
Actual Size
90.0018 The measured size.
Additive Process
53.1322 A Process for obtaining conductive patterns by the selective deposition of conductive material on clad or unclad base material. (See also “Semi-Additive Process” and “Fully-Additive Process”.)
Add-On Component
30.0019 Discrete or integrated packaged or chip components that are attached to a film circuit in order to complete the circuit's function.
Adhesion
(Pressure Sensitive Tape) 46.2038 The bond produced by contact between pressure-sensitive adhesive and a surface.
Adhesive
46.1728 A substance such as glue or cement used to fasten objects together. In surface mounting, an epoxy adhesive is used to adhere SMDs to the substrate.
Adhesion Failure
96.0020 The rupture of an adhesive bond s
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