EN 62137-1-5:2009
(Main)Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
Oberflächenmontage-Technik - Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen - Teil 1-5: Prüfung der Ermüdung durch mechanische Scherbeanspruchung
Technologie du montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-5: Essai de fatigue par cisaillement mécanique
La CEI 62137-1-5:2009 s'applique aux boîtiers de type matriciel tels que les BGA. Cette méthode d'essai est destinée à évaluer l'endurance des joints de soudure situés entre les sorties du composant et les pastilles d'un substrat comme illustré à la Figure 1. On utilise généralement une approche par cycles de températures pour évaluer la fiabilité des joints de soudure. Une autre méthode consiste à faire subir aux joints de soudure des cycles mécaniques pour réduire le temps d'essai plutôt que de produire des contraintes générées par des variations de température. La méthodologie consiste à imposer une déformation par cisaillement aux joints de soudure par déplacement mécanique au lieu d'un déplacement relatif produit par une différence de coefficient de dilatation thermique (CTE) comme cela est représenté sur la Figure 2. A la place des essais de cycles de températures, cet essai de fatigue par cisaillement mécanique sert à prévoir la fiabilité des joints de soudure dans des conditions de variations de température répétées en faisant subir des cycles mécaniques aux joints de soudure. Dans la présente méthode d'essai, pour procéder à l'évaluation, le composant pour montage en surface nécessite d'abord d'être monté sur le substrat par brasage par fusion, puis les joints de soudure sont soumis à des déformations cycliques par cisaillement mécanique jusqu'à ce que les joints de soudure rompent. Les propriétés des joints de soudure (par exemple alliage de soudure, substrat, dispositif assemblé ou conception, etc.) sont évaluées pour aider à améliorer la résistance des joints de soudure.
Tehnologija površinske montaže - Okoljski preskusi in preskusne metode za določanje zanesljivosti spajkanih spojev, izdelanih s površinsko montažo - 1-5. del: Mehanski preskus trdnosti s strižno obremenitvijo (IEC 62137-1-5:2009)
Preskusna metoda, opisana v tem delu IEC 62137, se nanaša na nize ploskovnih paketov, kot je BGA. Ta preskusna metoda je zasnovana za ocenjevanje trajnostne dobe spajkanih spojev med priključnimi žicami komponent ter substratom, kot je prikazano na Sliki 1. Običajno se za oceno zanesljivosti spajkanih spojev uporablja temperaturni krožni pristop. Druga metoda je mehansko kroženje spajkanih spojev, s čimer se skrajša čas testiranja, namesto da bi ustvarili deformacijo s spreminjanjem temperature. Metodologija predstavlja vsiljevanje strižne deformacije spajkanim spojem z mehanskim premikom namesto relativnega premika, ki je povzročen zaradi neujemanjem koeficienta termalnega raztezanja (CTE), kot je prikazano na Sliki 2. Na mestu temperaturnega krožnega testa mehanski preskus trdnosti s strižno obremenitvijo napove zanesljivost spajkanih spojev pod pogoji ponavljajoče temperaturne spremembe z mehanskim vrtenjem spajkanih spojev. Pri tej metodi preskušanja ocenjevanje zahteva, da najprej montiramo komponento površinske montaže na substrat s povratnim mehkim spajkanjem, nato se na spajkane spoje aplicira ciklična mehanična strižna obremenitev, dokler spajkani spoji ne počijo. Lastnosti spajkanih spojev (na primer zlitina za spajkanje, substrat, montirana naprava ali načrt itd.) se ocenjujejo z namenom, da bi pripomogli k izboljšanju trdnosti spajkanih spojev.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-januar-2010
7HKQRORJLMDSRYUãLQVNHPRQWDåH2NROMVNLSUHVNXVLLQSUHVNXVQHPHWRGH]D
GRORþDQMH]DQHVOMLYRVWLVSDMNDQLKVSRMHYL]GHODQLKVSRYUãLQVNRPRQWDåR
GHO 0HKDQVNLSUHVNXVWUGQRVWLVVWULåQRREUHPHQLWYLMR ,(&
Surface mounting technology - Environmental and endurance test methods for surface
mount solder joints -- Part 1-5: Mechanical shear fatigue test
Oberflächenmontage-Technik -- Verfahren zur Prüfung auf Umgebungseinflüsse und zur
Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen -- Teil 1-5: Prüfung der
Ermüdung durch mechanische Scherbeanspruchung
Technologie du montage en surface - Méthodes d'essais d'environnement et
d'endurance des joints brasés montés en surface -- Partie 1-5: Essai de fatigue par
cisaillement mécanique
Ta slovenski standard je istoveten z: EN 62137-1-5:2009
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 62137-1-5
NORME EUROPÉENNE
May 2009
EUROPÄISCHE NORM
ICS 31.190
English version
Surface mounting technology -
Environmental and endurance test methods
for surface mount solder joints -
Part 1-5: Mechanical shear fatigue test
(IEC 62137-1-5:2009)
Technologie du montage en surface - Oberflächenmontage-Technik -
Méthodes d'essais d'environnement Verfahren zur Prüfung
et d'endurance des joints brasés auf Umgebungseinflüsse
montés en surface - und zur Prüfung der Haltbarkeit
Partie 1-5: Essai de fatigue von Oberflächen-Lötverbindungen -
par cisaillement mécanique Teil 1-5: Prüfung der Ermüdung durch
(CEI 62137-1-5:2009) mechanische Scherbeanspruchung
(IEC 62137-1-5:2009)
This European Standard was approved by CENELEC on 2009-04-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: avenue Marnix 17, B - 1000 Brussels
© 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62137-1-5:2009 E
Foreword
The text of document 91/826/FDIS, future edition 1 of IEC 62137-1-5, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 62137-1-5 on 2009-04-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2010-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2012-04-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62137-1-5:2009 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-21 NOTE Harmonized as EN 60068-2-21:2006 (not modified).
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8:2008 (not modified).
__________
– 3 – EN 62137-1-5:2009
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-1 - Environmental testing - EN 60068-1 1994
Part 1: General and guidance
1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions
IEC 61188-5 Series Printed boards and printed board EN 61188-5 Series
assemblies - Design and use -
Part 5: Attachment (land/joint) considerations
IEC 61190-1-2 2007 Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics
assembly
1) 2)
IEC 61190-1-3 - Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications
IEC 61249-2-7 2002 Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures - + corr. September 2005
Part 2-7: Reinforced base materials, clad
and unclad - Epoxide woven E-glass
laminated sheet of defined flammability
(vertical burning test), copper-clad
1) 2)
IEC 61760-1 - Surface mounting technology - EN 61760-1 2006
Part 1: Standard method for the specification
of surface mounting components (SMDs)
1)
Undated reference.
2)
Valid edition at date of issue.
IEC 62137-1-5 ®
Edition 1.0 2009-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joints –
Part 1-5: Mechanical shear fatigue test
Technologie du montage en surface – Méthodes d'essais d'environnement et
d'endurance des joints brasés montés en surface –
Partie 1-5: Essai de fatigue par cisaillement mécanique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.190 ISBN 2-8318-1028-5
– 2 – 62137-1-5 © IEC:2009
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .7
3 Terms and definitions .8
4 Test equipment and materials.8
4.1 Test equipment for mechanical shear fatigue testing .8
4.2 Test substrate .8
4.3 Solder alloy .9
4.4 Solder paste.9
4.5 Reflow soldering equipment .9
5 Mounting .9
6 Test conditions .10
6.1 Pre-treatment .10
6.2 Test procedures .10
6.3 Judging criteria.10
7 Items to be included in the test report.11
8 Items to be given in the product specification .11
Annex A (normative) Mechanical shear fatigue test equipment.12
Annex B (normative) Mechanical shear fatigue test procedure .15
Annex C (informative) Evaluation of mechanical properties of a single solder joint by
mechanical shear fatigue test .17
Bibliography.21
Figure 1 – Image drawing on evaluation area of joint strength.6
Figure 2 – Schematic illustrations of thermomechanical and mechanical fatigue for
solder joints .7
Figure 3 – A typical temperature profile taken by reflow soldering equipment.10
Figure A.1 – Sample structures of shear fatigue jig .13
Figure B.1 – Example of set-up for electrical resistance measuring.16
Figure C.1 – Schematic illustration of the single solder joint for mechanical fatigue
testing .18
Figure C.2 – Schematic illustration of fixing jig for soldering of the single solder joint .18
Figure C.3 – Schematic illustration of the shear fatigue jig.19
Figure C.4 – Relationship between reaction forces and the number of cycles during a
fatigue test.20
Figure C.5 – Relationship between the displacement range and fatigue life .20
62137-1-5 © IEC:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINTS –
Part 1-5: Mechanical shear fatigue test
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, us
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.