EN 62047-17:2015

SLOVENSKI STANDARD
01-september-2015
Polprevodniški elementi - Mikroelektromehanski elementi - 17. del: Izboklinska
preskusna metoda za merjenje mehanskih lastnosti tankih plasti
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method
for measuring mechanical properties of thin films
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 17: Wölbungs-
Prüfverfahren zur Bestimmung mechanischer Eigenschaften dünner Schichten
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 17: Méthode
d'essai de renflement pour la mesure des propriétés mécaniques des couches minces
Ta slovenski standard je istoveten z: EN 62047-17:2015
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 62047-17

NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2015
ICS 31.080.99
English Version
Semiconductor devices - Micro-electromechanical devices - Part
17: Bulge test method for measuring mechanical properties of
thin films
(IEC 62047-17:2015)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 17: Méthode d'essai de Mikrosystemtechnik - Teil 17: Wölbungs-Prüfverfahren zur
renflement pour la mesure des propriétés mécaniques des Bestimmung mechanischer Eigenschaften dünner
couches minces Schichten
(IEC 62047-17:2015) (IEC 62047-17:2015)
This European Standard was approved by CENELEC on 2015-04-09. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
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same status as the official versions.
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Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-17:2015 E
European foreword
The text of document 47F/210/FDIS, future edition 1 of IEC 62047-17, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-17:2015.

The following dates are fixed:
(dop) 2016-01-10
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2018-04-09
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-17:2015 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 62047-2 2006 Semiconductor devices - Micro- EN 62047-2 2006
electromechanical devices -- Part 2: Tensile
testing method of thin film materials

IEC 62047-17 ®
Edition 1.0 2015-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 17: Bulge test method for measuring mechanical properties of thin films

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 17: Méthode d'essai de renflement pour la mesure des propriétés

mécaniques des couches minces
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-2295-9

– 2 – IEC 62047-17:2015 © IEC 2015
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and symbols. 6
3.1 Terms and definitions . 6
3.2 Symbols . 7
4 Principle of bulge test . 7
5 Test apparatus and environment . 8
5.1 General . 8
5.2 Apparatus . 9
5.2.1 Pressuring device . 9
5.2.2 Bulge (pressure) chamber. 9
5.2.3 Height measurement units . 9
5.3 Test environment . 10
6 Specimen . 10
6.1 General . 10
6.2 Shape and dimension of specimen . 10
6.3 Measurement of test piece dimension . 10
7 Test procedure and analysis . 11
7.1 Test procedure . 11
7.2 Data analysis . 12
8 Test report . 13
Annex A (informative) Determination of mechanical properties . 14
A.1 General . 14
A.2 Determination of mechanical properties using stress-strain curve . 14
A.3 Determination of mechanical properties using analysis of load-deflection . 16
Annex B (informative) Deformation measurement techniques . 19
B.1 General . 19
B.2 Laser interferometry technique . 19
B.3 Capacitance type measurement . 19
Annex C (informative) Example of test piece fabrication: MEMS process . 25
C.1 Test piece fabrication . 25
C.2 Measurement of shape of specimen . 26
Bibliography . 27

Figure 1 – Typical example of bulge specimen . 7
Figure 2 – Membrane window bulged by pressure . 8
Figure 3 – Typical example of bulge test apparatus . 8
Figure 4 – Bulge membrane window shapes . 10
Figure 5 – Example of typical pressure-height curve obtained from bulge test . 12
Figure A.1 – Determination of biaxial modulus in the stress-strain curve obtained from
bulge test . 18
Figure B.1 – Typical example of laser interferometer configuration . 21

IEC 62047-17:2015 © IEC 2015 – 3 –
Figure B.2 – Typical fringe patterns obtained from laser Michelson interferometry and
ESPI system . 22
Figure B.3 – Typical example of the measurement system using a photo detector . 23
Figure B.4 – Schematic of capacitance bulge tester . 23
Figure B.5 – Typical example of relationship between bulge height and capacitance
change . 24
Figure C.1 – Example of fabrication procedure for bulge test piece . 25

Table 1 – Symbols and designations of a specimen . 7
Table A.1 – Examples of various expressions of parameters, C and C (ν), for thin
1 2
square films . 17
Table A.2 – Examples of various expressions of parameters, C and C (ν), for thin
1 2
spherical films . 17

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 17: Bulge test method for measuring
mechanical properties of thin films

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-17 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/210/FDIS 47F/215/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

IEC 62047-17:2015 © IEC 2015 – 5 –
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found in the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 62047-17:2015 © IEC 2015
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 17: Bulge test method for measuring
mechanical properties of thin films

1 Scope
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing
film that is bulged within a window. The specimen is fabricated with micro/nano structural film
materials, including metal, ceramic and polymer films, for MEMS, micromachines and others.
The thickness of the film is in the range of 0,1 µm to 10 µm, and the width of the rectangular
and square membrane window and the diameter of the circular membrane range from 0,5 mm
to 4 mm.
The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure
to the testing film specimen with bulging window.
Elastic modulus and residual stress for the film materials can be determined with this method.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:
Tensile testing method of thin film materials
3 Terms, definitions and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
residual stress
σ
stress which exists in a specimen in the absence of an external load
3.1.2
biaxial modulus
M
elastic modulus in plane strain condition
3.1.3
membrane window
testing area, contacted directly with the pressure media and surrounded by a frame, in the
free standing film specimen
Note 1 to entry: See Figure 1.

IEC 62047-17:2015 © IEC 2015 – 7 –
1 2
IEC
Key
1 top view 2 side view
3 membrane window 4 thin film deposited

Figure 1 – Typical example of bulge specimen
3.2 Symbols
The symbols used in this document are presented in Table 1 below.
Table 1 – Symbols and designations of a specimen
Symbol Unit Designation
t µm thickness of a membrane or thin film
R radius of a bulged membrane window
µm
maximum vertical displacement at the centre of the bulged
h
µm
window
d mm diameter in a circular window
half-width and half-length of the rectangular window,
respectively.
a,b mm
In case of square window, a equals to b.
p MPa differential pressure applied to the membrane window
C , C coefficients in generalized linear-elastic bulge equation
1 2
4 Principle of bulge test
Nominally free-standing film specimen with a frame surrounding a bulging membrane window
as shown in Figure 1 is required and it should be mounted on a bulge testing system which
can apply differential pressure to the specimen. Here, the pressure should be uniformly
distributed over the film in the window and loaded to the film in a constant and relatively static
rate. The geometry of the membrane window can be circular, square and rectangular shape.
NOTE 1 With selection of window geometry, analysis for determining stress and strain of the bulged film is
performed with different models, i.e. a spherical or a cyclindrical pressure vessel model.
The film, subjected to the differential pressure, over the window deforms in the out-of-plane
bulged form. By measuring the height, h, and pressure, p, from the bulged window, as
presented in Figure 2, pressure-deflection response and/or stress-strain relationship is
obtained through analysis model which can be chosen. The mechanical properties of the film,
t
– 8 – IEC 62047-17:2015 © IEC 2015
such as elastic modulus and residual stress, can be determined with the pressure-deflection
curve or stress-strain curve.
NOTE 2 The details of the analytic models are described in Annex A.
R
p
IEC
Figure 2 – Membrane window bulged by pressure
5 Test apparatus and environment
5.1 General
With applying pressure to the specimen, deformation response, i.e. change in bulge height,
in the membrane window shall be measured. In general, bulge test apparatus can be
composed of pressuring device, specimen holder and bulging height measurement units as
shown in Figure 3.
9 8
IEC
Key
1 deflection measurement system 4 pressure chamber 7 pressure gauge
2 specimen 5 membrane window 8 inlet
3 O-ring 6 substrate 9 outlet
Figure 3 – Typical example of bulge test apparatus
h
IEC 62047-17:2015 © IEC 2015 – 9 –
5.2 Apparatus
5.2.1 Pressuring device
Pressuring device should be equipped to apply a specified continuous pressure with a
controlled rate or a certain level of pressure to the membrane window to be bulged. Pressure
media can be oil, gas and distilled water. In general, the device can be composed of a
pressure sensor and pressure controller. The controller should be with accuracy of 1 % in full
test scale.
NOTE At the pressures encountered in the tests, gas is over a million times more compressible than typical
liquids such as oil and distilled water.
5.2.2 Bulge (pressure) chamber
The pressure chamber should be as compact as possible, to reduce the compliance of the
test system. The volume, which has to be pressurized and which potentially contributes to the
compliance, would be minimized.
In the case liquid is used to pressurize the test system, the system contains as little air as
possible because even a small air bubble trapped inside the test system can dominate the
system’s compliance. It is recommended that the system including the chamber be designed
so that there are no places where air bubbles can hide and that the liquid can be refilled
easily. Special care shall be taken not to introduce air bubbles when samples is mounted and
removed.
The material of the chamber should be chosen considering the pressure media for the test
and testing pressure range.
In the case liquid is used to pressurize the test system, it is recommended that the testing
apparatus be made out of transparent acrylic sheet in order to see air bubbles and then to
minimize them trapped within the chamber.
The bulge chamber is connected to the pressurizing device and thus allows a specimen to be
deformed with fine control. The specimen is mounted on the bulge chamber by mechanical
clamping or epoxy gluing method, etc.
NOTE In the case of capacitance measurement type
...