EN 60747-16-10:2004

SLOVENSKI SIST EN 60747-16-10:2005

STANDARD
december 2005
Polprevodniški elementi – 16-10. del: Program odobravanja tehnologije za
monolitna mikrovalovna integrirana vezja (IEC 60747-16-10:2004)
Semiconductor devices – Part 16-10: Technology Approval Schedule (TAS) for
monolithic microwave integrated circuits (IEC 60747-16-10:2004)
ICS 31.080.01; 31.200 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60747-16-10
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2004

ICS 31.200
English version
Semiconductor devices
Part 16-10: Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
(IEC 60747-16-10:2004)
Dispositifs à semiconducteurs Halbleiterbauelemente
Partie 16-10: Format-cadre Teil 16-10: Prüfplan für die
pour agrément de technologie (TAS) Technikanerkennung
pour circuits intégrés monolithiques (Technology Approval Schedule - TAS)
hyperfréquences für monolithische integrierte
(CEI 60747-16-10:2004) Mikrowellenschaltkreise
(IEC 60747-16-10:2004)
This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60747-16-10:2004 E

Foreword
The text of document 47E/257/FDIS, future edition 1 of IEC 60747-16-10, prepared by SC 47E,
Discrete semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the
IEC-CENELEC parallel vote and was approved by CENELEC as EN 60747-16-10 on 2004-09-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2005-06-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2007-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60747-16-10:2004 was approved by CENELEC as a
European Standard without any modification.
__________
- 3 - EN 60747-16-10:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60027 Series Letter symbols to be used in HD 245.4 S1 1997
electrical technology and
HD 60027 Series
IEC 60050 Series International Electrotechnical - -
Vocabulary (IEV)
IEC 60068 Series Environmental testing EN 60068 Series

1)
IEC 60191-2 - Mechanical standardization of - -
semiconductor devices
Part 2: Dimensions
IEC 60617 database Graphical symbols for diagrams - -

1)
IEC 60747-1 - Semiconductor devices - Discrete - -
devices
Part 1: General
1)
2)
IEC 60747-16-1 - Part 16-1: Microwave integrated EN 60747-16-1 2002
circuits - Amplifiers
1)
IEC 60747-16-2 - Part 16-2: Microwave integrated - -
circuits - Frequency prescalers

1) 2)
IEC 60747-16-3 - Part 16-3: Microwave integrated EN 60747-16-3 2002
circuits - Frequency converters

1) 2)
IEC 60747-16-4 - Part 16-4: Microwave integrated EN 60747-16-4 2004
circuits - Switches
1)
IEC 60748-1 - Semiconductor devices - Integrated - -
circuits
Part 1:General
1)
ISO 1000 - SI units and recommendations for - -
the use of their multiples and of
certain other units
1)
Undated reference.
2)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD 60747-16-10
QC 210021
First edition
2004-07
Semiconductor devices –
Part 16-10:
Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
© IEC 2004 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
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International Electrotechnical Commission
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– 2 – 60747-16-10 © IEC:2004(E)
CONTENTS
FOREWORD.4
Foreword to this particular Technology Approval Schedule (TAS) .7
Organizations responsible for preparing the present TAS.7
Preface.7
INTRODUCTION.8
1 General .9
1.1 Scope.9
1.2 Normative documents.9
1.3 Units, symbols and terminology .10
1.4 Standard and preferred values .10
1.5 Definitions .10
2 Definition of the component technology .12
2.1 Scope.12
2.2 Description of activities and flow charts.13
2.3 Technical abstract .13
2.4 Requirements for control of subcontractors .16
3 Component design of MMICs.18
3.1 Scope.18
3.2 Description of activities and flow charts.18
3.3 Interfaces .19
3.4 Validations and control of the processes .21
4 Mask manufacture .23
4.1 Scope.23
4.2 Description of activities and flow charts.23
4.3 Validation and control of the processes .23
4.4 Subcontractors, vendors and internal suppliers .23
5 Wafer fabrication of MMICs .23
5.1 Scope.23
5.2 Description of activities and flow charts.24
5.3 Equipment.26
5.4 Materials .26
5.5 Re-work .26
5.6 Validation methods and control of the processes .27
5.7 Interrelationship .28
6 Wafer probing of MMICs .30
6.1 Scope.30
6.2 Description of activities and flow charts.30
6.3 Equipment.30
6.4 Test procedures .30
6.5 Interrelationship .30
7 Back-side process for bare chip delivery .32
7.1 Scope.32
7.2 Description of activity and flow charts.32
7.3 Equipment.33
7.4 Materials .33

60747-16-10 © IEC:2004(E) – 3 –
7.5 Validation methods and control of the processes .33
7.6 Interrelationship .33
7.7 Validity of release.34
8 Assembly of MMICs.36
8.1 Scope.36
8.2 Description of activities and flow charts.36
8.3 Materials, inspection and handling.37
8.4 Equipment.37
8.5 Re-work .37
8.6 Validation and control of the processes .37
8.7 Interrelationships.38
9 Testing of MMICs .40
9.1 Scope.40
9.2 Description of activities and flow charts.40
9.3 Equipment.40
9.4 Test procedures .41
9.5 Interfaces .42
9.6 Validation and control of the processes .43
9.7 Process boundary verification.46
9.8 Product verification.50
10 Process characterization .50
10.1 Identification of process characteristics .50
10.2 Description of activities .51
10.3 Characterization procedures.52
11 Packaging and shipping.
...