EN IEC 62435-6:2018

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.SUHYRGQLãNLKElectronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (IEC 62435-6:2018)31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN IEC 62435-6:2018SIST EN IEC 62435-6:2019en01-januar-2019SIST EN IEC 62435-6:2019SLOVENSKI
STANDARD
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN IEC 62435-6
October 2018 ICS 31.020
English Version
Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices (IEC 62435-6:2018)
Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 6: Dispositifs encapsulés ou finis (IEC 62435-6:2018)
Elektronische Bauteile - Langzeitlagerung elektronischer Halbleiterbauelemente - Teil 6: Bauelemente in Gehäusen oder fertiggestellte Bauelemente (IEC 62435-6:2018) This European Standard was approved by CENELEC on 2018-10-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23,
B-1040 Brussels © 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62435-6:2018 E SIST EN IEC 62435-6:2019

Endorsement notice The text of the International Standard IEC 62435-6:2018 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60721-3-1 NOTE Harmonized as EN IEC 60721-3-1 IEC 62435-1 NOTE Harmonized as EN 62435-1 IEC 62435-2 NOTE Harmonized as EN 62435-2 IEC 62435-31 NOTE Harmonized as EN IEC 62435-32
IEC 62435-4 NOTE Harmonized as EN IEC 62435-4 IEC 62435-5 NOTE Harmonized as EN 62435-5 IEC 62435-73 NOTE Harmonized as EN IEC 62435-74 IEC 62435-85 NOTE Harmonized as EN IEC 62435-86
1 Under preparation. Stage at the time of publication: IEC/CCDV 62435-3:2018. 2 Under preparation. Stage at the time of publication: prEN IEC 62435-3:2018. 3 Under preparation. Stage at the time of publication: IEC/CD 62435-7:2018. 4 Under preparation. Stage at the time of publication: prEN IEC 62435-7:2018. 5 Under preparation. Stage at the time of publication: IEC/CD 62435-8:2018. 6 Under preparation. Stage at the time of publication: prEN IEC 62435-8:2018. SIST EN IEC 62435-6:2019

Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1
Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2
Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year IEC 60749-20 -
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat EN 60749-20 -
IEC 60749-20-1 -
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat EN 60749-20-1 -
JEDEC J-STD-020 -
Moisture/reflow classification for nonhermetic solid state surface mount devices - -
JEDEC J-STD-075 -
Classification of non-IC electronic components for assembly processes - -
IEC 62435-6 Edition 1.0 2018-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic components – Long-term storage of electronic semiconductor devices – Part 6: Packaged or finished devices
Composants électroniques – Stockage de longue durée des dispositifs électroniques à semiconducteurs – Partie 6: Dispositifs encapsulés ou finis
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 31.020
ISBN 978-2-8322-5979-5
– 2 – IEC 62435-6:2018 © IEC 2018 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope . 7 2 Normative references . 7 3 Terms and definitions . 7 4 Storage considerations . 9 4.1 Failure mechanisms . 9 4.1.1 Occurrence of failure and driving force . 9 4.1.2 Storage environment and mitigation for stimuli to prevent failure . 10 4.2 Materials management . 11 4.3 Storage media . 11 4.4 Inventory check. 11 4.5 Inventory dry packing refreshing . 12 4.6 Inventory re-assessment . 12 5 Baseline long-term storage requirements . 12 5.1 General . 12 5.1.1 Categories . 12 5.1.2 Critical aspects . 12 5.1.3 Recommendations and best practice . 12 5.2 Non-moisture sensitive device storage . 13 5.2.1 Storage media . 13 5.2.2 Lot data and labelling . 13 5.3 Moisture sensitive finished device storage . 13 5.3.1 Moisture sensitivity designation . 13 5.3.2 Dry packing for storage . 13 5.3.3 Moisture barrier bag . 13 5.3.4 Dunnage . 13 5.3.5 Humidity indicator card – HIC . 14 5.3.6 Desiccant . 14 5.3.7 Labelling . 14 5.4 Storage environment . 14 5.5 Process (temperature) sensitivity designation . 14 Annex A (informative)
Packaged or finished device storage environment considerations . 15 Bibliography . 16
Table 1 – Example failure mechanisms in storage and stimuli to mitigate during storage . 9 Table 2 – Long-term environment – Sustained condition requirements . 10 Table 3 – Considerations for management, control and documentation during storage . 11 Table A.1 – Long-term storage environment – Sustained condition considerations . 15
IEC 62435-6:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES –
Part 6: Packaged or finished devices
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote interna-tional co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Tech-nical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publica-tion(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the Interna-tional Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all inter-ested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinter-pretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence be-tween any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and ex-penses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publica-tions.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62435-6 has been prepared by IEC technical committee 47: Semi-conductor devices. The text of this International Standard is based on the following documents: FDIS Report on votin
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