ASTM E2444-05e1

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
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Designation: E2444 – 05
Terminology Relating to
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Measurements Taken on Thin, Reflecting Films
This standard is issued under the fixed designation E2444; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
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´ NOTE—Editorial changes were made throughout in January 2006.
1. Scope anchor—in a surface-micromachining process, the portion of
the test structure where a structural layer is intentionally
1.1 This standard consists of terms and definitions pertain-
attached to its underlying layer. E2244
ing to measurements taken on thin, reflecting films, such as
anchor lip—in a surface-micromachining process, the free-
found in microelectromechanical systems (MEMS) materials.
standing extension of the structural layer of interest around
In particular, the terms are related to the standards in Section 2,
the edges of the anchor to its underlying layer.
which were generated by Committee E08 on Fatigue and
Fracture. Terminology E1823 Relating to Fatigue and Fracture
DISCUSSION—In some processes, the width of the anchor lip may be
Testing is applicable to this standard.
zero. E2244
1.2 The terms are listed in alphabetical order.
bulk micromachining—a MEMS fabrication process where
2. Referenced Documents the substrate is removed at specified locations. E2244
2 cantilever—a test structure that consists of a freestanding
2.1 ASTM Standards:
beam that is fixed at one end. E2246
E1823 Terminology Relating to Fatigue and Fracture Test-
fixed-fixed beam —a test structure that consists of a freestand-
ing
ing beam that is fixed at both ends. E2245
E2244 Test Method for In-Plane Length Measurements of
in-plane length (or deflection) measurement, L (or D)
Thin, Reflecting Films Using an Optical Interferometer
[L]—the experimental determination of the straight-line
E2245 Test Method for Residual Strain Measurements of
distance between two transitional edges in a MEMS device.
Thin, Reflecting Films Using an Optical Interferometer
E2246 Test Method for Strain Gradient Measurements of
DISCUSSION—This length (or deflection) measurement is made paral-
Thin, Reflecting Films Using an Optical Interferometer lel to the underlying layer (or the xy-plane of the interferometer).
E2244
3. Terminology
interferometer—a non-contact optical instrument used to
3.1 Terms and Their Definitions:
obtain topographical 3-D data sets.
2-D data trace—a two-dimensional group of points that is
DISCUSSION—The height of the sample is measured along the z-axis
extracted from a topographical 3-D data set and that is
of the interferometer. The interferometer’s x-axis is typically aligned
parallel to the xz-or yz-plane of the interferometer. E2244
parallel or perpendicular to the transitional edges to be measured.
3-D data set—a three-dimensional group of points with a
E2244
topographical z-value for each (x, y) pixel location within the
MEMS—microelectromechanical systems. E2244
interferometer’s field of view. E2244
microelectromechanical systems, MEMS—in general, this
term is used to describe micron-scale structures, sensors, and
actuators and the technologies used for their manufacture
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This test method is under the jurisdiction ofASTM Committee E08 on Fatigue
(such as, silicon process technologies), or both. E2244
and Fracture and is the direct responsibility of Subcommittee E08.02 on Standards
out-of-plane measurements [L]—experimental data taken on
and Terminology.
structures that are curved in the interferometer’s z-direction
Current edition approved May 1, 2005. Published May 2005. DOI: 10.1520/
E2444-05E01.
(that is, perpendicular to the underlying layer). E2244
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For referenced ASTM standards, visit the ASTM website, www.astm.org, or
residual strain, ´ —in a MEMS process, the amount of
r
contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
deformation (or displacement) per unit length constrained
Standards volume information, refer to the standard’s Document Summary page on
the ASTM website. within the structural layer of interest after fabrication yet
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E2444 – 05
before the constraint of the sacrificial layer (or substrate) is support region—in a bulk-micromachining process, the area
removed (in whole or in part) E2245 that marks the end of the suspended structure. E2244
sacrificial layer—a single thickness of material that is inten- surface micromachining—a MEMS fabrication process
tionally deposited (or added) then removed (in whole or in where micron-scale c
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