ISO 21466:2019
(Main)Microbeam analysis — Scanning electron microscopy — Method for evaluating critical dimensions by CD-SEM
Microbeam analysis — Scanning electron microscopy — Method for evaluating critical dimensions by CD-SEM
This document specifies the structure model with related parameters, file format and fitting procedure for characterizing critical dimension (CD) values for wafer and photomask by imaging with a critical dimension scanning electron microscope (CD-SEM) by the model-based library (MBL) method. The method is applicable to linewidth determination for specimen, such as, gate on wafer, photomask, single isolated or dense line feature pattern down to size of 10 nm.
Analyse par microfaisceaux — Méthode d’évaluation des dimensions critiques par CD-SEM
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INTERNATIONAL ISO
STANDARD 21466
First edition
2019-12
Microbeam analysis — Scanning
electron microscopy — Method for
evaluating critical dimensions by CD-
SEM
Analyse par microfaisceaux — Méthode d’évaluation des dimensions
critiques par CD-SEM
Reference number
©
ISO 2019
© ISO 2019
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting
on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address
below or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Fax: +41 22 749 09 47
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii © ISO 2019 – All rights reserved
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Symbols and abbreviated terms . 8
5 Generation of Model-based Library (MBL) . 8
5.1 Basic components of a MBL simulator . 8
5.1.1 Electron probe model . 8
5.1.2 SE signal generation model .10
5.1.3 SE signal detection model .11
5.2 Model of specimen .12
5.2.1 Specimen structure and parameters .12
5.2.2 Specimen specification .15
5.2.3 Generation methods of specimen geometry .15
5.3 Monte Carlo simulation .15
5.3.1 Input parameters .15
5.3.2 Beam-specimen interaction .16
5.4 MBL file structure .16
5.4.1 Variable type and value .16
5.4.2 Model description file .20
5.4.3 Parameter specification file .21
5.4.4 Preparation of library data.21
5.4.5 MBL data structure .22
5.4.6 MBL data file format .22
6 Acquisition of a CD-SEM image.23
6.1 Acceptable image .23
6.2 Specimen tilt .23
6.3 Image quality .23
6.4 Selection of the field of view .23
6.5 CD-SEM image data file .23
7 CD determination .23
7.1 Determination of pixel size.24
7.2 Selection of the field of interest .24
7.3 Coordination and normalization .24
7.4 Matching procedure.25
7.4.1 Interpolation .25
7.4.2 Convolution .25
7.4.3 Matching .26
7.4.4 Averaging .30
8 Module functions and relationship .31
9 Uncertainty of CD measurement .33
Annex A (normative) Flow charts of procedures .35
Annex B (informative) Example of model description file .39
Annex C (informative) Example of parameter specification file .40
Annex D (informative) Example of CD evaluation .41
Bibliography .44
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www .iso .org/ patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www .iso .org/
iso/ foreword .html.
This document was prepared by Technical Committee ISO/TC 202, Microbeam analysis, Subcommittee
SC 4, Scanning electron microscopy (SEM).
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html.
iv © ISO 2019 – All rights reserved
Introduction
Nanostructures need strict dimensional control to meet the demands of the semiconductor industry.
Critical dimension (CD) is the minimum size of a feature on an integrated circuit that impacts the
electrical properties of the device, whose value represents the level of complexity of manufacturing.
At nanometer scale, measurement uncertainty control becomes more difficult with much smaller
dimensions. A determination method with algorithm for accurate measurement is a key for CD
valuation. CD-SEMs (critical dimension scanning electron microscopes) are one of the main tools for
CD measurement in semiconductor manufacturing processes, where secondary electrons (SEs) are
the signal source for CD-SEM imaging of surface structure. The CD-SEM image displays the structure
geometry, but the image contrast is not a perfect representation of the structure morphology. The
detected intensity linescan profile of SE signals carries the information about the sample shape and
composition, beam size and shape and the information volume generated by the electron beam-solid
interaction. Restricted by the physical mechanism in the processes of SE signal generation and emission,
the SE signal profiles show an edge effect which leads to difficulty for accurate CD value determination
with image contrast. A reliable CD determination method which bases on physical principle of SE signal
emission is necessary.
Many factors, for example the specimen chemical composition, structural geometric parameters, beam
conditions and other specimen/instrument factors (charging, vibration and drift), can affect CD-SEM
image contrast and hence the CD measurement result. Topographic contrast in the SE mode is resulted
from the enhanced SE emission from an edge as well as tilted local surface in relative to the incident
beam. The quantitative description of contrast or SE intensity profile is crucial in CD metrology.
The physical mechanisms that dominate quantitative measurements by CD-SEM have been well
understood. The CD determination algorithm is based on physical modelling of SE generation and
emission and gives adequate consideration of the influence of various experimental factors during
electron beam-specimen interaction. This document employs the model-based library (MBL) method
for accurate CD determination by CD-SEM. MBL is superior to simpler, unsophisticated, arbitrary
methods that disregard the physics of signal generation, and report only a meagre number, potentially
with unacceptably high bias. MBL uses the whole waveform of the signal, so it can provide result
...
INTERNATIONAL ISO
STANDARD 21466
First edition
2019-12
Microbeam analysis — Scanning
electron microscopy — Method for
evaluating critical dimensions by CD-
SEM
Analyse par microfaisceaux — Méthode d’évaluation des dimensions
critiques par CD-SEM
Reference number
©
ISO 2019
© ISO 2019
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting
on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address
below or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Fax: +41 22 749 09 47
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii © ISO 2019 – All rights reserved
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Symbols and abbreviated terms . 8
5 Generation of Model-based Library (MBL) . 8
5.1 Basic components of a MBL simulator . 8
5.1.1 Electron probe model . 8
5.1.2 SE signal generation model .10
5.1.3 SE signal detection model .11
5.2 Model of specimen .12
5.2.1 Specimen structure and parameters .12
5.2.2 Specimen specification .15
5.2.3 Generation methods of specimen geometry .15
5.3 Monte Carlo simulation .15
5.3.1 Input parameters .15
5.3.2 Beam-specimen interaction .16
5.4 MBL file structure .16
5.4.1 Variable type and value .16
5.4.2 Model description file .20
5.4.3 Parameter specification file .21
5.4.4 Preparation of library data.21
5.4.5 MBL data structure .22
5.4.6 MBL data file format .22
6 Acquisition of a CD-SEM image.23
6.1 Acceptable image .23
6.2 Specimen tilt .23
6.3 Image quality .23
6.4 Selection of the field of view .23
6.5 CD-SEM image data file .23
7 CD determination .23
7.1 Determination of pixel size.24
7.2 Selection of the field of interest .24
7.3 Coordination and normalization .24
7.4 Matching procedure.25
7.4.1 Interpolation .25
7.4.2 Convolution .25
7.4.3 Matching .26
7.4.4 Averaging .30
8 Module functions and relationship .31
9 Uncertainty of CD measurement .33
Annex A (normative) Flow charts of procedures .35
Annex B (informative) Example of model description file .39
Annex C (informative) Example of parameter specification file .40
Annex D (informative) Example of CD evaluation .41
Bibliography .44
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www .iso .org/ patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www .iso .org/
iso/ foreword .html.
This document was prepared by Technical Committee ISO/TC 202, Microbeam analysis, Subcommittee
SC 4, Scanning electron microscopy (SEM).
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html.
iv © ISO 2019 – All rights reserved
Introduction
Nanostructures need strict dimensional control to meet the demands of the semiconductor industry.
Critical dimension (CD) is the minimum size of a feature on an integrated circuit that impacts the
electrical properties of the device, whose value represents the level of complexity of manufacturing.
At nanometer scale, measurement uncertainty control becomes more difficult with much smaller
dimensions. A determination method with algorithm for accurate measurement is a key for CD
valuation. CD-SEMs (critical dimension scanning electron microscopes) are one of the main tools for
CD measurement in semiconductor manufacturing processes, where secondary electrons (SEs) are
the signal source for CD-SEM imaging of surface structure. The CD-SEM image displays the structure
geometry, but the image contrast is not a perfect representation of the structure morphology. The
detected intensity linescan profile of SE signals carries the information about the sample shape and
composition, beam size and shape and the information volume generated by the electron beam-solid
interaction. Restricted by the physical mechanism in the processes of SE signal generation and emission,
the SE signal profiles show an edge effect which leads to difficulty for accurate CD value determination
with image contrast. A reliable CD determination method which bases on physical principle of SE signal
emission is necessary.
Many factors, for example the specimen chemical composition, structural geometric parameters, beam
conditions and other specimen/instrument factors (charging, vibration and drift), can affect CD-SEM
image contrast and hence the CD measurement result. Topographic contrast in the SE mode is resulted
from the enhanced SE emission from an edge as well as tilted local surface in relative to the incident
beam. The quantitative description of contrast or SE intensity profile is crucial in CD metrology.
The physical mechanisms that dominate quantitative measurements by CD-SEM have been well
understood. The CD determination algorithm is based on physical modelling of SE generation and
emission and gives adequate consideration of the influence of various experimental factors during
electron beam-specimen interaction. This document employs the model-based library (MBL) method
for accurate CD determination by CD-SEM. MBL is superior to simpler, unsophisticated, arbitrary
methods that disregard the physics of signal generation, and report only a meagre number, potentially
with unacceptably high bias. MBL uses the whole waveform of the signal, so it can provide result
...
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