ISO 21456
(Main)Determination of the residual stress of TGO layer in thermal barrier coating by photoexcitation fluorescence piezoelectric spectroscopy
Determination of the residual stress of TGO layer in thermal barrier coating by photoexcitation fluorescence piezoelectric spectroscopy
This document describes the test method for the determination of the residual stress of the TGO layer in thermal barrier coating by photoexcitation fluorescence piezoelectric spectroscopy. This test method requires that there must be a Cr element in the bond coat of the thermal barrier coating, i.e., Cr element shall exist in the TGO layer. This test method of determining the residual stress in the TGO layer of the thermal barrier coating system is not limited by the preparation method of the thermal barrier coatings. Particularly, the thermal barrier coating system prepared by EB-PVD has a better effect. This method provides guidance on determining reliable estimates of residual stresses from fluorescence spectral data and estimating uncertainties in the results.
Détermination de la contrainte résiduelle de la couche TGO dans les revêtements barrières thermiques par spectroscopie de photoexcitation fluorescente et piezoélectrique
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FINAL DRAFT
International
Standard
ISO/FDIS 21456
ISO/TC 107
Determination of the residual
Secretariat: KATS
stress of TGO layer in thermal
Voting begins on:
barrier coating by photoexcitation
2024-12-13
fluorescence piezoelectric
Voting terminates on:
spectroscopy
2025-02-07
RECIPIENTS OF THIS DRAFT ARE INVITED TO SUBMIT,
WITH THEIR COMMENTS, NOTIFICATION OF ANY
RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE
AND TO PROVIDE SUPPOR TING DOCUMENTATION.
IN ADDITION TO THEIR EVALUATION AS
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LOGICAL, COMMERCIAL AND USER PURPOSES, DRAFT
INTERNATIONAL STANDARDS MAY ON OCCASION HAVE
TO BE CONSIDERED IN THE LIGHT OF THEIR POTENTIAL
TO BECOME STAN DARDS TO WHICH REFERENCE MAY BE
MADE IN NATIONAL REGULATIONS.
Reference number
ISO/FDIS 21456:2024(en) © ISO 2024
FINAL DRAFT
ISO/FDIS 21456:2024(en)
International
Standard
ISO/FDIS 21456
ISO/TC 107
Determination of the residual
Secretariat: KATS
stress of TGO layer in thermal
Voting begins on:
barrier coating by photoexcitation
fluorescence piezoelectric
Voting terminates on:
spectroscopy
RECIPIENTS OF THIS DRAFT ARE INVITED TO SUBMIT,
WITH THEIR COMMENTS, NOTIFICATION OF ANY
RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE
AND TO PROVIDE SUPPOR TING DOCUMENTATION.
© ISO 2024
IN ADDITION TO THEIR EVALUATION AS
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
BEING ACCEPTABLE FOR INDUSTRIAL, TECHNO
LOGICAL, COMMERCIAL AND USER PURPOSES, DRAFT
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on
INTERNATIONAL STANDARDS MAY ON OCCASION HAVE
the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below
TO BE CONSIDERED IN THE LIGHT OF THEIR POTENTIAL
or ISO’s member body in the country of the requester.
TO BECOME STAN DARDS TO WHICH REFERENCE MAY BE
MADE IN NATIONAL REGULATIONS.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland Reference number
ISO/FDIS 21456:2024(en) © ISO 2024
ii
ISO/FDIS 21456:2024(en)
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 3
4.1 General .3
4.2 Principle of measuring residual stress by photo-excited fluorescence piezoelectric
spectroscopy .3
5 Test methods . 3
5.1 General .3
5.2 Test specimen .3
5.3 PFPS device calibration .4
5.4 Setting of detection conditions .4
5.5 Sample focusing .4
5.6 Detection of Raman peaks .4
5.7 Data acquisition .4
6 Calculation of stress . 4
7 Reliability . 7
8 Test report . 7
Annex A (informative) Example of the determination of the residual stress of the TGO layer in
TBC by photoexcited fluorescence piezoelectric spectrum . 9
Bibliography .11
iii
ISO/FDIS 21456:2024(en)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out through
ISO technical committees. Each member body interested in a subject for which a technical committee
has been established has the right to be represented on that committee. International organizations,
governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely
with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types
of ISO document should be noted. This document was drafted in accordance with the editorial rules of the
ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). ISO takes no position concerning the evidence, validity or applicability of any claimed patent
rights in respect thereof. As of the date of publication of this document, ISO had not received notice of (a)
patent(s) which may be required to implement this document. However, implementers are cautioned that
this may not represent the latest information, which may be obtained from the patent database available at
www.iso.org/patents. ISO shall not be held responsible for identifying any or all such patent rights.
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and expressions
related to conformity assessment, as well as information about ISO's adherence to the World Trade
Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www.iso.org/iso/foreword.html.
This document was prepared by Technical Committee ISO/TC 107, Metallic and other inorganic coatings.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.html.
iv
ISO/FDIS 21456:2024(en)
Introduction
The thermally grown oxide (TGO) layer of a thermal barrier coating (TBC) is the fundamental cause of
interface crack and eventual spalling failure of the ceramic layer. Therefore, the TGO layer and its interfaces
with each layer are risky areas for TBC failure and peeling. The residual stress in the TGO of a TBC can
be determined using the photoexcitation fluorescence piezoelectric spectroscopy (PFPS) method. This
provides an important basis for the lifetime evaluation of TBC and to understand the failure mechanism of
the TBC.
This method to test the residual stress in the TGO layer is a non-destructive testing method, unlike the
curvature and drilling methods, which cause damage to the sample. Unlike x-ray diffraction, the penetration
depth is only tens of micrometers.
3+
The inclusion of Cr in the TGO of a TBC is a prerequisite for testing the residual stress of the TGO layer of
TBC by photoexcited fluorescence piezoelectric spectroscopy. No matter what method is used to prepare the
TBC system, the bond coat contains a Cr element.
The size, shape and composition of the substrate material are not specified and differentiated. In addition,
the preparation method of the TBC is not specified and differentiated.
The residual stress of the TGO layer is one of the main factors causing the failure of the TBC. However, no
standard document is available for the test method process and the result of the photoexcited fluorescence
piezoelectric spectroscopy test of residual stress in the TGO layer of the TBC. Therefore, it is necessary to
develop a standardized and unified test method process that is conducive to the formation, simulation and
testing of residual stress in the TGO layer of the TBC and even the prediction of the service life of the TBC.
v
FINAL DRAFT International Standard ISO/FDIS 21456:2024(en)
Determination of the residual stress of TGO layer in thermal
barrier coating by photoexcitation fluorescence piezoelectric
spectroscopy
1 Scope
This document specifies a test method for the determination of the residual stress of the TGO layer in
thermal barrier coating (TBC) by photoexcitation fluorescence piezoelectric spectroscopy.
This test method specifies that there is a Cr element in the bond coat of the TBC.
This test method to determine the residual stress in the TGO layer of the TBC system is not limited by the
preparation method of the TBCs. Particularly, the TBC system prepared by electron beam-physical vapour
deposition (EB-PVD) has a better effect.
This method provides guidance on determining reliable estimates of residual stresses from fluorescence
spectral data and estimating uncertainties in the results.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references,
the latest edition of the referenced document (including any amendments) applies.
ISO 14188, Metallic and other inorganic coatings — Test methods for measuring thermal cycle resistance and
thermal shock resistance for thermal barrier coatings
ISO 19477, Metallic and other inorganic coatings — Measurement of Young's modulus of thermal barrier coatings
by beam bending
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 14188 and ISO 19477 and the
following apply.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
3.1
thermal barrier coating
TBC
two-layer coating consisting of a metallic bond coat and a ceramic top coat in order to reduce heat transfer
from outside of the top coat through the coating to the substrate
Note 1 to entry: Thermal barrier coating is a thermal protection technology that combines ceramic materials, known
for high temperature resistance and low thermal conductivity, with substrate alloy in the form of coating to reduce the
surface temperature of hot-end components, enhance resistance to high-temperature oxidation corrosion in substrate
materials and ultimately improve the engine's thrust-to-weight ratio, thermal efficiency and the service life of hot-end
components under high temperature and stress.
ISO/FDIS 21456:2024(en)
Note 2 to entry: Thermal barrier coating systems usually consist of a metal bond coat and an insulating ceramic coat
(see Figure 1). In the thermal barrier coating system, due to the large difference in thermal expansion coefficient
between the ceramic coat and the substrate material, it is easy to produce large thermal stress in the service process,
lea
...
ISO/FDIS 21456:2024(en)
ISO /TC 107/N2912
Secretariat: KATS
Date: 2024-10-1011-29
Determination of the residual stress of TGO layer in thermal barrier
coating by photoexcitation fluorescence piezoelectric spectroscopy
FDIS stage
ISO/DISFDIS 21456:2024(en)
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication
may be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying,
or posting on the internet or an intranet, without prior written permission. Permission can be requested from either ISO
at the address below or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: + 41 22 749 01 11
EmailE-mail: copyright@iso.org
Website: www.iso.orgwww.iso.org
Published in Switzerland
© ISO 2024 – All rights reserved
ii
ISO/FDIS 21456:2024(en)
© ISO 2024 – All rights reserved
iii
ISO/DISFDIS 21456:2024(en)
© ISO 2024 – All rights reserved
iv
ISO/FDIS 21456:2024(en)
Contents
Foreword . iv
Introduction . v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 3
4.1 General . 3
4.2 Principle of measuring residual stress by photo-excited fluorescence piezoelectric
spectroscopy . 3
5 Test methods . 4
5.1 General . 4
5.2 Test specimen . 4
5.3 PFPS device calibration . 4
5.4 Setting of detection conditions . 4
5.5 Sample focusing . 4
5.6 Detection of Raman peaks . 4
5.7 Data acquisition . 4
6 Calculation of stress . 5
7 Reliability . 7
8 Test report . 7
Annex A (informative) Example of the determination of the residual stress of the TGO layer in
TBC by photoexcited fluorescence piezoelectric spectrum . 10
Bibliography . 12
Foreword . vii
Introduction . viii
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 3
4.1 General . 3
4.2 Principle of measuring residual stress by photo-excited fluorescence piezoelectric
spectroscopy . 3
5 Test methods . 4
5.1 General . 4
5.2 Test specimen . 4
5.3 PFPS device calibration . 4
5.4 Setting of detection conditions . 4
5.5 Sample focusing . 4
5.6 Detection of Raman peaks . 5
5.7 Data acquisition . 5
6 Calculation of stress . 5
© ISO 2024 – All rights reserved
v
ISO/DISFDIS 21456:2024(en)
7 Reliability . 11
8 Test report . 11
Annex A (informative) Example of the determination of the residual stress of the TGO layer in
TBC by photoexcited fluorescence piezoelectric spectrum . 13
Bibliography . 15
© ISO 2024 – All rights reserved
vi
ISO/FDIS 21456:2024(en)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out through
ISO technical committees. Each member body interested in a subject for which a technical committee has been
established has the right to be represented on that committee. International organizations, governmental and
non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the
International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types of
ISO document should be noted. This document was drafted in accordance with the editorial rules of the
ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). ISO takes no position concerning the evidence, validity or applicability of any claimed patent rights
in respect thereof. As of the date of publication of this document, ISO had not received notice of (a) patent(s)
which may be required to implement this document. However, implementers are cautioned that this may not
represent the latest information, which may be obtained from the patent database available at
www.iso.org/patents.www.iso.org/patents. ISO shall not be held responsible for identifying any or all such
patent rights.
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and expressions
related to conformity assessment, as well as information about ISO's adherence to the World Trade
Organization (WTO) principles in the Technical Barriers to Trade (TBT), see
www.iso.org/iso/foreword.htmlwww.iso.org/iso/foreword.html.
This document was prepared by Technical Committee ISO/TC 107, Metallic and other inorganic coatings.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www.iso.org/members.htmlwww.iso.org/members.html.
© ISO 2024 – All rights reserved
vii
ISO/DISFDIS 21456:2024(en)
Introduction
ThermallyThe thermally grown oxide (TGO) layer of a thermal barrier coating (TBC) is the fundamental cause
of interface crack and eventual spalling failure of the ceramic layer. Therefore, the TGO layer and its interfaces
with each layer are risky areas for thermal barrier coatingTBC failure and peeling. ByThe residual stress in the
TGO of a TBC can be determined using the photoexcitation fluorescence piezoelectric spectroscopy (PFPS)
method, the residual stress in TGO of thermal barrier coating can be determined, which. This provides an
important basis for the lifetime evaluation of thermal barrier coatingTBC and is also a necessary process to
understand the failure mechanism of the thermal barrier coatingTBC.
This method to test the residual stress in the TGO layer is a non-destructive testing method, unlike the
curvature and drilling methods, which cause damage to the sample. Unlike XRDx-ray diffraction, the
penetration depth is only tens of micrometers.
3+
The inclusion of Cr in the TGO of thermal barrier coatinga TBC is a prerequisite for testing the residual stress
of the TGO layer of thermal barrier coatingTBC by photoexcited fluorescence piezoelectric spectroscopy. No
matter what method is used to prepare the thermal barrier coatingTBC system, the bond coat must
containcontains a Cr element.
The size, shape, and composition of the substrate material are not specified and differentiated. In addition, the
preparation method of the thermal barrier coatingTBC is not specified and differentiated.
The residual stress of the TGO layer is one of the main factors causing the failure of the thermal barrier
coating.TBC. However, no standard document is available for the test method process and the result of the
photoexcited fluorescence piezoelectric spectroscopy test of residual stress in the TGO layer of the thermal
barrier coating.TBC. Therefore, it is necessary to develop a standardized and unified test method process,
which will be that is conducive to the formation, simulation, and testing of residual stress in the TGO layer of
the thermal barrier coatingTBC and even the prediction of the service life of thermal barrier coatingthe TBC.
© ISO 2024 – All rights reserved
viii
FINAL DRAFT International Standard ISO/FDIS 21456:2024(en)
Determination of the residual stress of TGO layer in thermal barrier
coating by photoexcitation fluorescence piezoelectric spectroscopy
1 Scope
This document describes thespecifies a test method for the determination of the residual stress of the TGO
layer in thermal barrier coating (TBC) by photoexcitation fluorescence piezoelectric spectroscopy.
This test method requiresspecifies that there must beis a Cr element in the bond coat of the thermal barrier
coating, i.e. Cr element shall exist in the TGO layerTBC.
This test method of determiningto determine the residual stress in the TGO layer of the thermal barrier
coatingTBC system is not limited by the preparation method of the thermal barrier coatings.TBCs. Particularly,
the thermal barrier coatingTBC system prepared by electron beam-physical vapour deposition (EB-PVD) has
a better effect.
This method provides guidance on determining reliable estimates of residual stresses from fluorescence
spectral data and estimating uncertainties in the results.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated re
...
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