IEC 60127-4:2005/AMD1:2008

IEC 60127-4 ®
Edition 3.0 2008-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Miniature fuses –
Part 4: Universal modular fuse-links (UMF) – Through-hole and surface mount
types
Coupe-circuit miniatures –
Partie 4: Eléments de remplacement modulaires universels (UMF) – Types de
montage en surface et montage par trous

IEC 60127-4:2005/A1:2008
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les
microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

Useful links:
IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.

IEC Just Published - webstore.iec.ch/justpublished Customer Service Centre - webstore.iec.ch/csc
Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication
details all new publications released. Available on-line and or need further assistance, please contact the
also once a month by email. Customer Service Centre: csc@iec.ch.

A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.

Liens utiles:
Recherche de publications CEI - www.iec.ch/searchpub Electropedia - www.electropedia.org
La recherche avancée vous permet de trouver des Le premier dictionnaire en ligne au monde de termes
publications CEI en utilisant différents critères (numéro de électroniques et électriques. Il contient plus de 30 000
référence, texte, comité d’études,…). termes et définitions en anglais et en français, ainsi que
Elle donne aussi des informations sur les projets et les les termes équivalents dans les langues additionnelles.
publications remplacées ou retirées. Egalement appelé Vocabulaire Electrotechnique
International (VEI) en ligne.
Just Published CEI - webstore.iec.ch/justpublished
Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications de la CEI.
Just Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur
Disponible en ligne et aussi une fois par mois par email. cette publication ou si vous avez des questions
contactez-nous: csc@iec.ch.
IEC 60127-4 ®
Edition 3.0 2008-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Miniature fuses –
Part 4: Universal modular fuse-links (UMF) – Through-hole and surface mount

types
Coupe-circuit miniatures –
Partie 4: Eléments de remplacement modulaires universels (UMF) – Types de

montage en surface et montage par trous

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX G
ICS 29.120.50 ISBN 978-2-83220-358-3

– 2 – 60127-4 Amend. 1  IEC:2008
FOREWORD
This amendment has been prepared by subcommittee 32C: Miniature fuses, of IEC technical
committee 32: Fuses.
This bilingual version (2012-09) corresponds to the monolingual English version, published in
2008-05.
The text of this amendment is based on the following documents:
FDIS Report on voting
32C/411/FDIS 32C/412/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The French version of this amendment has not been voted upon.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Page 17
7.3 Fuse-bases for tests
7.3.1 General requirements
Replace, in the second paragraph, the second dashed item commencing “… the nominal
thickness of copper layer … “ by the following:
– the nominal thickness of copper layer shall be 0,035 mm (0,070 mm for rated currents
above 5 A).
Page 21
8.6 Solderability of terminations
Add, after the title, the following new sentence:
For the tests described in 8.6.1 to 8.6.2, lead-free solder as described in Table 2 of
IEC 60068-2-58 shall be used in the solder bath.

60127-4 Amend. 1  IEC:2008 – 3 –
8.6.1 Through-hole fuse-links
In the list of test conditions, replace the second condition (immersion conditions) as follows:
Immersion conditions: 250 °C ± 3 °C, 3 s ± 0,3 s
8.6.2 Surface mount fuse-links
Replace the first sentence as follows:
The fuse-links shall be tested according to 6.2 of IEC 60068-2-58, with the following
conditions:
In the list of test conditions, replace the second condition (immersion conditions) as follows:
Immersion conditions: 250 °C ± 3 °C, 3 s ± 0,3 s

Page 23
8.7.2 Surface mount fuse-links
Replace the first sentence as follows:
The fuse-links shall be tested according to 6.2 of IEC 60068-2-58, with the following
conditions:
Page 27
9.7 Fuse-link temperature
In item a) replace the second sentence “The temperature rise shall not exceed 70 K for rated
current up to and including 6,3 A, and 85 K for rated current above 6,3 A;” by the following:
The temperature rise shall not exceed 75 K for fuse-links with rated current up to and
including 6,3 A and 95 K for rated current above 6,3 A;
In item b) replace the last sentence “The temperature rise shall not exceed 85 K.“ by the
following:
The temperature rise shall not exceed 95 K.

Page 37
Figure 2 – Test board for through-hole fuse-links
Replace, in the key to Figure 2, all three occurrences of “6,3 A” by ”5 A”.

– 4 – 60127-4 Amend. 1  IEC:2008
Page 39
Figure 3 – Test board for surface mount fuse-links
Replace, in the key to Figure 3, the two references to “6,3 A” by “5 A”.

Page 43
Figure 5 – Bending jig for surface-mount fuse-links
Replace the drawings of Figure 5 by the following new drawings:
Dimensions in millimetres
Standard printed wiring
board before the test
Solder Test sample
Support
45 ± 2 45 ± 2
Radius = 340
Standard printed wiring
board during the test
Width = 45
IEC  733/08
60127-4 Amend. 1  IEC:2008 – 5 –
Page 51
10.2 Standard sheet 2 – Surface mount fuse-links
Replace, in the table of values, under column “Minimum terminal spacing”, for fuse-links with
rated voltage 250 V (low-breaking capacity) the value “4” by the value “2,5”.

Page 55
Annex A
(informative)
Mounting for surface mount fuse-links

Replace the text of Annex A by the following new text:
The test fuse-links may be submitted to the test house already soldered to the test boards.
However, some tests require fuses to be loose, e.g. “solderability” and “resistance to
soldering heat” tests, while through-hole type “bend testing” has to be carried out before
soldering. While it is considered acceptable for the test house to be able to solder the
through-hole types to the test board for subsequent measurement of voltage drop, there is a
difficulty with soldering SMD fuse-links that have been subjected to resistance to soldering
heat onto a test board so that the voltage drop can be tested.
Some of the following is taken from IEC 60068-2-58 using “Group 3 Medium High
Temperature Solder paste”.
a) Choice of solder paste
1) The alloy composition to be used shall consist of 3,0 wt % Ag (silver), 0,5 wt % Cu
(copper) and the remainder of Sn (tin); Sn96,5Ag3,0Cu0,5 is preferred. The solder
alloys shall consist of 3,0 wt % to 4,0 wt % Ag, 0,5 wt % to 1,0 wt % Cu, and the
remainder of Sn may be used instead of Sn96,5Ag3,0Cu0,5.
– Solder powder
The powder size shall be symbol 3, specified in Table 2 of 6.3.2 of IEC 61190-1-2.
The shape of the solder powder shall be spherical.
– Flux composition
The flux to be used shall consist of 30 wt % polymerization rosin (softening point
approximately 95 °C), 30 wt % dibasic acid degeneration rosin (softening point
approximately 140 °C), 34,7 wt % diethylene glycol monobutyl ether, 0,8 wt % 1,3-
diphenylguanidine- HBr, 0,5 wt % adipic acid (chlorine content less than 0,1 %) and
4 wt % stiffening castor oil.
– Solder paste composition
The solder paste to be used shall consist of 88 wt % solder powder and 12 wt %
flux. The viscosity range shall be (180 ± 50) Pa·s.
2) The footprints shall be covered with a solder deposit. The thickness of the solder
deposit shall be between 100 µm and 250 µm; the thickness shall be specified in the
relevant specification.
b) Preparation of the specimen

– 6 – 60127-4 Amend. 1  IEC:2008
1) The specimen surface to be tested shall be in the "as received"
...