IEC 60127-4:2005/AMD1:2008

IEC 60127-4 ®
Edition 3.0 2008-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Miniature fuses –
Part 4: Universal modular fuse-links (UMF) – Through-hole and surface mount
types
Coupe-circuit miniatures –
Partie 4: Eléments de remplacement modulaires universels (UMF) – Types de
montage en surface et montage par trous

IEC 60127-4:2005/A1:2008
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IEC 60127-4 ®
Edition 3.0 2008-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Miniature fuses –
Part 4: Universal modular fuse-links (UMF) – Through-hole and surface mount

types
Coupe-circuit miniatures –
Partie 4: Eléments de remplacement modulaires universels (UMF) – Types de

montage en surface et montage par trous

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX G
ICS 29.120.50 ISBN 978-2-83220-358-3

– 2 – 60127-4 Amend. 1  IEC:2008
FOREWORD
This amendment has been prepared by subcommittee 32C: Miniature fuses, of IEC technical
committee 32: Fuses.
This bilingual version (2012-09) corresponds to the monolingual English version, published in
2008-05.
The text of this amendment is based on the following documents:
FDIS Report on voting
32C/411/FDIS 32C/412/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The French version of this amendment has not been voted upon.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Page 17
7.3 Fuse-bases for tests
7.3.1 General requirements
Replace, in the second paragraph, the second dashed item commencing “… the nominal
thickness of copper layer … “ by the following:
– the nominal thickness of copper layer shall be 0,035 mm (0,070 mm for rated currents
above 5 A).
Page 21
8.6 Solderability of terminations
Add, after the title, the following new sentence:
For the tests described in 8.6.1 to 8.6.2, lead-free solder as described in Table 2 of
IEC 60068-2-58 shall be used in the solder bath.

60127-4 Amend. 1  IEC:2008 – 3 –
8.6.1 Through-hole fuse-links
In the list of test conditions, replace the second condition (immersion conditions) as follows:
Immersion conditions: 250 °C ± 3 °C, 3 s ± 0,3 s
8.6.2 Surface mount fuse-links
Replace the first sentence as follows:
The fuse-links shall be tested according to 6.2 of IEC 60068-2-58, with the following
conditions:
In the list of test conditions, replace the second condition (immersion conditions) as follows:
Immersion conditions: 250 °C ± 3 °C, 3 s ± 0,3 s

Page 23
8.7.2 Surface mount fuse-links
Replace the first sentence as follows:
The fuse-links shall be tested according to 6.2 of IEC 60068-2-58, with the following
conditions:
Page 27
9.7 Fuse-link temperature
In item a) replace the second sentence “The temperature rise shall not exceed 70 K for rated
current up to and including 6,3 A, and 85 K for rated current above 6,3 A;” by the following:
The temperature rise shall not exceed 75 K for fuse-links with rated current up to and
including 6,3 A and 95 K for rated current above 6,3 A;
In item b) replace the last sentence “The temperature rise shall not exceed 85 K.“ by the
following:
The temperature rise shall not exceed 95 K.

Page 37
Figure 2 – Test board for through-hole fuse-links
Replace, in the key to Figure 2, all three occurrences of “6,3 A” by ”5 A”.

– 4 – 60127-4 Amend. 1  IEC:2008
Page 39
Figure 3 – Test board for surface mount fuse-links
Replace, in the key to Figure 3, the two references to “6,3 A” by “5 A”.

Page 43
Figure 5 – Bending jig for surface-mount fuse-links
Replace the drawings of Figure 5 by the following new drawings:
Dimensions in millimetres
Standard printed wiring
board before the test
Solder Test sample
Support
45 ± 2 45 ± 2
Radius = 340
Standard printed wiring
board during the test
Width = 45
IEC  733/08
60127-4 Amend. 1  IEC:2008 – 5 –
Page 51
10.2 Standard sheet 2 – Surface mount fuse-links
Replace, in the table of values, under column “Minimum terminal spacing”, for fuse-links with
rated voltage 250 V (low-breaking capacity) the value “4” by the value “2,5”.

Page 55
Annex A
(informative)
Mounting for surface mount fuse-links

Replace the text of Annex A by the following new text:
The test fuse-links may be submitted to the test house already soldered to the test boards.
However, some tests require fuses to be loose, e.g. “solderability” and “resistance to
soldering heat” tests, while through-hole type “bend testing” has to be carried out before
soldering. While it is considered acceptable for the test house to be able to solder the
through-hole types to the test board for subsequent measurement of voltage drop, there is a
difficulty with soldering SMD fuse-links that have been subjected to resistance to soldering
heat onto a test board so that the voltage drop can be tested.
Some of the following is taken from IEC 60068-2-58 using “Group 3 Medium High
Temperature Solder paste”.
a) Choice of solder paste
1) The alloy composition to be used shall consist of 3,0 wt % Ag (silver), 0,5 wt % Cu
(copper) and the remainder of Sn (tin); Sn96,5Ag3,0Cu0,5 is preferred. The solder
alloys shall consist of 3,0 wt % to 4,0 wt % Ag, 0,5 wt % to 1,0 wt % Cu, and the
remainder of Sn may be used instead of Sn96,5Ag3,0Cu0,5.
– Solder powder
The powder size shall be symbol 3, specified in Table 2 of 6.3.2 of IEC 61190-1-2.
The shape of the solder powder shall be spherical.
– Flux composition
The flux to be used shall consist of 30 wt % polymerization rosin (softening point
approximately 95 °C), 30 wt % dibasic acid degeneration rosin (softening point
approximately 140 °C), 34,7 wt % diethylene glycol monobutyl ether, 0,8 wt % 1,3-
diphenylguanidine- HBr, 0,5 wt % adipic acid (chlorine content less than 0,1 %) and
4 wt % stiffening castor oil.
– Solder paste composition
The solder paste to be used shall consist of 88 wt % solder powder and 12 wt %
flux. The viscosity range shall be (180 ± 50) Pa·s.
2) The footprints shall be covered with a solder deposit. The thickness of the solder
deposit shall be between 100 µm and 250 µm; the thickness shall be specified in the
relevant specification.
b) Preparation of the specimen

– 6 – 60127-4 Amend. 1  IEC:2008
1) The specimen surface to be tested shall be in the "as received" condition and shall not
be touched by fingers or otherwise contaminated.
2) The specimen shall not be cleaned prior to test. If required by the relevant
specification, the specimen may be immersed in an organic solvent at room
temperature for preconditioning.
3) Preconditioning
Specimens, which need preconditioning, shall be pre-treated in accordance with the
relevant specification.
c) Positioning of the specimen
The specimen shall be placed symmetrically on its footprint.
d) Soldering
1) As long as the soldering conditions do not lead to a thermal load, which exceeds the
SMD specification, any kind of reflow oven or vapour phase soldering oven may be
used.
2) The parameters for reflow temperature are detailed in Figure A.1.

Key
t
T Minimum preheating temperature
1  T
T Maximum preheating temperature
T
t
T Soldering temperature
T
T Peak temperature
T
t
t Preheating duration
t Soldering duration
t Peak temperature duration
IEC  713/04
T T t T  t T t
1 2 1 3 2 4 3
°C °C s °C s °C s
150 ± 5 180 ± 5 60 to 120 225 20 ± 5 235 --
Figure A.1 – Parameters for reflow temperature
3) The reflow temperature specified is mentioned for wetting test condition of solder
reflow method. Care should be taken that the typical soldering process temperature is
o o
235 C to 250 C as mentioned in Table 1 of IEC 60068-2-58.
4) Care shall be taken that complete wetting is achieved.
5) The soldered area of the substrate shall be cleaned using 2-propanol (iso-propanol) or
water to remove surplus flux. If necessary, the details of the cleaning method shall be
specified in the relevant specification.
6) The solder fillet shall comply with the minimum requirements for the relevant joint
given in IEC 61191-2.
60127-4 Amend. 1  IEC:2008 – 7 –
Page 59
Bibliography
Add the following new reference:
IEC 61190-1-2:2007, Attachment materials for electronic assembly – Part 1-2:Requirements
for soldering pastes for high-quality interconnects in electronics assembly

___________
– 8 – 60127-4 Amend. 1  CEI:2008
AVANT-PROPOS
Le présent amendement a été établi par le sous-comité 32C: Coupe-circuit à fusibles
miniatures, du comité d'études 32 de la CEI: Coupe-circuit à fusibles.
La présente version bilingue (2012-09) correspond à la version anglaise monolingue publiée
en 2008-05.
Le texte anglais de cet amendement est issu des documents 32C/411/FDIS et 32C/412/RVD.
Le rapport de vote 32C/412/RVD donne toute information sur le vote ayant abouti à
l’approbation de cet amendement.
La version française de cet amendement n’a pas été soumise au vote.Le comité a décidé que
le contenu de la publication de base et de ses amendements ne sera pas modifié avant la
date de maintenance indiquée sur le site web de la CEI sous “http://webstore.iec.ch” dans les
données relatives à la publication recherchée. A cet
...