IEC 61837-4:2004

IEC 61837-4 ®
Edition 1.0 2004-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 4: Hybrid enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 4: Encombrements des enveloppes hybrides

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IEC 61837-4 ®
Edition 1.0 2004-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 4: Hybrid enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 4: Encombrements des enveloppes hybrides

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.140 ISBN 978-2-8322-1098-7

– 2 – 61837-4  IEC:2004
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 4: Hybrid enclosure outlines

FOREWORD
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International Standard IEC 61837-4 has been prepared by IEC technical committee 49:
Piezoelectric and dielectric devices for frequency control and selection.
This International Standard shall be read in conjunction with IEC 61240.
This bilingual version (2013-09) corresponds to the monolingual English version, published in
2004-05.
The text of this standard is based on the following documents:
FDIS Report on voting
49/657/FDIS 49/679/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

61837-4  IEC:2004 – 3 –
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61837 consists of the following parts under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal
lead connections:
Part 1: Plastic moulded enclosure outlines;
Part 2:  Ceramic enclosures;
Part 3: Metal enclosures;
Part 4: Hybrid enclosure outlines.

The committee has decided that the contents of this publication will remain unchanged until
2008. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 61837-4  IEC:2004
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 4: Hybrid enclosure outlines

1 Scope
This part of IEC 61837 specifies the outline drawings for surface mounted piezoelectric
devices with hybrid enclosure outlines.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61240:1994, Piezoelectric devices – Preparation of outline drawings of surface mounted
devices (SMD) for frequency control and selection – General rules
3 Dimensions of surface mounted piezoelectric devices with hybrid enclosure
outlines
The dimensions in this standard apply to surface mounted piezoelectric devices.
Only those dimensions are given which meet the requirements of IEC 61240.
4 Designation of surface mounted piezoelectric devices with hybrid enclosure
outlines
Table 1 – Designation of surface mounted piezoelectric devices
with hybrid enclosure outlines
National reference
No. Type Sheet No. Description
Country Reference
1 CO 25 Sheet 1 Hybrid SMD enclosure with four bent connection pins
2 CO 26 Sheet 2 Hybrid SMD enclosure with four connection pads
3 CO 27 Sheet 3 Hybrid SMD enclosure with six connection pads
4 CO 28 Sheet 4 Hybrid SMD enclosure with seven connection pads
5 CO 29 Sheet 5 Hybrid SMD enclosure with eight connection pads
6 CO 30 Sheet 6 Hybrid SMD enclosure with six connection pads

61837-4  IEC:2004 – 5 –
Table 2 – Lead connections
Crystal oscillator Position
Function
outline (lead number)
CO 25 1 NC (IC)
2 Ground
3 Output
4 Vcc
CO 26 1 NC (IC)
2 Ground
3 Output
4 Vcc
CO 27 1 Vc
2 NC (IC)
3 Ground
4 Output
5 NC (IC)
6 Vcc
CO 28 1 NC (IC)
2 Vref
3 Vcc
4 Output
5 NC (IC)
6 NC (IC)
7 Ground
CO 29 1 Vc
2 Optional
6 Disable
7 Ground
8 Output
9 Output
13 Optional
14 Vcc
CO 30 1 Vc
2 Vcc
3 Optional
4 Output
5 Ground
6 Optional
– 6 – 61837-4  IEC:2004
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A  18,5
B  12,0
C
4,3 4,5 4,7
C1 5,1 5,3 5,5
D 4,2
E 4,6 4,9 5,2
F 20,9 21,2 21,5
G 7,4 7,5 7,6
H
3,5 3,7 3,9
I
1,07 1,27 1,47
J 4,1
K 1,9
L 17,9 18,0 18,1
M 7,4 7,5 7,6
Hybrid SMD enclosure with four bent connection pins – Scale
Type CO 25 4:1
Sheet 1 Date: 2004-05
61837-4  IEC:2004 – 7 –
4.1
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A  14,4
B  9,5
C 5,1 5,3 5,5
C1 5,7 5,9 6,1
D 8,2 8,4 8,6
E 5,8 6,0 6,2
F
4,98 5,08 5,18
G 1,0
H 1,7 1,8 1,9
I 2,6
J 2,1
K 8,3 8,4 8,5
L
4,98 5,08 5,18
Hybrid SMD enclosure with four connection pads – Scale

Type CO 26 5:1
Sheet 2 Date: 2004-05
– 8 – 61837-4  IEC:2004
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A  14,4
B  9,5
C 5,1 5,3 5,5
C1 4,3 4,5 4,7
C2 5,7 5,9 6,1
D 6,2 6,4 6,6
E 0,9 1,0 1,1
F 4,98 5,08 5,18
G 8,6 8,7 8,8
H 4,98 5,08 5,18
I
2,5
J 1,3
Hybrid SMD enclosure with six connection pads – Scale
Type CO 27 5:1
Sheet 3 Date: 2004-05
61837-4  IEC:2004 – 9 –
Dimensions (mm)
Notes
Ref.
Min. Nom. Max.
A  25,6
B  22,2
C 11,1 11,3 11,5
C1 14,8 15,0 15,2
C2 6,8 7,0 7,2
D 7,52 7,62 7,72
E 17,7 17,8 17,9
F 2,4 2,5 2,6
G 2,4 2,5 2,6
H 23,4 23,5 23,6
I 4,0
J 3,0
K 7,52 7,62 7,72
L 17,7 17,8 17,9
Hybrid SMD enclosure with seven connection pads – Scale
Type CO 28 2:1
Sheet 4 Date: 2004-05
– 10 – 61837-4  IEC:2004
Dimensions (mm)
Ref. Notes
Min. Nom.
...