Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

General Information

Status
Published
Publication Date
29-Oct-2001
Current Stage
PPUB - Publication issued
Start Date
15-Dec-2001
Completion Date
30-Oct-2001
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IEC 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
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INTERNATIONAL IEC
STANDARD
60191-6-1
First edition
2001-10
Mechanical standardization of semiconductor
devices –
Part 6-1:
General rules for the preparation of outline
drawings of surface mounted semiconductor
device packages –
Design guide for gull-wing lead terminals
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6-1:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs pour
montage en surface –
Guide de conception pour les boîtiers à broches
en forme d'ailes de mouette
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
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edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
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INTERNATIONAL IEC
STANDARD
60191-6-1
First edition
2001-10
Mechanical standardization of semiconductor
devices –
Part 6-1:
General rules for the preparation of outline
drawings of surface mounted semiconductor
device packages –
Design guide for gull-wing lead terminals
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6-1:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs pour
montage en surface –
Guide de conception pour les boîtiers à broches
en forme d'ailes de mouette
 IEC 2001  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
G
International Electrotechnical Commission
For price, see current catalogue

– 2 – 60191-6-1  IEC:2001(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 6-1: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for gull-wing lead terminals
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-1 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of
...

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