IEC 60191-6-1:2001

INTERNATIONAL IEC
STANDARD
60191-6-1
First edition
2001-10
Mechanical standardization of semiconductor
devices –
Part 6-1:
General rules for the preparation of outline
drawings of surface mounted semiconductor
device packages –
Design guide for gull-wing lead terminals
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6-1:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs pour
montage en surface –
Guide de conception pour les boîtiers à broches
en forme d'ailes de mouette
Reference number
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INTERNATIONAL IEC
STANDARD
60191-6-1
First edition
2001-10
Mechanical standardization of semiconductor
devices –
Part 6-1:
General rules for the preparation of outline
drawings of surface mounted semiconductor
device packages –
Design guide for gull-wing lead terminals
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6-1:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs pour
montage en surface –
Guide de conception pour les boîtiers à broches
en forme d'ailes de mouette
 IEC 2001  Copyright - all rights reserved
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International Electrotechnical Commission
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– 2 – 60191-6-1  IEC:2001(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 6-1: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for gull-wing lead terminals
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-1 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of
...