IEC 61837-3:2015
(Main)Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition:
- The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition.
- The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number.
- The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc.
- In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3.
- If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet.
- The configurations of the enclosures were revised as shown in Table 1.
This publication is to be read in conjunction with IEC 61240:2012.
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 3: Enveloppes métalliques
L'IEC 61837-3:2015 est applicable aux enveloppes métalliques normalisées et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence; elle est fondée sur l'IEC 61240, qui a normalisé les règles de tracé des dessins d'encombrement des dispositifs à montage en surface. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- Le dessin d'encombrement est défini comme un ensemble de dessins composé de quatre vues, à savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, la vue de droite ayant été dessinée en option dans l'édition précédente.
- La hauteur du boîtier (G1) a été supprimée, la hauteur totale étant exprimée par la lettre-symbole G ou par un numéro en indice.
- Les dimensions de l'espacement entre les sorties sont présentées par la position centrale des sorties et sa valeur de base e est de 2,54 x n mm (n étant un entier) et 1,27 x n mm pour des dimensions de boîtier inférieures à 6 mm (voir l'IEC 61240:2012, 5.5). Si l'espacement entre les sorties n'est pas un multiple de la valeur de base, un numéro d'indice tel que e1, e2 est associé, par exemple e1, e2, etc. En présence de plusieurs valeurs d'espacement, le numéro en indice est suivi d'un trait d'union et de numéros tels que e1-1, e1-2 , etc.
- Dans les surfaces de contact des sorties, les longueurs de chaque plaquette de sortie sont désormais exprimées avec des valeurs maximales pour les besoins du client. Elles étaient exprimées en valeurs minimales dans l'édition précédente de l'IEC 61837-3.
- En présence de plusieurs enveloppes identiques de hauteur différente, chacune d'elles était exprimée par une barre oblique (/) et un numéro à deux chiffres placé après le nom de type de base. Les références d'identité sont données dans le tableau de la feuille.
- Les configurations des enveloppes ont été révisées comme indiqué au Tableau 1.
Cette publication doit être lue conjointement avec la CEI 61240:2012.
General Information
Relations
Overview
IEC 61837-3:2015 is an international standard published by the International Electrotechnical Commission (IEC) that specifies standard outlines and terminal lead connections for surface mounted piezoelectric devices (SMDs) used in frequency control and selection. This particular part (Part 3) focuses on metal enclosures for these devices, providing standardized configurations, dimensions, and designation schemes aligned with the general rules established in IEC 61240:2012.
Updating and refining the previous edition, IEC 61837-3:2015 introduces consistent technical changes to enhance the clarity, usability, and uniformity of metal enclosure designs for surface-mounted piezoelectric components. It aims to facilitate global interoperability, manufacturing efficiency, and clear communication between manufacturers, suppliers, and customers in the electronics industry.
Key Topics
Standard Outlines and Views
The 2015 edition clarifies the outline drawings by defining a complete set of four views for each metal enclosure: top, front, right, and bottom. Previously, the right view was optional, ensuring more comprehensive graphical representation for accurate component design and inspection.Package Height Representation
The outdated concept of separate "package height (G1)" has been eliminated. Now, total package height is expressed uniformly by the symbol "G" or with a subscript number for variations, simplifying dimensional references.Terminal Lead Spacing Dimensions
Terminal lead spacing is standardized with the basic value e = 2.54 × n mm (n ∈ integers), or 1.27 × n mm for packages smaller than 6 mm. When spacings do not match basic multiples, subscript indices (e.g., e₁, e₂) and hyphenated extensions (e₁-1, e₁-2) are used for precision.Terminal Pad Lengths
Terminal pad lengths on land areas are now expressed as maximum values, improving clarity and convenience for PCB designers and manufacturers relative to previous editions, where minimum values were given.Designation and Configurations
Metal enclosure types follow a descriptive four-part designator including configuration (SMS for surface-mounted special), terminal lead structure (e.g., L for folded leads), number of leads, and a serial number. Revised enclosure configurations and designation tables enhance classification and selection.Reference to IEC 61240:2012
The standard should be used in conjunction with IEC 61240:2012, which provides the foundational general rules for outline drawings and surface-mounted device layouts, ensuring harmonized technical application.
Applications
IEC 61837-3:2015 is essential for:
Manufacturers of piezoelectric frequency control devices
Ensures consistent enclosure dimensions and lead connections for metal-cased SMD piezoelectric components-critical for reliable production, testing, and quality control.Electronic component designers and engineers
Facilitates precise integration of piezoelectric SMDs into circuit layouts and systems by providing standardized footprint dimensions and terminal spacing details.PCB fabrication and assembly processes
Enables accurate pad design and soldering techniques that accommodate maximum pad lengths and standard lead spacing, improving component mounting reliability.Procurement and specification specialists
Provides clear type designations and configuration references for selecting compatible metal enclosure types within frequency control device portfolios.Global supply chain and compliance teams
Supports conformance with international standards, promoting interchangeability and reducing technical barriers in electronic component markets.
Related Standards
IEC 61240:2012 - Piezoelectric devices: Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection; general rules that underpin IEC 61837 series formatting.
IEC 61837 series - Includes parts covering outlines and terminal connections for other enclosure types beyond metal, creating a comprehensive framework for surface mounted frequency control devices.
ISO/IEC Directives - Guidance on drafting international standards ensuring consistency and clarity in documentation.
By aligning with these related standards, IEC 61837-3:2015 fits within a structured system that addresses both mechanical and electrical specifications for piezoelectric SMDs used across diverse industries.
Keywords: IEC 61837-3:2015, surface mounted piezoelectric devices, frequency control, standard outlines, terminal lead connections, metal enclosures, SMD, IEC 61240, electronic component standards, piezoelectric frequency selection devices, international electrotechnical standards.
Frequently Asked Questions
IEC 61837-3:2015 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures". This standard covers: IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition: - The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition. - The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number. - The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc. - In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3. - If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet. - The configurations of the enclosures were revised as shown in Table 1. This publication is to be read in conjunction with IEC 61240:2012.
IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition: - The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition. - The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number. - The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc. - In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3. - If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet. - The configurations of the enclosures were revised as shown in Table 1. This publication is to be read in conjunction with IEC 61240:2012.
IEC 61837-3:2015 is classified under the following ICS (International Classification for Standards) categories: 31.140 - Piezoelectric devices. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 61837-3:2015 has the following relationships with other standards: It is inter standard links to IEC 61837-3:2000. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
You can purchase IEC 61837-3:2015 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.
Standards Content (Sample)
IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 3: Enveloppes métalliques
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IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 3: Enveloppes métalliques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-2598-1
– 2 – IEC 61837-3:2015 IEC 2015
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Metal enclosure dimensions. 6
6 Lead connections . 6
7 Designation of metal enclosures . 6
Bibliography . 20
Table 1 – Revised configurations . 6
Table 2 – Designation of metal enclosures . 7
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –
Part 3: Metal enclosures
FOREWORD
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-3 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 2000. It constitutes a
technical revision.
This International Standard is to be read in conjunction with IEC 61240:2012.
This edition includes the following significant technical changes with respect to the previous
edition:
• The outline drawing is defined as one set of drawings consisting of four views, which are the
view from above, the front view, the view from the right, and the view from below; the view
from the right was drawn optionally in the previous edition.
– 4 – IEC 61837-3:2015 IEC 2015
• The height of package (G ) is eliminated, instead total height is expressed by the symbol
letter G or with a subscript number.
• The dimensions of terminal lead spacing are shown by the centre position of the terminal
leads and its basic value e is 2.54 × n mm (n is an integer) and 1,27 × n mm for package
dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not
a multiple of the basic value, a subscript number such as e , e is attached, e.g. e , e , etc.
1 2 1 2
If there are plural spacing values, the subscript number is followed by a hyphen and numbers
such as e , e , etc.
1-1 1-2
• In terminal land areas, the lengths of each terminal pad are now expressed with maximum
values for consumer’s convenience. They were expressed as minimum values in the
previous edition of IEC 61837-3.
• If there are plural identical enclosures with different height, each enclosure was expressed
by a dash (/) and a two-digit number after the basic type name. The identity references are
given in the table of the sheet.
• The configurations of the enclosures were revised as shown in Table 1.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1118/FDIS 49/1140/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –
Part 3: Metal enclosures
1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they
apply to SMDs for frequency control and selection in metal enclosures and is based on
IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240:2012, Piezoelectric devices – Preparation of outline drawings of surface mounted
devices (SMD) for frequency control and selection – General rules
3 Configuration of enclosures
The enclosures of the surface-mounted devices are made of metal with the formed lead
terminals based on the descriptive designation system for semiconductors – devices package.
All SMD enclosures described in this part of IEC 61837 are special surface mount types.
Therefore, the following designator is used.
– SMS (Surface-Mounted, Special)
4 Designation of types
The type designator consists of four parts as follows:
B C
A D
A: Configuration symbol of enclosures:
– SMS (Surface-Mounted, Special).
B: Structure of terminal leads
– L: folded leads type;
– J: folded leads type.
If there is a leadless type, it will have no mark.
See Clause 3 of IEC 61240:2012, Classification of SMD.
C: Number of terminal leads
– 6 – IEC 61837-3:2015 IEC 2015
D: 2-digit serial number
5 Metal enclosure dimensions
The dimensions given in this part of IEC 61837 apply to all completed SMD for frequency
control and selection. Only those dimensions are given which meet the requirements of
IEC 61240.
• If there are plural identical enclosures with different height (G), or different length (F), etc.
The symbol letter shall be expressed with a subscript number such as G , G , F , F etc.
1 2 1 2,
• The dimensions of terminal lead spacing shall be shown by the centre position of the
terminal leads and its basic value e is 2,54 × n mm (n is an integer) and 1,27 × n mm for
package dimensions smaller than 6 mm (see IEC 61240:2012, 5.5). If the terminal lead
spacing is not a multiple of the basic value, a subscript number such as e , e shall be
1 2
attached. If there are plural spacing values, the subscript number shall be followed by a
hyphen and numbers such as e , e , etc.
1-1 1-2
• If there are plural identical enclosures with different height, each enclosure was expressed
by the following dash (/) and two digit number after the basic type name. The identity
references are given in the table of the sheet.
6 Lead connections
Since SMS types of enclosures are special SMD type, they won’t have any specified lead
connections. However, lead connections shall always be given in the detail specification under
the agreement with customers.
7 Designation of metal enclosures
Table 2 sets out the designation of the metal enclosures as outlined in the following
specification sheets. All corresponding enclosures are listed in Table 1 below.
Table 1 – Revised configurations
Type Sheet No. Description
SMS-L4/01~03 Sheet 1 Maximum LP was changed from 1,2 to 1,4.
SMS-L4/04~07 Sheet 2 Maximum B was changed from 9,5 to 9,6.
Maximum LP was changed from 1,2 to 1,4.
SMS-J2/01~02 Sheet 12 Maximum B was changed from 4,7 to 5,0.
Minimum K was changed from 0,85 to 0,6.
Table 2 – Designation of metal enclosures
No. Type Sheet No. Description
1 SMS – L4/01
2 SMS – L4/02 Sheet 1 Metal, resistance-welded, four L-lead SMD outline
3 SMS – L4/03
4 SMS – L4/04
5 SMS – L4/05
Sheet 2 Metal, resistance-welded, four L-lead SMD outline
6 SMS – L4/06
7 SMS – L4/07
8 SMS – L3/01
9 SMS – L3/02 Sheet 3 Metal, resistance-welded, three L-lead SMD outline
10 SMS – L3/03
11 SMS – L3/04
Sheet 4 Metal, resistance-welded, three L-lead, SMD outline
12 SMS – L3/05
13 SMS – L3/06
14 SMS – L3/07 Sheet 5 Metal, resistance-welded, three L-lead, SMD outline
15 SMS – L3/08
16 SMS – L3/09
17 SMS – L3/10 Sheet 6 Metal, resistance-welded, three L-lead, SMD outline
18 SMS – L3/11
19 SMS – L3/12
20 SMS – L3/13 Sheet 7 Metal, resistance-welded, three L-lead SMD outline
21 SMS – L3/14
22 SMS – L3/15
23 SMS – L3/16
24 SMS – L3/17
Sheet 8 Metal, resistance-welded, three L-lead, SMD outline
25 SMS – L3/18
26 SMS – L3/19
27 SMS – L3/20
28 SMS – L3/21
29 SMS – L3/22
Sheet 9 Metal, resistance-welded, three L-lead SMD outline
30 SMS – L3/23
31 SMS – L3/24
32 SMS – L3/25
33 SMS – L3/26 Sheet 10 Metal, resistance-welded, three L-lead SMD outline
34 SMS – L3/27
35 SMS – J4/01 Sheet 11 Metal, resistance-welded, plastic frame, four J-lead SMD outline
36 SMS – J2/01
Sheet 12 Metal, resistance-welded, plastic frame, two J-lead SMD outline
37 SMS – J2/02
– 8 – IEC 61837-3:2015 IEC 2015
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /01
B2 ― ― 6,40 /02
B3 ― ― 8,80 /03
Actual size
F1 ― ― 9,50 /01
F2 ― ― 10,80 /02
F3 ― ― 12,75 /03
G ― ― 4,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,90 Note 2
LP1 0,70 ― 1,40
LP2 1,20 ― 1,80
e ― 1,88 ―
B
e1-1 ― 7,50 ― /01
e1-2 ― 8,80 ― /02
e1-3 ― 10,80 ― /03
b1 ― ― 0,80
b2 ― ― 2,40
l1 ― ― 2,30
l2 ― ― 2,10
y ― ― 0,20
A
s
e
e
y
s b
K3
Metal jacket
b
(see Note 1)
e
e
K1
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, four L-lead SMD
Scale
5:1
outline – Type SMS-L4/01 ~ 03
Sheet 1
L
LP1 P2
G
F
l1
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,05
B1 ― ― 9,60 /04
B2 ― ― 10,70 /05
B3 ― ― 11,40 /06
B4 ― ― 13,50 /07
F1 ― ― 14,30 /04
Actual size F2 ― ― 15,50 /05
F3 ― ― 16,20 /06
F4 ― ― 18,30 /07
G ― ― 5,30
K1 2,90 ― 3,10
K2 0,15 ― 0,30
K3 0,38 ― 1,10 Note 2
LP1 0,70 ― 1,40
LP2 1,00 ― 1,70
e ― 2,44 ―
e1-1 ― 11,80 ― /04
e1-2 ― 13,00 ― /05
e1-3 ― 13,70 ― /06
e1-4 ― 16,00 ― /07
b1 ― ― 5,00
b2 ― ― 1,40
l1 ― ― 1,80
A
l2 ― ― 3,00
y ― ― 0,20
s
y s
e e
K
b
b
Metal jacket
(see Note1)
e e
K
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, four L-lead SMD
Scale
3:1
outline – Type SMS-L4/04 ~ 07
Sheet 2
L
P2 G B
L
P1
F
l
l2 1
K
e
– 10 – IEC 61837-3:2015 IEC 2015
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /01
B2 ― ― 6,40 /02
Actual size
B3 ― ― 8,80 /03
F1 ― ― 9,50 /01
F2 ― ― 10,80 /02
F3 ― ― 12,75 /03
G ― ― 4,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,90 Note 2
LP1 0,70 ― 1,20
LP2 1,20 ― 1,80
e ― 3,75 ―
e1-1 ― 7,50 ― /01
e1-2 ― 8,80 ― /02
e1-3 ― 10,80 ― /03
b1 ― ― 0,80
b2 ― ― 2,40
l1 ― ― 2,30
l2 ― ― 2,10
A
y ― ― 0,20
s
s
y
b
e
K
Metal jacket
b
(See Note 1)
e
Terminal land areas
K
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/01 ~ 03
Sheet 3
B
G
L L
P1 P2
F
l
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 6,00 /04
B2 ― ― 8,00 /05
F1 ― ― 8,20 /04
F2 ― ― 10,20 /05
G ― ― 3,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,50 Note 2
LP1 0,70 ― 1,20
LP2 1,00 ― 1,30
e 3,50 3,75 4,00
e1-1 ― 6,80 ― /04
e1-2 ― 8,80 ― /05
b1 ― ― 0,80
b2 ― ― 2,60
l1 ― ― 2,10
l2 ― ― 1,70
y ― ― 0,20
A
s
y
s
e
b
K
Metal jacket
(See Note 1)
b
e
K
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/04 ~ 05
Sheet 4
G
B
L L
P1 P2
F
l
l
K
e
– 12 – IEC 61837-3:2015 IEC 2015
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /06
B2 ― ― 6,00 /07
B3 ― ― 8,00 /08
Actual size
F1 ― ― 6,20 /06
F2 ― ― 8,00 /07
F3 ― ― 10,00 /08
G ― ― 4,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,50 Note 2
LP1 0,70 ― 1,20
LP2 0,80 ― 1,60
e 5,30 5,60 5,90
e1-1 ― 5,00 ― /06
e1-2 ― 5,90 ― /07
e1-3 ― 7,90 ― /08
b1 ― ― 2,60
b2 ― ― 0,80
l1 ― ― 1,70
l2 ― ― 2,10
A
y ― ― 0,20
s
s
y
e b
L
P2
Metal jacket
l
(see Note 1) 1
e
K
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/06 ~ 08
Sheet 5
G
B
L
P1 K
F
b
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /09
B2 ― ― 6,00 /10
B3 ― ― 8,00 /11
F1 ― ― 7,70 /09
F2 ― ― 8,00 /10
Actual size
F3 ― ― 10,00 /11
G ― ― 3,00
K1 1,75 ― 2,25
K2 0,15 ― 0,30
K3 0,30 ― 0,50 Note 2
LP1 0,70 ― 1,20
LP2 0,80 ― 1,60
e 5,30 5,60 5,90
e1-1 ― 5,00 ― /09
e1-2 ― 5,90 ― /10
e1-3 ― 7,90 ― /11
b1 ― ― 2,60
b2 ― ― 0,80
l1 ― ― 1,70
l2 ― ― 2,10
y ― ― 0,20
A
s
y
s
e
L
P2
b
Metal jacket
l
(see Note 1)
K
e
Terminal land areas
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD
Scale
5:1
outline – Type SMS-L3/09 ~ 11
Sheet 6
G
B
K
L
P1
F
b
l1
K
e
– 14 – IEC 61837-3:2015 IEC 2015
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,05
B1 ― ― 10,70 /12
B2 ― ― 11,40 /13
B3 ― ― 13,50 /14
F1 ― ― 15,50 /12
Actual size
F2 ― ― 16,20 /13
F3 ― ― 18,30 /14
G ― ― 5,30
K1 2,90 3,10
K2 0,15 ― 0,30
K3 0,40 ― 1,10 Note 2
LP1 0,70 ― 1,20
LP2 1,10 ― 1,70
e 4,88
e1-1 ― 13,00 ― /12
e1-2 ― 13,70 ― /13
e1-3 ― 16,00 ― /14
b1 ― ― 3,40
b2 ― ― 1,40
l1 ― ― 1,60
l2 ― ― 2,10
y ― ― 0,20
A
s
y s
e
K
b
b
Metal jacket
(see Note 1)
e
Terminal land areas
K
IEC
NOTE 1 The configuration of the metal jacket is given as an example.
NOTE 2 This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD
Scale
3:1
outline – Type SMS-L3/12 ~ 14
Sheet 7
L G
P2
L
P1 B
F
l l
2 1
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,05
B1 ― ― 5,10 /15
B2 ― ― 6,60 /16
B3 ― ― 9,70 /17
B4 ― ― 10,70 /18
B5 ― ― 11,40 /19
Actual size
B6 ― ― 13,50 /20
F1 7,15 ― 7,85 /15
F2 8,65 ― 9,35 /16
F3 10,95 ― 11,65 /17
F4 12,75 ― 13,45 /18
F5 13,45 ― 14,15 /19
F6 15,55 ― 16,25 /20
G ― ― 5,30
K1 1,50 ― 2,00
K2 0,40 ― 0,48
K3 0,40 ― 0,48 Note
LP1 0,40 ― 0,48
LP2 1,50 ― 2,10
e 4,67 4,90 5,08
e1-1 ― 7,05 ― /15
e1-2 ― 8,55 ― /16
e1-3 ― 11,65 ― /17
e1-4 ― 12,65 ― /18
e1-5 ― 13,35 ― /19
e1-6 ― 15,45 ― /20
b1 ― ― 0,70
A b2 ― ― 2,20
l1 ― ― 1,80
l2 ― ― 0,70
y ― ― 0,20
s
y s
e
b
L
P2
l
e
K
Terminal land areas
IEC
NOTE This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD outline – Scale
Type SMS-L3/15 ~ 20 3:1
Sheet 8
B
L
P1 K3
G
F
b
l
K
e
– 16 – IEC 61837-3:2015 IEC 2015
(Voir Note 1)
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /21
B2 ― ― 6,00 /22
B3 ― ― 8,00 /23
B4 ― ― 8,80 /24
Actual size
F1 6,40 ― 7,00 /21
F2 7,30 ― 7,90 /22
F3 9,30 ― 9,90 /23
F4 10,10 ― 10,70 /24
G ― ― 3,80
K1 1,40 ― 1,60
K2 0,40 ― 0,50
K3 0,40 ― 0,50 Note
LP1 0,40 ― 0,50
LP2 1,20 ― 1,60
e 5,00 5,15 5,30
e1-1 ― 6,30 ― /21
e1-2 ― 7,20 ― /22
e1-3 ― 9,20 ― /23
e1-4 ― 10,00 ― /24
b1 ― ― 1,80
b2 ― ― 0,70
l1 ― ― 0,70
A
l2 ― ― 1,80
y ― ― 0,20
s
e
y s
L
P2
b
l
K
e
Terminal land areas
IEC
NOTE This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD outline – Scale
Type SMS-L3/21 ~ 24 5:1
Sheet 9
G B
L K
P1 3
F
b
l
K
e
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 8,26
B1 ― ― 5,10 /25
B2 ― ― 6,00 /26
B3 ― ― 8,00 /27
Actual size
F1 ― ― 7,20 /25
F2 ― ― 8,10 /26
F3 ― ― 10,10 /27
G ― ― 2,60
K1 1,25 ― 1,35
K2 0,20 ― 0,30
K3 0,30 ― 0,40 Note
LP1 0,20 ― 0,30
LP2 1,20 ― 1,60
e 5,00 5,15 5,30
e1-1 ― 6,90 ― /25
e1-2 ― 7,80 ― /26
e1-3 ― 9,80 ― /27
b1 ― ― 1,80
b2 ― ― 0,70
l1 ― ― 0,70
l2 ― ― 1,80
y ― ― 0,20
A
s
y s
e
b
L
P2
l
e
K
Terminal land areas
IEC
NOTE This portion of the lead may be re-shaped under pressure.
Metal, resistance-welded, three L-lead SMD outline – Scale
Type SMS-L3/25 ~ 27 5:1
Sheet 10
B
L K
P1 3
G
F
b2
l
K
e1
– 18 – IEC 61837-3:2015 IEC 2015
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 12,00
B ― ― 5,20
F ― ― 5,50
G ― ― 8,20
Actual size
K 0,70 ― 1,40
L 1,00 ― 1,40
B
e ― 4,90 ―
e ― 4,00 ―
b ― ― 2,00
l ― ― 2,00
A
y ― ― 0,15
s
y s
b
e
K
e
Terminal land areas
IEC
Metal, resistance-welded, plastic frame, four J-lead SMD Scale
outline – Type SMS-J4/01 3:1
Sheet 11
L G
B
B
e
F
e
l
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A ― ― 11,60
B ― ― 5,00
G ― ― 3,50 /01
Actual size 1
G ― ― 5,00 /02
K1 0,6 ― 1,15
F 11,80 ― 13,50
L 3,30 ― 3,90
B
e ― 8,80 ―
b ― ― 1,35
l ― ― 3,90
y ― ― 0,15
A
F
s
y s
e
l
L
B
e
Terminal land areas
IEC
Metal, resistance-welded, plastic frame, two J-lead
Scale
SMD outline – Type SMS-J2/01 ~ 02
3:1
Sheet 12
K
G
B
b
– 20 – IEC 61837-3:2015 IEC 2015
Bibliography
IEC 60122-2:1983, Quartz crystal units for frequency control and selection – Part 2: Guide to
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記事のタイトル： IEC 61837-3:2015 - 周波数制御および選択のための表面実装圧電デバイス - 標準の輪郭と端子の接続 - 第3部：金属筐体 記事の内容：IEC 61837-3:2015は、金属筐体で使用される周波数制御および選択のための表面実装圧電デバイス（SMD）に適用される標準の輪郭と端子の接続について取り扱っており、これは表面実装デバイスのレイアウト規則を定めたIEC 61240に基づいています。この版では以下の重要な技術的変更が前版と比較して含まれています： - 輪郭図は、上から見た図、正面図、右から見た図、下から見た図の４つの視点からなる１セットの図面と定義されており、前版では右から見た図がオプションで描かれていました。 - パッケージの高さ（G1）は廃止され、代わりに合計高さは記号のGまたは下付き数字で表されます。 - 端子の間隔の寸法は、端子の中心位置を示し、基本値eは2.54 x n mm（nは整数）および6 mm未満のパッケージ寸法の場合は1.27 x n mmで示されます（参照：IEC 61240:2012、5.5）。端子の間隔が基本値の倍数でない場合、e1、e2などの下付き数字が付けられます。複数の間隔値がある場合、下付き数字の後にハイフンと数字が続き、e1-1、e1-2などの形式で表示されます。 - 端子ランドエリアでは、各端子パッドの長さが最大値で表示されるようになりました。前版では最小値で表されていました。 - 異なる高さを持つ同一の筐体が複数ある場合、各筐体は基本タイプ名の後にダッシュと2桁の数字を付けて示されます。識別参照は、シートの表に記載されています。 - 筐体の配置は、表1に示すように改訂されました。 本文書は、IEC 61240:2012と併せて参照する必要があります。
The article discusses the standards and guidelines outlined in IEC 61837-3:2015 for surface mounted piezoelectric devices (SMDs) used for frequency control and selection in metal enclosures. The standard is based on IEC 61240, which provides layout rules for outline drawings of SMDs. Some of the significant changes in this edition include the inclusion of a view from the right in the outline drawing, the elimination of the height of the package, the expression of terminal lead spacing by the center position of the leads, the expression of terminal pad lengths as maximum values, the identification of different enclosures with a dash and a two-digit number, and the revised configurations of the enclosures. It is recommended to read this publication alongside IEC 61240:2012.
기사 제목: IEC 61837-3:2015 - 주파수 제어 및 선택을 위한 표면 부착 피에조전 기기 - 표준 윤곽과 단자 연결 - 제 3부: 금속 케이스 기사 내용: IEC 61837-3:2015는 금속 케이스에서의 주파수 제어 및 선택을 위한 표면 부착 피에조전 기기(SMD)에 적용되는 표준 윤곽과 단자 연결에 대해 다루며, 이는 표준화된 레이아웃 규칙을 제시한 IEC 61240에 기반합니다. 이번 판은 이전 판과 비교하여 다음과 같은 중요한 기술적 변경 사항을 포함하고 있습니다: - 외형 도면은 위쪽에서 본 도면, 전면 도면, 오른쪽에서 본 도면, 아래에서 본 도면으로 구성된 한 세트의 도면으로 정의되며, 이전 판에서는 오른쪽에서 본 도면이 선택적으로 그려졌습니다. - 패키지의 높이(G1)는 제거되었으며, 대신 총 높이는 기호 문자 G 또는 첨자 숫자로 표현됩니다. - 단자 연결 간격의 치수는 단자 연결의 중심 위치로 나타내며, 기본 값 e는 2.54 x n mm (n은 정수)이며, 패키지 크기가 6 mm보다 작을 경우 1.27 x n mm입니다 (참조: IEC 61240:2012, 5.5). 단자 연결 간격이 기본 값의 배수가 아닌 경우, e1, e2와 같이 첨자 숫자가 붙습니다. 여러 간격 값이 있는 경우, 첨자 숫자 다음에 하이픈과 숫자가 오는 형식(e1-1, e1-2 등)으로 표시됩니다. - 단자 패드 영역에서는 각 단자 패드의 길이가 이제 소비자의 편의를 위해 최대값으로 표시됩니다. 이전 판의 경우 최소값으로 표시되었습니다. - 다른 높이를 가진 동일한 케이스가 있는 경우, 각 케이스는 기본 유형 이름 뒤에 대시(/)와 두 자리 숫자로 표시됩니다. 식별 참조는 시트의 표에서 제공됩니다. - 케이스의 구성은 표 1에 나와 있는 대로 수정되었습니다. 이 출판물은 IEC 61240:2012와 함께 읽어야 합니다.
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