Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures

IEC 61837-3:2015 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. This edition includes the following significant technical changes with respect to the previous edition:
- The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition.
- The height of package (G1) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number.
- The dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 x n mm (n is an integer) and 1,27 x n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e1-1, e1-2 , etc.
- In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumer's convenience. They were expressed as minimum values in the previous edition of IEC 61837-3.
- If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet.
- The configurations of the enclosures were revised as shown in Table 1.
This publication is to be read in conjunction with IEC 61240:2012.

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 3: Enveloppes métalliques

L'IEC 61837-3:2015 est applicable aux enveloppes métalliques normalisées et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence; elle est fondée sur l'IEC 61240, qui a normalisé les règles de tracé des dessins d'encombrement des dispositifs à montage en surface. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- Le dessin d'encombrement est défini comme un ensemble de dessins composé de quatre vues, à savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, la vue de droite ayant été dessinée en option dans l'édition précédente.
- La hauteur du boîtier (G1) a été supprimée, la hauteur totale étant exprimée par la lettre-symbole G ou par un numéro en indice.
- Les dimensions de l'espacement entre les sorties sont présentées par la position centrale des sorties et sa valeur de base e est de 2,54 x n mm (n étant un entier) et 1,27 x n mm pour des dimensions de boîtier inférieures à 6 mm (voir l'IEC 61240:2012, 5.5). Si l'espacement entre les sorties n'est pas un multiple de la valeur de base, un numéro d'indice tel que e1, e2 est associé, par exemple e1, e2, etc. En présence de plusieurs valeurs d'espacement, le numéro en indice est suivi d'un trait d'union et de numéros tels que e1-1, e1-2 , etc.
- Dans les surfaces de contact des sorties, les longueurs de chaque plaquette de sortie sont désormais exprimées avec des valeurs maximales pour les besoins du client. Elles étaient exprimées en valeurs minimales dans l'édition précédente de l'IEC 61837-3.
- En présence de plusieurs enveloppes identiques de hauteur différente, chacune d'elles était exprimée par une barre oblique (/) et un numéro à deux chiffres placé après le nom de type de base. Les références d'identité sont données dans le tableau de la feuille.
- Les configurations des enveloppes ont été révisées comme indiqué au Tableau 1.
Cette publication doit être lue conjointement avec la CEI 61240:2012.

General Information

Status
Published
Publication Date
14-Apr-2015
Current Stage
PPUB - Publication issued
Start Date
30-Apr-2015
Completion Date
15-Apr-2015
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IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 3: Enveloppes métalliques

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IEC 61837-3 ®
Edition 2.0 2015-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 3: Metal enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 3: Enveloppes métalliques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-2598-1

– 2 – IEC 61837-3:2015  IEC 2015
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Metal enclosure dimensions. 6
6 Lead connections . 6
7 Designation of metal enclosures . 6
Bibliography . 20

Table 1 – Revised configurations . 6
Table 2 – Designation of metal enclosures . 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC
DEVICES FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 3: Metal enclosures
FOREWORD
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-3 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 2000. It constitutes a
technical revision.
This International Standard is to be read in conjunction with IEC 61240:2012.
This edition includes the following significant technical changes with respect to the previous
edition:
• The outline drawing is defined as one set of drawings consisting of four views, which are the
view from above, the front view, the view from the right, and the view from below; the view
from the right was drawn optionally in the previous edition.

– 4 – IEC 61837-3:2015  IEC 2015
• The height of package (G ) is eliminated, instead total height is expressed by the symbol
letter G or with a subscript number.
• The dimensions of terminal lead spacing are shown by the centre position of the terminal
leads and its basic value e is 2.54 × n mm (n is an integer) and 1,27 × n mm for package
dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not
a multiple of the basic value, a subscript number such as e , e is attached, e.g. e , e , etc.

1 2 1 2
If there are plural spacing values, the subscript number is followed by a hyphen and numbers
such as e , e , etc.
1-1 1-2
• In terminal land areas, the lengths of each terminal pad are now expressed with maximum
values for consumer’s convenience. They were expressed as minimum values in the
previous edition of IEC 61837-3.
• If there are plural identical enclosures with different height, each enclosure was expressed
by a dash (/) and a two-digit number after the basic type name. The identity references are
given in the table of the sheet.
• The configurations of the enclosures were revised as shown in Table 1.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1118/FDIS 49/1140/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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...

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