IEC PAS 60512-27-200:2018

IEC PAS 60512-27-200 ®
Edition 1.0 2018-10
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
colour
inside
Connectors for electrical and electronic equipment – Tests and measurements –
Part 27-200: Additional specifications for signal integrity tests up to 2 000 MHz on
IEC 60603-7 series connectors – Tests 27a to 27g

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IEC PAS 60512-27-200 ®
Edition 1.0 2018-10
PUBLICLY AVAILABLE
SPECIFICATION
PRE-STANDARD
colour
inside
Connectors for electrical and electronic equipment – Tests and measurements –

Part 27-200: Additional specifications for signal integrity tests up to 2 000 MHz on

IEC 60603-7 series connectors – Tests 27a to 27g

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.220.10 ISBN 978-2-8322-6093-7

– 2 – IEC PAS 60512-27-200:2018 © IEC 2018
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 12
4 Overall test arrangement . 12
4.1 General . 12
4.2 Indirect-reference test fixtures . 12
Annex A (normative) Indirect-reference test fixtures . 13
A.1 General . 13
A.2 Requirements . 13
Annex B (normative) Measurement requirements (general) . 14
B.1 General test configuration . 14
B.2 Termination of a cable DUT to test system . 14
B.2.1 General . 14
B.2.2 Interconnections between the device under test (DUT) and the
calibration plane . 15
B.2.3 Test lead return loss requirements . 15
B.2.4 Ground plane requirements . 18
B.2.5 Network analyzer requirements . 18
B.3 Measurement points and spacing . 18
B.4 Impedance matching terminations . 19
B.4.1 General . 19
B.4.2 Resistor terminations . 19
B.4.3 Termination return loss performance at the calibration plane . 20
B.4.4 Termination TCL performance at the calibration plane . 20
B.4.5 Calibration methods . 20
B.4.6 Two-port calibration of the test system . 21
B.4.7 One-port calibration of the test system . 21
B.5 General calibration plane . 21
B.5.1 General . 21
B.5.2 Calibration references . 22
B.5.3 50 Ω and 100 Ω calibration reference load requirements . 22
B.5.4 Calibration reference load return loss requirement . 23
B.5.5 Typical test equipment performance parameters . 23
Annex C (normative) Cabling and component test procedures using baluns . 24
C.1 Measurement test setup and apparatus. 24
C.1.1 General . 24
C.1.2 Balun terminations . 24
C.1.3 Balun requirements. 24
C.2 Testing of cabling . 26
C.2.1 Cabling DC resistance . 26
C.2.2 Return loss testing of cables and channels . 27
C.2.3 Insertion loss of cables and channels . 29
C.2.4 NEXT loss of cables and channels . 30
C.2.5 FEXT loss of cables and channels . 32
C.2.6 Cable and channel propagation delay . 34

C.2.7 TCL of cables and channels . 34
C.2.8 TCTL of cables and channels . 38
C.2.9 Cable and channel measurement precautions . 40
C.2.10 Screened or shielded cable and channel measurement configurations . 40
C.3 Permanent link test procedures . 40
C.3.1 General . 40
C.3.2 Permanent link measurement configurations . 40
C.3.3 Calibration of permanent link test configurations. . 41
C.3.4 Return loss of permanent links . 41
C.3.5 Insertion loss of permanent link . 42
C.3.6 NEXT loss of permanent link . 42
C.3.7 FEXT loss of permanent link . 43
C.3.8 TCL of permanent link . 44
C.3.9 TCTL of permanent link . 45
C.3.10 Propagation delay of permanent link . 46
C.4 Direct attach measurement procedures . 47
C.4.1 Direct attach test configurations. 47
C.5 Modular cord test procedures . 50
C.5.1 Network analyzer test configuration . 50
C.5.2 Test fixturing for modular cords . 52
C.5.3 Modular cord measurements. . 52
C.6 Connecting hardware testing . 52
C.6.1 General . 52
C.6.2 Connecting hardware measurement configurations . 52
C.6.3 Return loss measurements . 53
C.6.4 Insertion loss measurements . 53
C.6.5 NEXT loss measurements . 54
C.6.6 Test plug characterization . 56
C.6.7 Category 6A measurement reproducibility . 72
C.7 Modular cord test head requirements . 74
C.7.1 General . 74
C.7.2 Modular cord test head NEXT loss . 74
C.7.3 Modular cord test head FEXT loss . 74
C.7.4 Modular cord test head return loss . 75
C.8 Alien crosstalk measurements . 75
C.8.1 Cabling ANEXT loss and AFEXT loss laboratory measurement
procedures . 75
C.8.2 ANEXT loss and AFEXT loss of cable . 77
C.8.3 Connecting Hardware ANEXT loss and AFEXT loss measurements . 79
Annex D (normative) Cabling and component balunless test procedures . 83
D.1 Balunless measurement requirements . 83
D.2 Resistor terminations used with balunless measurement systems . 83
D.3 Calibration methods . 84
D.4 Testing of cables and cabling . 84
D.4.1 Cabling and cable measurement procedures . 84
D.4.2 Cabling and cable DC resistance . 85
D.4.3 Cabling and cable return loss . 85
D.4.4 Insertion loss of cables and channels . 86
D.4.5 NEXT loss of cables and channels . 87

– 4 – IEC PAS 60512-27-200:2018 © IEC 2018
D.4.6 FEXT loss of cables and channels . 87
D.4.7 TCL of cabling and cables . 88
D.4.8 TCTL of cabling and cables . 88
D.4.9 Propagation delay of cabling and cable. 89
D.5 Permanent link test procedures . 89
D.5.1 General . 89
D.5.2 Permanent link measurement configurations . 89
D.5.3 Calibration of permanent link test configurations. . 89
D.5.4 Return loss of permanent links . 89
D.5.5 Insertion loss of permanent link . 90
D.5.6 NEXT loss of permanent link . 91
D.5.7 FEXT loss of permanent link . 92
D.5.8 TCL of permanent link . 93
D.5.9 TCTL of permanent link . 93
D.5.10 Propagation delay of permanent link . 94
D.6 Balunless direct attach measurement procedures . 94
D.7 Balunless modular cord test procedures – Balunless network analyzer test

configuration . 98
D.8 Connecting hardware test procedures . 100
D.8.1 General . 100
D.8.2 Connecting hardware measurement configurations . 100
D.9 Balunless alien crosstalk for cabling, cable and connecting hardware. . 101
D.9.1 Balunless ANEXT loss and AFEXT loss laboratory measurement

procedures . 101
D.9.2 Balunless connecting hardware ANEXT loss and AFEXT loss
procedures . 101
Annex E (informative) Connecting hardware test fixtures . 104
E.1 General . 104
E.2 Additional components for connection to a network analyzer . 105
E.3 Direct fixture . 106
E.4 PCB based test plug assembly . 106
E.5 Connecting hardware measurement configuration . 107
E.6 Test fixture calibration . 108
E.6.1 General . 108
E.6.2 Calibration and reference plane location . 112
E.7 DUT connections using header PCB assemblies . 113
Bibliography . 114

Figure B.1 – Example 360° shielded cable termination . 16
Figure B 2 – Example individually shielded pair cable termination . 17
Figure B.3 – Test fixture interface pattern . 17
Figure B.4 – Example pin and socket dimension . 18
Figure B.5 – Resistor termination networks for balun testing . 19
Figure B.6 – Balunless resistor termination network . 20
Figure B.7 – Calibration plane . 21
Figure C.1 – Measurement configurations for test balun qualification . 26
Figure C.2 – Balun schematic diagram . 27
Figure C.3 – Laboratory test configuration for return loss . 28

Figure C.4 – Laboratory test configuration for insertion loss and propagation delay
measurements . 29
Figure C.5 – Laboratory test configuration for cable and channel NEXT loss . 31
Figure C.6 – Laboratory test configuration for FEXT loss . 33
Figure C.7 – Laboratory test configuration for TCL . 35
Figure C.8 – Coaxial lead through calibration . 36
Figure C.9 – Back-to-back balun insertion loss measurement . 36
Figure C.10 – Output terminal connection . 37
Figure C.11 – Outer shield grounding position . 37
Figure C.12 – Laboratory test configuration for TCTL . 39
Figure C.13 – Laboratory test configuration for permanent link return loss and TCL

measurements . 41
Figure C.14 – Laboratory test configuration for permanent link insertion loss and
propagation delay measurements . 42
Figure C.15 – Laboratory test configuration for permanent link NEXT loss
measurements . 43
Figure C.16 – Laboratory test configuration for permanent link FEXT loss (ACRF) . 44
Figure C.17 – Laboratory test configuration for permanent link TCL measurements . 45
Figure C.18 – Laboratory test configuration for permanent link TCTL . 46
Figure C.19 – Direct attach return loss test configuration . 47
Figure C.20 – Direct attach cord insertion loss test configuration . 48
Figure C.21 – Direct attach cord NEXT loss test configuration . 48
Figure C.22 – Direct attach cord FEXT loss, (ACRF) test configuration . 49
Figure C.23 – Direct attach cord TCL test configuration . 49
Figure C.24 – Direct attach cord TCTL test configuration . 50
Figure C.25 – Modular cord return loss test configuration . 51
Figure C.26 – Modular cord NEXT loss test configuration . 51
Figure C.27 – Modular cord FEXT loss, (ACRF) test configuration . 52
Figure C.28 – Female test connector interface mating dimensions (1) . 58
Figure C.29 – Female test connector interface mating dimensions (2) . 59
Figure C.30 – Balun fixture PCB paddle card interface mating dimensions . 60
Figure C.31 – Balunless fixture PCB paddle card interface mating dimensions . 60
Figure C.32 – Example of a measurement setup for test plug NEXT loss . 64
Figure C.33 – Example of a measurement setup for test plug FEXT loss . 65
Figure C.34 – Direct fixture mating dimensions, top view . 67
Figure C.35 – Direct fixture mating dimensions, front view . 68
Figure C.36 – Direct fixture mating dimensions, side view . 68
Figure C.37 – Modular plug placed into the plug clamp . 69
Figure C.38 – Guiding the plug into position. 69
Figure C.39 – Calibration planes, test plug phase reference plane, and port extensions . 70
Figure C.40 – Examples of direct fixture short, open, load, and through artefacts . 72
Figure C.41 – Inter-laboratory return loss variability for testing category 6A connecting
hardware . 74
Figure C.42 – 6-around-1 cable test configuration . 78
Figure C.43 – Connecting hardware ANEXT loss measurement setup . 80

– 6 – IEC PAS 60512-27-200:2018 © IEC 2018
Figure C.44 – Connecting hardware AFEXT loss measurement setup . 81
Figure C.45 – Example connector configurations for alien crosstalk . 82
Figure D.1 – Balunless resistor termination network . 84
Figure D.2 – Laboratory test configuration for cabling and cable return loss and TCL
measurements . 85
Figure D.3 – Laboratory test configuration for cabling and cable insertion loss, TCTL,
and propagation delay measurements –  Alternate test configuration for return loss
and TCL. . 86
Figure D.4 – Laboratory test configuration for cabling and cable NEXT loss . 87
Figure D.5 – Laboratory test configuration for cabling and cable FEXT loss (ACRF) . 88
Figure D.6 – Laboratory test configuration for permanent link return loss and TCL
measurements . 90
Figure D.7 – Laboratory test configuration for permanent link insertion loss, TCTL, and

propagation delay measurements – Alternate test configuration for return loss and TCL . 91
Figure D.8 – Laboratory test configuration for permanent link NEXT loss
measurements . 92
Figure D.9 – Laboratory test configuration for permanent link FEXT loss (ACRF) . 93
Figure D.10 – Balunless direct attach cord return loss test configuration . 95
Figure D.11 – Balunless direct attach insertion loss, TCTL, and propagation delay test
configuration – Alternate test configuration for return loss and TCL . 96
Figure D.12 – Balunless direct attach cord NEXT loss test configuration . 97
Figure D.13 – Balunless direct attach cord FEXT loss, (ACRF) test configuration . 98
Figure D.14 – Balunless modular cord NEXT loss test configuration . 99
Figure D.15 – Balunless modular cord return loss test configuration . 100
Figure D.16 – Connecting hardware ANEXT loss measurement setup . 102
Figure D.17 – Connecting hardware AFEXT loss measurement setup . 103
Figure E.1 – Test head assembly with baluns attached . 104
Figure E.2 – Test head assembly showing shielding between interconnecting sockets . 105
Figure E.3 – Plug direct fixture . 106
Figure E.4 – PCB based plug . 107
Figure E.5 – PCB based plug assembly with adapter . 107
Figure E.6 – An example of a connecting hardware measurement configuration . 108
Figure E.7 – Test fixture interface . 109
Figure E.8 – Open calibration standard applied to balunless test interface . 109
Figure E.9 – Short calibration standard applied to balunless test interface . 110
Figure E.10 – Load calibration standard applied to test interface . 110
Figure E.11 – A loop back through standard applied to a balunless test interface . 111
Figure E.12 – Test plug attached to the test interface . 111
Figure E.13 – Direct fixture mounted to the test head interface . 112
Figure E.14 – Calibration reference plane . 112
Figure E.15 – Back-to-back through calibration . 113

Table A.1 – IEC 60603-7 series, 8-way connector types detail specifications and

respective detail connector test procedures standards . 13
Table B.1 – Interconnection return loss . 16
Table B.2 – Minimum number of measurement points . 19

Table B.3 – Calibration reference load return loss requirement . 23
Table C.1 – Test balun performance characteristics . 25
Table C.2 – Category 6, 6A and 8 test plug NEXT loss limit vectors . 55
Table C.3 – Category 5e test plug NEXT loss limit vectors . 55
Table C.4 – Category 6, 6A and 8 connecting hardware NEXT loss requirements for
case 1 and case 4 . 56
Table C.5 – Category 5e, 6, and 6A test plug NEXT loss ranges . 62
Table C.6 – Category 8 test plug NEXT loss ranges . 63
Table C.7 – Test plug FEXT loss ranges . 64
Table C.8 – Category 5e, 6 and 6A test plug return loss requirements . 66
Table C.9 – Category 8 test plug return loss requirements . 66
Table C.10 – Direct fixture performance . 68
Table C 11 – Category 6A NEXT loss measurement reproducibility between

laboratories . 73
Table C.12 – Category 6A FEXT loss measurement reproducibility between
laboratories . 73
Table C.13 – Category 5e, 6, and 6A modular cord test head return loss . 75
Table C.14 – Category 8 modular cord test head return loss . 75

– 8 – IEC PAS 60512-27-200:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT –
TESTS AND MEASUREMENTS –
Part 27-200: Additional specifications for signal integrity tests up to
2 000 MHz on IEC 60603-7 series connectors – Tests 27a to 27g

FOREWORD
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A PAS is a technical specification not fulfilling the requirements for a standard, but made
available to the public.
IEC PAS 60512-27-200 has been processed by subcommittee 48B: Electrical connectors, of
IEC technical committee 48: Electrical connectors and mechanical structures for electrical and
electronic equipment.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document
Draft PAS Report on voting
48B/2652/DPAS 48B/2673/RVDPAS
Following publication of this PAS, which is a pre-standard publication, the technical committee
or subcommittee concerned may transform it into an International Standard.
A list of all parts of IEC 60512 series, under the general title Connectors for electrical and
electronic equipment – Tests and measurements can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
This PAS shall remain valid for an initial maximum period of 3 years starting from the
publication date. The validity may be extended for a single period up to a maximum of
3 years, at the end of which it shall be published as another type of normative document, or
shall be withdrawn.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 10 – IEC PAS 60512-27-200:2018 © IEC 2018
CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT –
TESTS AND MEASUREMENTS –
Part 27-200: Additional specifications for signal integrity tests up to
2 000 MHz on IEC 60603-7 series connectors – Tests 27a to 27g

1 Scope
This part of IEC 60512 covers additional, supplemental specifications for signal integrity and
transmission performance test methods of IEC 60512-27-100, for connectors using de-
embedded crosstalk measurements, which are specified in respective parts of IEC 60603-7
standards for connecting hardware applications up to 2 000 MHz.
These additional specifications are also applicable for testing the related lower frequency
connectors. However, the test methodology specified in the detail specification for any given
connector remains the reference conformance test for that connector.
Test procedures of IEC 60512-27-100 affected by these supplemental methods and
procedures are:
• insertion loss, test 27a;
• return loss, test 27b;
• near-end crosstalk (NEXT) test 27c;
• far-end crosstalk (FEXT), test 27d;
• transverse conversion loss (TCL), test 27f;
• transverse conversion transfer loss (TCTL), test 27g.
Other test procedures referenced here are:
• transfer impedance (Z ), see test procedures in IEC 62153-4-6 or IEC 62153-4-7.
T
• for coupling attenuation (a ), see test procedures in IEC 62153-4-7 or IEC 62153-4-12.
C
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60050-581, International Electrotechnical Vocabulary (IEV) – Part 581: Electromechanical
components for electronic equipment
IEC 60512-1, Connectors for electronic equipment – Tests and measurements – Part 1:
General
IEC 60512-26-100, Connectors for electronic equipment – Tests and measurements –
Part 26-100: Measurement setup, test and reference arrangement and measurements for
connectors according to IEC 60603-7 – Tests 26a to 26g
IEC 60512-27-100, Connectors for electronic equipment – Tests and measurements –
Part 27-100: Signal integrity tests up to 500 MHz on 60603-7 series connectors – Tests 27a to
27g
IEC 60512-28-100, Connectors for electronic equipment – Tests and measurements – Part
28-100: Signal integrity tests up to 2 000 MHz on IEC 60603-7 and IEC 61076-3 series
connectors – Tests 28a to 28g
IEC 60603-7, Connectors for electronic equipment – Part 7: Detail specification for 8-way,
unshielded, free and fixed connectors
IEC 60603-7-1, Connectors for electronic equipment – Part 7-1: Detail specification for 8-way,
shielded, free and fixed connectors
IEC 60603-7-2, Connectors for electronic equipment – Part 7-2: Detail specification for 8-way,
unshielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz
IEC 60603-7-3, Connectors for electronic equipment – Part 7-3: Detail specification for 8-way,
shielded, free and fixed connectors, for data transmission with frequencies up to 100 MHz
IEC 60603-7-4, Connectors for electronic equipment – Part 7-4: Detail specification for 8-way,
unshielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz
IEC 60603-7-5, Connectors for electronic equipment – Part 7-5: Detail specification for 8-way,
shielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz
IEC 60603-7-41, Connectors for electronic equipment – Part 7-41: Detail specification for
8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to
500 MHz
IEC 60603-7-51, Connectors for electronic equipment – Part 7-51: Detail specification for
8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to
500 MHz
IEC 60603-7-81, Connectors for electronic equipment – Part 7-81: Detail specification for
8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to
2 000 MHz
IEC 61156-1, Multicore and symmetrical pair/quad cables for digital communications – Part 1:
Generic specification
IEC 61156-9, Multicore and symmetrical pair/quad cables for digital communications – Part 9:
Cables for channels with transmission characteristics up to 2 GHz – Sectional specification
IEC 61156-10, Multicore and symmetrical pair/quad cables for digital communications –
Part 10: Cables for cords with transmission characteristics up to 2 GHz – Sectional
specification
IEC 61169-16, Radio-frequency connectors – Part 16: Sectional specification – RF coaxial
connectors with inner diameter of outer conductor 7 mm (0,276 in) with screw coupling –
Characteristics impedance 50 ohms (75 ohms) (type N)
IEC 61935-1, Specification for the testing of balanced and coaxial information technology
cabling – Part 1: Installed balanced cabling as specified in ISO/IEC 11801 and related
standards
IEC 61935-2, Specification for the testing of balanced and coaxial information technology
cabling – Part 2: Cords as specified in ISO/IEC 11801 and related standards
ISO/IEC 11801-1, Information technology – Generic cabling for customer premises – Part 1:
General requirements
– 12 – IEC PAS 60512-27-200:2018 © IEC 2018
ITU-T Recommendation G.117, Transmission aspects of unbalance about earth
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-581,
IEC 60512-1 and IEC 60603-7 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Overall test arrangement
4.1 General
This document specifies test methods and procedures for connectors.
The test fixtures and reference connectors specified in this document are referenced by
IEC 60512-28-100.
The test methods and procedures for signal integrity and transmission performance, specified
in IEC 60512-28-100, covering the frequency range up to 2 000 MHz, are referenced by
connector standards, specified in IEC 60603-7 and IEC 60603-7-1, with signal integrity
specifications up to 2 000 MHz; e.g., IEC 60603-7-81.
This document extends the frequency range, up to 2 000 MHz, for IEC 60512-27-100, which
has a frequency range up to 500 MHz.
The test methods and procedures for signal integrity and transmission performance specified
herein are for connectors using de-embedded crosstalk specifications and measurements up
to 2 000 MHz; e.g. IEC 60603-7-81.
The test methods and procedures specified herein are referenced by connector standards for
connecting hardware normally used with twisted-pair cables having 100 Ω nominal differential
characteristic impedance, which are specified up to 2 000 MHz, in accordance with
IEC 61156-1 cable standard and
...