IEC 62150-6:2022

IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Test and measurement
procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic
devices
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IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Test and measurement

procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic

devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-1074-9

– 2 – IEC 62150-6:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Mezzanine board requirements . 7
4.1 Functional description . 7
4.2 Critical dimensions . 9
4.3 Daughtercard and extended system . 11
4.4 Power and signal flows . 15
Annex A (informative)  International collaborative research and development . 18
A.1 Overview. 18
A.2 European FP7 PhoxTroT project . 19
A.3 European H2020 Nephele project . 19
A.4 European H2020 COSMICC project . 19
A.5 Benefit of universal test board. 20
Bibliography . 21

Figure 1 – Outlines of mezzanine test boards . 7
Figure 2 – Attachment of PDS onto M2 board . 8
Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 9
Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 10
Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power
and low speed signal connectors on bottom surfaces and mezzanine board origin . 10
Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard
with electrical edge connectors and cut-outs to accommodate optical backplane
connectors . 12
Figure 7 – Attachment of M2 boards onto daughtercard . 13
Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards
attached. 14
Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards
attached. 14
Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards
and one M2 board attached . 15
Figure 11 – Functional diagram showing power and low speed signal distribution
between PDS, M1/M2, daughtercard and backplane . 16
Figure 12 – Multiple daughtercards populated with M1/M2 and PDS in multiple slots
on a system backplane . 17
Figure A.1 – Example of cross-project deployment of mezzanine test card [3] . 18
Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project. 20

Table 1 – Critical relative dimensions . 11
Table 2 – Voltages and low-power signal designations . 16

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices

FOREWORD
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IEC 62150-6 has been prepared by subcommittee SC 86C: Fibre optic systems and active
devices of IEC technical committee 86: Fibre optics. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
86C/1721/CDV 86C/1752/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 62150-6:2022 © IEC 2022
A list of all parts in the IEC 62150 series, published under the general title Fibre optic active
components and devices – Test and measurement procedures, can be found on the IEC
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INTRODUCTION
This document defines a generic electro-optic mezzanine board for the test and measurement
of micro-optical and micro-photonic devices, including a wide diversity of photonic integrated
circuit (PIC) technologies including, but not limited to, transceivers, switches, sensors,
neuromorphic networks, LiDAR and quantum integrated circuits. The board size and shape
would allow two mezzanine boards to be mounted, side-by-side, on a larger Eurocard form
factor daughtercard, which itself can be docked into and powered from a backplane system.
Alternatively, each mezzanine board can be operated alone, for example on a lab bench
powered from a bench supply.
The purpose of this generic mezzanine board concept is to allow like-for-like comparative
characterisation of devices under test (DUTs) with respect to one another and to measure the
performance of DUTs within larger test environments, relevant to their targeted application,
such as data centre systems, high performance computers, automotive or 5G cabinets. The
mezzanine board PCB will be designed to accommodate very high-speed electronic signals and
a high-speed electronic signal interface to allow external test equipment such as test pattern
generators, bit error rate testers and communication signal analysers to drive the device under
test
...