IEC TR 62014-3:2002

TECHNICAL IEC
REPORT
TR 62014-3
First edition
2002-12
Electronic design automation libraries –
Part 3:
Models of integrated circuits
for EMI behavioural simulation
Reference number
IEC/TR 62014-3:2002(E)
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TECHNICAL IEC
REPORT
TR 62014-3
First edition
2002-12
Electronic design automation libraries –
Part 3:
Models of integrated circuits
for EMI behavioural simulation
 IEC 2002  Copyright - all rights reserved
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– 2 – TR 62014-3  IEC:2002(E)
CONTENTS
FOREWORD . 3
1 Scope . 5
1.1 General . 5
1.2 Philosophy. 6
2 Normative references. 7
3 Definitions . 7
4 ICEM models description . 8
4.1 ICEM power-supply line model. 8
4.2 ICEM Input/output. 9
4.3 ICEM direct radiation .10
5 ICEM models parts details .11
5.1 Passive parts parameters .11
5.2 The current sources I and I .12
b i/o
Annex A Simulation tools implementation.14
Figure 1 – Mechanisms for parasitic emission covered by ICEM. 5
Figure 2 – The basic mechanism for parasitic emission is due to the current driving
by all the gates. 6
Figure 3 – Number of switching gates versus time. 6
Figure 4 – Model of the IC supply lines . 8
Figure 5 – Origin of primary and secondary resonance in the IC model . 9
Figure 6 – Comparison between simulation and measurements (IEC 61967-4, 1 Ω method) . 9
Figure 7 – Coupling between core and I/Os.10
Figure 8 – Coupling between core and I/Os in the case of separate supplies.10
Figure 9 – IC direct emissions measured in TEM cell .11
Figure 10 – Current source definition as a PWL description versus time.13
Table 1 – Value range of the model parameters .12

TR 62014-3 © IEC:2002(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
__________
ELECTRONIC DESIGN AUTOMATION LIBRARIES –
Part 3: Models of integrated circuits
for EMI behavioural simulation
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
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2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
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Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
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5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this technical report may be the subject of
patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However,
a technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard,
for example “state of the art”.
IEC 62014-3, which is a technical report, has been prepared by IEC technical committee 93:
Design automation.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
93/146/DTR 93/157/RVC
Full information on the voting for the approval of this technical report can be found in the
report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – TR 62014-3  IEC:2002(E)
The committee has decided that the contents of this publication will remain unchanged until
2005. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
TR 62014-3 © IEC:2002(E) – 5 –
ELECTRONIC DESIGN AUTOMATION LIBRARIES –
Part 3: Models of integrated circuits
for EMI behavioural simulation
1 Scope
The objective of this Technical Report (TR) ICEM (Integrated Circuit Electrical Model) for
Components is to propose electrical modelling for integrated circuit internal activities. This
model will be used to evaluate electromagnetic behaviour and performances of electronic
equipment.
1.1 General
Integrated circuits integrate more and more gates on silicon and the technologies are faster
and faster. To predict the electromagnetic behaviour of equipment, it is required to model IC
interface switching and their internal activities as well. Indeed IBIS and IMIC models are
focused mainly on interface activity predictions (cross-talk, overshoot, etc.). See IEC 62014-1.
This report describes a model for EMI simulation due to IC internal activities. This model gives
more accurately the electromagnetic emissions of electronic equipment by taking into account
the influence of internal activities. This model gives general data which could be implemented
in different format such as IBIS, IMIC, SPICE, etc.
During the design stage of the application that will exploit the IC, it becomes useful to predict
and to prevent electromagnetic risks with the CAD tool. Accurate IC modelling is necessary
to run on these simulation tools.
Three coupling mechanisms of the internal activities for emission (Figure 1) are proposed
in the ICEM model:
! conducted emissions through supply lines;
! conducted emissions through input/output lines;
! direct radiated emissions.
Internal
activities
noise
Coupling by power Direct
lines alimentations radiation
Coupling by
input/output
IEC  3027/02
Figure 1 – Mechanisms for parasitic emission covered by ICEM

– 6 – TR 62014-3  IEC:2002(E)
This report proposes a model that addresses those three types of coupling in a single
approach. The elements of the model would be kept as simple as possible to ease the
identification and simulation process.
1.2 Philosophy
The purpose of this report is to provide data to enable printed-circuit-board level (PCB)
electromagnetic tools to compute the electromagnetic fields produced by integrated circuits
and their associated PCB. These data can be extracted from measurement methods, as
described in IEC 61967, or obtained from IC simulation tools.
1.2.1 Origin of parasitic emission
The origin of parasitic emission in IC is due to the current flowing through all the IC gates (Iv
and Iv ) during high to low or low to high transitions as shown in Figure 2.

IV
dd
IC
IV 1 IV N
dd dd
Gate 1 Gate N
N gates
IV 1 N
ss IV
ss
IV
ss
IEC  3028/02
Figure 2 – The basic mechanism for parasitic emission is due
to the current driving by all the gates
The combination of several hundred thousands of gates lead to very important peaks of
current, mainly at rise and fall edges of the clock circuit. For example Figure 3 plots the
number of gates switching versus the time for an IC integrating 1 000 000 transistors.
Consequently, high current spikes are created inside the die and induce voltage drops of
the internal voltage references.
1 200
1 000
0 20 40 60 80 100 120 140
Time  ns
IEC  3029/02
Figure 3 – Number of switching gates versus time
Number of simultaneous
switching gates
TR 62014-3 © IEC:2002(E) – 7 –
1.2.2 Conducted emission through power-supply lines
The current spikes created inside the die are partially reduced thanks to the on-chip
decoupling capacitance. Anyhow, a significant portion of the current spikes is present at the
power-supply pins of the chip. This current could be measured according to IEC 61967 or
other methods permitting to have the power-supply currents.
1.2.3 Conducted emissions through input/output lines (I/O)
The internal voltage drops generated by the current spikes create noise on the I/Os through
direct connection, parasitic capacitive and inductive couplings and/or through common
impedance. The PCB wires connected to the I/O can act as antennas and propagate
electromagnetic emissions. The measurement set-up is done according to IEC 61967.
1.2.4 Direct radiated emissions
The internal current flowing in low impedance loops generates electromagnetic fields which
can be measured in near field according to IEC 61967.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 KHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz – Part 4: Measurement of conducted emissions, 1 Ω /150 Ω direct coupling method
IEC 61967-6, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method
IEC 62014-1, Electronic design automation libraries – Part 1: Input/output buffer information
specifications (IBIS version 3.2)
...