IEC 62037-1:2012

IEC 62037-1 ®
Edition 1.0 2012-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Passive RF and microwave devices, intermodulation level measurement –
Part 1: General requirements and measuring methods

Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –
Partie 1: Exigences générales et méthodes de mesure

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IEC 62037-1 ®
Edition 1.0 2012-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Passive RF and microwave devices, intermodulation level measurement –

Part 1: General requirements and measuring methods

Dispositifs RF et à micro-ondes passifs, mesure du niveau d’intermodulation –

Partie 1: Exigences générales et méthodes de mesure

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX Q
ICS 33.040.20 ISBN 978-2-8322-1350-6

– 2 – 62037-1  IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references. 5
3 Abbreviations . 5
4 Characteristics of intermodulation products . 5
5 Principle of test procedure . 6
6 Test set-up . 6
6.1 General . 6
6.2 Test equipment . 6
6.2.1 General . 6
6.2.2 Set-up 1 . 7
6.2.3 Set-up 2 . 8
7 Preparation of DUT and test equipment . 8
7.1 General . 8
7.2 Guidelines for minimizing generation of passive intermodulation. 8
8 Test procedure . 10
9 Reporting . 10
9.1 Results . 10
9.2 Example of results . 10
10 Measurement error . 11
Annex A (informative) Configuration of low-PIM termination . 15
Annex B (informative) Test procedure considerations . 17

Figure 1 – Set-up 1; reverse IM-test set-up . 12
Figure 2 – Set-up 2; forward IM-test set-up . 13
Figure 3 – Passive intermodulation (PIM) measurement error caused by residual system
error . 14
Figure A.1 – Long cable termination . 15
Figure A.2 – Lumped termination with a linear attenuator . 16

Table 1 – Guide for the design, selection of materials and handling of components that
may be susceptive to PIM generation . 9
Table 2 – Test set-up conditions . 10

62037-1  IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –

Part 1: General requirements and measuring methods

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62037-1 has been prepared by technical committee 46: Cables,
wires, waveguides, R.F. connectors, R.F. and microwave passive components and
accessories.
This bilingual version (2014-01) corresponds to the monolingual English version, published in
2012-05.
This first edition of IEC 62037-1 replaces IEC 62037, published in 1999. It constitutes a
technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
46/402/FDIS 46/416/RVD
– 4 – 62037-1  IEC:2012
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62037 series, published under the general title Passive RF and
microwave devices intermodulation level measurement, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

62037-1  IEC:2012 – 5 –
PASSIVE RF AND MICROWAVE DEVICES,
INTERMODULATION LEVEL MEASUREMENT –

Part 1: General requirements and measuring methods

1 Scope
This part of IEC 62037 deals with the general requirements and measuring methods for
intermodulation (IM) level measurement of passive RF and microwave components, which can
be caused by the presence of two or more transmitting signals.
The test procedures given in this standard give the general requirements and measurement
methods required to characterize the level of unwanted IM signals using two transmitting
signals.
The standards in this series address the measurement of PIM, but do not cover the long term
reliability of a product with reference to its performance.
This standard is to be used in conjunction with other appropriate part(s) of IEC 62037.
2 Normative references
None.
3 Abbreviations
CATV Community antenna television
DUT Device under test
IM Intermodulation
PIM Passive intermodulation
4 Characteristics of intermodulation products
PIM interference is caused by sources of non-linearity of mostly unknown nature, location and
behaviour. A few examples are inter-metallic contacts, choice of materials, corrosion products,
dirt, etc. Most of these effects are subject to changes over time due to mechanical stress,
temperature changes, variations in material characteristics (cold flow, etc.) and climatic
changes, etc.
The generation of intermodulation products originates from point-sources inside a DUT and
propagate equally in all available directions.
The generation of passive intermodulation products (PIM) does not necessarily follow the law
of the usual non-linear equation of quadratic form. Therefore, accurate calculation to other
power levels causing the intermodulation is not possible and PIM comparisons should be made
at the same power level.
Furthermore, PIM generation can be frequency-dependent. When PIM generation is frequency-
dependant, the PIM performance shall be investigated over the specified frequency band.

– 6 – 62037-1  IEC:2012
5 Principle of test procedure
Test signals of frequencies f and f with equal specified test port power levels are combined

1 2
and fed to the DUT. The test signals should contain at least 10 dB less harmonic or self-
intermodulation signal level than the expected level generated in the DUT.
The PIM is measured over the specified frequency range. The intermodulation products of
order (2f ± f ), (2f ± f ) etc. are measured.

1 2 2 1
In most cases, the third order intermodulation signals represent the worst case condition of
unwanted signals generated; therefore, the measurement of these signals characterizes the
DUT in a sufficient way. However, the test set-ups given in Clause 6 are suitable for measuring
other intermodulation products.
rd
In other systems (such as CATV), the 3 order may not be as applicable in characterizing the
DUT.
Intermodulation can be measured in reverse and forward direction. Reverse and forward is
referred to the direction of propagation of the most powerful carrier.
6 Test set-up
6.1 General
Experience shows that the generation of intermodulation products originates from point-
sources inside a device under test (DUT) and propagates equally in all available directions.
Therefore, either the reverse (reflected) or the forward (transmitted) intermodulation signal can
be measured.
Two different test set-ups are described in Figure 1 and Figure 2 and are for reference only.
Other topologies are possible.
Set-up 1 is for measuring the reverse (reflected) intermodulation signal only, and set-up 2 is for
measuring the forward (transmitted) intermodulation signal. The measurement method (reverse
or forward) is dependent upon the DUT. The set-ups may be assembled from standard
microwave or radio link hardware selected for this particular application. All components shall
be checked for lowest self-intermodulation generation.
Experience shows that devices containing magnetic materials (circulators, isolators, etc.) can
be prominent sources of intermodulation signal generation.
See Annex B for additional set-up considerations.
6.2 Test equipment
6.2.1 General
Two signal sources or signal generators with power amplifiers are required to reach the
specified test port power. The combining and diplexing device may comprise a circulator,
hybrid junction, coupler or filter network.
The test set-up self-intermodulation generated (including contribution of the load) should be at
least 10 dB below the level to be measured on the DUT. The associated error may be obtained
from the graph in Figure 3.
62037-1  IEC:2012 – 7 –
The DUT shall be terminated by a load for the specified power if necessary. The receiving
bandpass filter, tuned for the desired intermodulation signal, is followed by a low noise
amplifier (if required) and a receiver.
See Annex B for additional set-up considerations.
6.2.2 Set-up 1
This set-up is to measure the reverse (reflected) IM-product and is therefore suitable for 1-port
and multi-port DUTs. On multi-port DUTs, the unused ports shall be connected to a linear
termination.
a) Generators
The generators shall provide continuous wave (CW) signals of the specified test port
power. They shall have sufficient frequency stability to make sure that the IM-product can
be detected properly by the receiver.
b) Transmit-filters
The filters are bandpass-filters tuned to the particular frequencies. They isolate the
generators from each other and filter out the harmonics of f and f .

1 2
c) Combining and diplexing device
This device is used for combining the signals f and f , delivering them to the test port and

1 2
provides a port for the extraction of the reverse (reflected) signal f .
IM
d) Receive-filter
This filter is used for isolating the input of the receiver from the signals f and f to the

1 2
extent that IM-products are not generated within the receiver.
e) Test port
The DUT is connected to P4. The specified input power shall be at the DUT, with any set-up
loss between the receiver and the DUT compensated for.
f) Termination
When a multi-port DUT is measured, the DUT shall be connected to a sufficiently linear
termination (low intermodulation) of suitable power handling capability.
g) Receiver
The receiver shall be sensitive enough to detect a signal of the expected power level.
The receiver response time shall be sufficiently short to allow acquisition of rapid changes
in amplitude. Sensitivity can be increased by a low noise preamplifier. Frequency stability
shall be sufficient for the proper detection of the IM-signal.
When the PIM measurement result is close to the thermal noise floor of the receiver, the
receiver sensitivity can be improved by reducing the resolution bandwidth (RBW).
Furthermore, by using the averaging mode rather than the max-hold mode, a further
improvement can be achieved, since the max-hold mode essentially measures the
maximum thermal noise peak, while the averaging mode results in a measurement that is
closer to the r.m.s. value.
– 8 – 62037-1  IEC:2012
6.2.3 Set-up 2
This set-up is to measure the forward (transmitted) IM-product and is therefore suitable only for
two- or multi-port DUTs.
All components are the same as those of set-up 1, except for those as noted below:
a) Combining and diplexing device
The extraction-port P3 on this device shall be terminated to prevent reflection of the IM-
signals.
b) Diplexing device
The signals f , f and f are split to P6 and P7. This device, together with an additional
1 2 IM
receive-filter, is used for the extraction of the intermodulation signals.
7 Preparation of DUT and test equipment
7.1 General
The DUT and test equipment shall be carefully checked for proper power handling range,
frequency range, cleanliness and correct interconnection dimensions. All connector interfaces
shall be tightened to the applicable IEC specification or, if none exists, to the manufacturer’s
recommended specification.
See Annex B for additional set-up considerations.
7.2 Guidelines for minimizing generation of passive intermodulation
The following guidelines and Table 1 should be considered and adhered to wherever possible.
a) Non-linear materials should not be used in or near the current paths.
b) Current densities should be minimized in the conduction paths (e.g. Tx channel), by using
larger conductors.
c) Minimize metallic junctions, avoid loose contacts and rotating joints.
d) Minimize the exposure of loose contacts, rough surfaces and sharp edges to RF power.
e) Keep thermal variations to a minimum, as the expansion and contraction of metals can
create non-linear contacts.
f) Use brazed, soldered or welded joints if possible – but ensure these joints are good and
have no non-linear materials, cracks, contamination or corrosion.
g) Avoid having tuning screws or moving parts in the high current paths – if necessary, then
ensure all joints are tight and clean, and preferably, free from vibration.
h) Cable lengths in general should be minimized and the use of high quality, low-IM cable is
essential.
i) Minimize the use of non-linear components such as high-PIM loads, circulators, isolators
and semiconductor devices.
j) Achieve good isolation between the high-power transmit signals and the low-power receive
signals by filtering and physical separation.

62037-1  IEC:2012 – 9 –
Table 1 – Guide for the design, selection of materials and handling
of components that may be susceptive to PIM generation
Part, material or procedure Recommendations
Interfaces Minimize the total number.
Connectors Minimize the number of connectors used. Use high quality, low-PIM
connectors mated with proper torque.
Inter-metallic connections Each inter-metallic connection should be evaluated in terms of
criticality for the total PIM level. Methods of controlling the
performance are high contact pressure, insulation, soldering,
brazing, etc.
Ferromagnetic materials Not recommended (non-linear).
Non-magnetic stainless steel Not recommended (contains iron).
Circulators, isolators and other ferrite Not recommended.
devices
Sharp edges Avoid if it results in high current density.
Terminations or attenuators Should be evaluated before use.
Hermetic seals / gaskets Evaluate before use and avoid ferromagnetic materials.
Printed circuit boards (PCB) Materials, processes and design should all be considered and
evaluated. Use low-PIM materials; be careful with material
impurities, contamination and etching residuals. The copper trace
should be finished to prevent corrosion.
Dissimilar metals Not recommended (risk of galvanic corrosion).
Dielectric material Use clean, high quality material. Ensure it does not contain
electrically conductive particles.
Machined dielectric materials Use clean non-contaminated tools for machining.
Welded, soldered or brazed joint Well executed and thoroughly cleaned, they provide satisfactory
results. Shall be carefully inspected.
Carbon fibre epoxy composite (CFEC) Generally acceptable for use in reflector and support structures,
provided the fibres are not damaged. Should be evaluated if high
flux density (e.g. >10 mW/cm is expected.
Standard multilayer thermal blankets Special design required.
made of Vacuum Deposited Aluminium
(VDA) on biaxially-oriented polyethylene
terephthalate film or Polyimide film
Cleanliness Maintain clean and dry surfaces.
Plating The thickness of the plating should be at least three times greater
than the skin depth of the wave resulting from the skin effect at the
lowest relevant frequency.
– 10 – 62037-1  IEC:2012
8 Test procedure
Table 2 gives certain conditions for test set-up 1 and test set-up 2.
Table 2 – Test set-up conditions
Test set-up 1 Test set-up 2
The set-up shall be verified for correct signal levels applied to the DUT. For mobile communication
systems, it is generally recommended to use 2 × 20 W (43 dBm) at the test port of the DUT, unless
otherwise specified. Other systems may require different power levels.
The minimum number of test frequencies and/or frequency spacing shall be specified.
For lowest measurement uncertainty, the receiver shall be calibrated at the expected IM-level with a
calibrated signal-source as indicated in Figure 1 and Figure 2.
The termination shall be connected directly to the P5 of diplexing device shall be connected directly to
test port P4 and the self-intermodulation level of P4 of combining and summing device and the self-
the set-up recorded. intermodulation level of the set-up recorded.
For low measurement uncertainties, the level of self-intermodulation should be at least 10 dB below the
specified value for the DUT.
Test the DUT as given in the specific set-up and procedure in the appropriate test set-up.
An additional mechanical shock test may be carried out during the test sequence.
9 Reporting
9.1 Results
The input power at individual frequencies should be specified.
The values of f and f should be specified.
1 2
The PIM level and frequency should be specified.
9.2 Example of results
The result is expressed as an absolute magnitude in dBm or relative magnitude in dBc,
referenced to the power of a single carrier.
The relationship between a measured IM -value of –120 dBm can be converted to dBc as
follows:
EXAMPLE:
f = 936 MHz, f = 958 MHz, f = 914 MHz
IM
1 2 3
) = P(f ) = 20 W (+43 dBm)
P(f
1 2
IM = –163 dBc (–120 dBm)
62037-1  IEC:2012 – 11 –
10 Measurement error
The measurement uncertainty can be calculated by the following formula:
2 2 2 2
RSS = [(δA) + (δPm) + (δPg) + (δD) ]
where
δA is the uncertainty of attenuator;
δPm is the uncertainty of power meter;
δPg is the uncertainty of generator 3;
δD is the uncertainty due to the difference between self-intermodulation of the test bench
and intermodulation of the DUT (taken from Figure 3).
Mismatch errors are not included in the given formula.

– 12 –               62037-1  IEC:2012

Combining and Diplexing device
Transmit filter
Generator 1/2
P1
f
Termination
P4
n-port DUT
P2
f
P3
1-port DUT
Receive filter
Power meter
Attenuator
Generator 3
Receiver
f
IM
For calibration only
IEC  948/12
Figure 1 – Set-up 1; reverse IM-test set-up

62037-1  IEC:2012          – 13 –

Combining and diplexing device device 1 Diplexing device
Transmit filter
Generator 1/2
P1
f
Termination
P4 n-port DUT
P5 P7
P2
f
P3
P6
Receive filter
Receive filter
Attenuator
Termination
Power meter
Receiver
Generator 3
f
IM
f
IM
For calibration only
IEC  949/12
Figure 2 – Set-up 2; forward IM-test set-up

– 14 –               62037-1  IEC:2012
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
(T(Trruuee PI PMIM) ) - (S– (Sysytsetem PIm PMI)  (M) ddB)B
Measurement error (dB) when PIMs add Measurement error (dB) when PIMs subtract Zero error line
IEC  950/12
Figure 3 – Passive intermodulation (PIM) measurement error caused by residual system error

Error  (dB)
Error (dB)
62037-1  IEC:2012 – 15 –
Annex A
(informative)
Configuration of low-PIM termination

A.1 General
This annex provides information on low-PIM terminations.
A.2 Configuration of low-PIM terminations
A.2.1 Long cable termination
High-PIM terminations may often consist of resistive materials. Therefore, long coaxial cables
are used as a low-PIM termination (see Figure A.1). The following guidelines are in no
particular order of significance, but should be considered and adhered to wherever possible.
a) Avoid braided cables. Cables with a single centre conductor should be used. Semi-rigid
cables would be a good choice from the practical viewpoint.
b) Avoid using cables with high-PIM materials and high-PIM plating. Plating with silver and
tin would be a good choice. Plating should be sufficiently thicker than the skin depth at
the lowest fundamental frequency.
c) A seamless cable configuration is the best for terminations because minimizing cable-
connection is essential to achieve low-PIM. When the termination is composed of
several short cables, the longest one should be used at the nearest side to the DUT.
d) Choose the cable with sufficient power-handling capability.
e) Choose the cable length sufficient for power absorption at the lowest fundamental
frequency considering the isolation performance between the receive signals and
transmit signals.
f) Use a connector with low-PIM characteristics.

Connector Linear attenuator
ex: long semirigid cable
IEC  951/12
Figure A.1 – Long cable termination
A.2.2 Lumped termination with a linear attenuator
Low-PIM cable can be considered as a linear attenuator. The combination of the linear
attenuator and a high-PIM lumped load as shown in Figure A.2 may be used as a low-PIM
termination. The following procedure is presented for designing a low-PIM termination.
1) Measure the PIM characteristics of the lumped termination as a function of the
fundamental power, and determine the PIM-increase ratio X[dB].
2) Determine the required attenuation of the linear attenuator X [dB] using the formula:
c
PIM =PIM −( X+1)X
term RDL c
– 16 – 62037-1  IEC:2012
3) Design the required length of the cable for the linear attenuator using the following
formula:
X =α×l
c m
where
PIM is the PIM of the lumped termination for P , in dBm;

RDL in
PIM is the PIM level required for the low-PIM termination in dBm;
term
X      is the PIM increase against the 1 dB-increase of each input tone, in dB;
X is the attenuation of the linear attenuator, in dB;
c
α      is the attenuation ratio of the cable, in dB/m;
l      is the cable length, in m.
m
Connector Linear attenuator
Lumped
termination
IEC  952/12
Figure A.2 – Lumped termination with a linear attenuator

62037-1  IEC:2012 – 17 –
Annex B
(informative)
Test procedure considerations
B.1 General
Due to the phase interaction of the connectors and the length of the transmission line when
measured in the reverse (reflected) mode, the frequency at which maximum PIM occurs within
the band can vary and shall be determined.
B.2 Stepped frequency sweep
An accepted method of sweeping is to fix F1 at the low end of the transmit band and step F2
down, starting at the top of the band for all combination of frequencies that result in IM in the
receive band. If desired, this procedure can be reversed by fixing F1 at the highest frequency
in the transmit band and then stepping F2 up, starting at the bottom of the band.
B.3 Fixed frequency
Assemblies of varying lengths shall be made to ensure that the PIM adds in-phase. Assemble 2
λ/6 longer and the second one is to be λ/3 longer at the
additional DUTs. The first one is to be
receive frequency of test. The PIM of the three assemblies is measured to determine which
DUT exhibits maximum PIM. The impact test is to be performed on this DUT.
Multiple fixed frequency may be used in lieu of varying the cable length.

___________
– 18 – 62037-1 © CEI:2012
SOMMAIRE
AVANT-PROPOS . 19
1 Domaine d’application . 21
2 Références normatives . 21
3 Abréviations . 21
4 Caractéristiques des produits d'intermodulation . 21
5 Principe de procédure d'essai . 22
6 Montage d'essai . 22
6.1 Généralités . 22
6.2 Matériel d'essai . 22
6.2.1 Généralités . 22
6.2.2 Montage 1 . 23
6.2.3 Montage 2 . 24
7 Préparation du DUT et du matériel d’essai . 24
7.1 Généralités . 24
7.2 Lignes directrices pour la réduction de la création d'intermodulation
passive . 24
8 Procédure d'essai . 25
9 Rapport . 26
9.1 Résultats . 26
9.2 Exemple de résultats . 26
10 Erreur de mesure . 26
Annexe A (informative) Configuration d’une terminaison d’intermodulation passive
faible . 31
Annexe B (informative) Considérations relatives à la procédure d'essai . 33

Figure 1 – Montage 1: montage d’essai de l’intermodulation inverse . 28
Figure 2 – Montage 2: montage d’essai de l’intermodulation directe . 29
Figure 3 – Erreur de mesure de l'intermodulation passive (PIM) provoquée par une
erreur du système résiduel . 30
Figure A.1 – Terminaison de câble long . 31
Figure A.2 – Terminaison localisée avec un affaiblisseur linéaire . 32

Tableau 1 – Guide pour la conception, la sélection de matériaux et la manipulation de
composants pouvant être susceptibles de créer une intermodulation passive . 25
Tableau 2 – Conditions pour les montages d’essai . 26

62037-1 © CEI:2012 – 19 –
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS RF ET À MICRO-ONDES PASSIFS,
MESURE DU NIVEAU D’INTERMODULATION –

Partie 1: Exigences générales et méthodes de mesure

AVANT-PROPOS
1) La Commission Electrotechnique Internationale (CEI) est une organisation mondiale de normalisation composée
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La Norme internationale CEI 62037-1 a été établie par le comité d’études 46 de la CEI: Câbles,
fils, guides d'ondes, connecteurs, composants passifs pour micro-onde et accessoires.
Cette première édition de la CEI 62037-1 remplace la CEI 62037 publiée en 1999. Elle
constitue une révision technique.

– 20 – 62037-1 © CEI:2012
La présente version bilingue (2014-01) correspond à la version anglaise monolingue publiée en
2012-05.
Le texte anglais de cette norme est issu des documents 46/402/FDIS et 46/416/RVD.
Le rapport de vote 46/416/RVD donne toute information sur le vote ayant abouti à l’approbation
de cette norme.
La version française de cette norme n’a pas été soumise au vote.
Cette publication a été rédigée selon les Directives ISO/CEI, Partie 2.
Une liste de toutes les parties de la série CEI 62037
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